An air guide device and an air guide method for realizing uniform distribution of air flow in a case

Abstract

The invention provides an air guide device and an air guide method for realizing uniform distribution of air flow in a case, which are used for solving the technical problem of guiding the direction of air flow in the case, so as to achieve the technical effect of good heat dissipation in the case. An air guide device for realizing uniform distribution of air flow in a case comprises an air guidepartition plate, wherein the air guide partition plate partitions the air flow in the case into upper and lower parts; a plurality of ribs are arranged at the lower end of the air guide partition plate, and the ribs partition the lower part of the air guide partition plate to form a CPU heat dissipation channel and a DIMM heat dissipation channel.

Description

technical field [0001] The invention relates to the technical field of heat dissipation and air guide devices, in particular to an air guide device and an air guide method for realizing uniform distribution of air flow in a chassis. Background technique [0002] In the era of cloud computing, the performance requirements for servers are getting higher and higher. In order to meet the computing, processing and storage needs of customers for explosive information, more and more functional components are integrated and carried in the server, and the chassis of the server is gradually becoming larger. The height of the traditional server chassis is gradually changing from 1U to 2U and 3U. Due to different functional positioning, some computing-type servers have multiple CPUs distributed front and back on the motherboard for high-speed computing and task processing. Solid-state drives, such as M.2 hard drives, are used to greatly increase data storage and read speed. These CPUs...

AI Technical Summary

Problems solved by technology

These CPUs, graphics cards, and hard disks are components with very large power consumption. The air volume caused by the heat dissipation solution in the prior art is generally scattered in a large chassis space.

The amount of air blowing directly to the motherboard area, especially to the rear CPU and M.2 hard disk and other components is relatively small, which often cannot meet the heat dissipation requirements of the CPU, DIMM, PCH, M.2 and other components on the motherboard, resulting in overheating Even the risk of burning out the motherboard and burning out important components cannot meet the heat dissipation requirements of some high-power graphics cards in the upper area of ​​the chassis, causing the graphics card to take protective measures such as automatic down-frequency operation or even stop operation, which will greatly affect the performance of the server It means that if the system adopts a fan with a larger air volume, it will not only increase power consumption and cost, but also cause a huge waste of resources.

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