Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

11results about How to "Address cooling needs" patented technology

Preparation process of high-thermal-conductivity composite substrate

The invention discloses a preparation process of a high-thermal-conductivity composite substrate, and the process comprises the steps: fixing a pre-prepared skeleton on an insulating base layer, and enabling branches of the skeleton and the surface of the insulating base layer to jointly define a plurality of heat dissipation spaces; dividing the plurality of heat dissipation spaces into at least one high heat dissipation space and at least one low heat dissipation space according to the layout and heating characteristics of a predetermined electronic component; a first heat-conducting filler is injected into the high-heat-dissipation space, a second heat-conducting filler is injected into the low-heat-dissipation space, curing treatment is conducted, the heat conductivity coefficient of the first heat-conducting filler is larger than that of the second heat-conducting filler, and the first heat-conducting filler and the second heat-conducting filler are combined with the framework to form a heat-conducting layer; a functional layer of the printed circuit board is fixed on the surface of the heat conduction layer, the area, corresponding to the high-heat-dissipation space, of the functional layer is used for installing high-heat-dissipation electronic elements, and the area, corresponding to the low-heat-dissipation space, of the functional layer is used for installing low-heat-dissipation electronic elements According to the technical scheme, different heat conduction measures can be adopted for different heating elements.
Owner:DONGGUAN HETONG ELECTRONICS CO LTD

Immersion liquid cooling device of net-forming type energy storage converter and use method

The invention discloses an immersion liquid cooling device of a net-forming type energy storage converter and a use method, and belongs to the technical field of high-voltage cascade energy storage, the device comprises a power module cooling unit, a first heat exchanger, a second heat exchanger and a liquid storage tank; cooling liquid is arranged in the power module cooling unit, the power module is soaked in the cooling liquid, and direct heat exchange of the power module is carried out. The power module cooling unit is connected with the first heat exchanger, the first heat exchanger is connected with one end of the liquid storage tank, the other end of the liquid storage tank is connected with the second heat exchanger, and cooling liquid flows into the second heat exchanger from the liquid storage tank for indirect heat exchange of electronic elements in the converter; and the second heat exchanger is connected with the power module cooling unit to form an immersion liquid cooling device. Through indirect heat exchange and direct heat exchange, the heat dissipation problem that heat consumption is increased due to short-time multi-time overload of the net-forming type energy storage converter is solved, and the problems that an existing converter is low in heat dissipation efficiency, complex in system, low in reliability and the like in cooling are solved.
Owner:BEIJING SIFANG JIBAO AUTOMATION

Spherical phased-array antenna efficient heat dissipation assembly and spherical phased-array antenna thereof

The spherical phased-array antenna efficient heat dissipation assembly comprises an upper-layer thermal control board, a bottom-layer thermal control board, a thermal control fan and the like, and the upper-layer thermal control board, a right side supporting arm, the bottom-layer thermal control board and a left side thermal control supporting arm are jointly spliced to form a heat dissipation air channel cavity; heat dissipation teeth in the air duct direction are designed on an upper-layer thermal control plate, a bottom-layer thermal control plate and a left-side thermal control supporting arm on the inner wall of an air duct cavity, and thermal control fans and fan dust covers are installed in front of and behind the cavity, so that the heat dissipation requirements of all modules installed on the upper-layer thermal control plate, the bottom-layer thermal control plate and the left-side thermal control supporting arm are efficiently met; the production cycle of the whole machine is greatly shortened, meanwhile, the production cost is reduced, sealing measures are designed at the mounting positions of the efficient heat dissipation assembly and the antenna housing and the base and at the splicing positions of the upper-layer thermal control board and the right side supporting arm, an air duct cavity is only communicated with the outside and completely isolated from internal devices of the product, and the adaptability of the product is improved.
Owner:XIAN AEROSPACE TIANHUI DATA TECH CO LTD

Combined cooling and power heat dissipation mechanism based on microfluid fuel cell

The invention belongs to the technical field of heat dissipation, and particularly relates to a combined cooling and power heat dissipation mechanism based on a microfluid fuel cell, which comprises a micro-channel arranged on a non-functional side of an external heat source, the micro-channel exchanges heat with the non-functional side of the external heat source, the micro-channel is used for being connected with an injection pump, the injection pump is used for conveying an electrolyte into the micro-channel, and the injection pump is used for injecting the electrolyte into the micro-channel. The electrolyte can exchange heat with the surface of the micro-channel; and the fuel cell assembly is located in the micro-channel, the internal space of the micro-channel is used for containing the fuel cell assembly, the fuel cell assembly is used for carrying out electrochemical reaction based on the electrolyte, and the power output end of the fuel cell assembly is used for being connected with the power end of electronic equipment. According to the invention, waste heat is utilized to enhance electrochemical reaction in the micro-channel, and meanwhile, the electrolyte is utilized to continuously remove heat, so that the energy efficiency and the cooling efficiency of the coupling system are improved at the same time.
Owner:HARBIN INSTITUTE OF TECHNOLOGY (SHENZHEN) (INSTITUTE OF SCIENCE AND TECHNOLOGY INNOVATION HARBIN INSTITUTE OF TECHNOLOGY SHENZHEN)

Composite heat dissipation module and electronic device

A composite heat dissipation module and an electronic device are suitable for heat dissipation of a heat source. The composite heat dissipation module comprises an air-cooled heat dissipation assembly and a liquid-cooled heat dissipation assembly. The air-cooled heat dissipation assembly comprises an airflow generator and a first heat dissipation fin. The airflow generator is provided with a first air outlet. The first heat dissipation fin is adjacent to the first air outlet of the airflow generator and is used for being thermally coupled to a heat source. The liquid-cooled heat dissipation assembly comprises a heat conduction flow pipe and a fluid driver. The heat conduction flow pipe is thermally coupled to the first heat dissipation fins and is used for accommodating a cooling fluid. The fluid driver is communicated with the heat conduction flow pipe to form a circulation flow channel, and is used for driving the cooling fluid to circulate in the circulation flow channel.
Owner:COOLER MASTER CO LTD

A single-component moisture-curing conductive and thermally conductive adhesive and its preparation process

This invention discloses a single-component moisture-curing conductive and thermally conductive adhesive and its preparation process, comprising the following raw materials in parts by weight: 100 parts SMP adhesive; 15-30 parts flake silver powder; 500-900 parts spherical silver-coated copper powder; 0-400 parts dendritic silver-coated copper powder; 10-20 parts decamethyltetrasiloxane; 1-1.5 parts β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate isooctyl ester; 7.5-10 parts N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane; and 1-1.5 parts vinyltrimethoxysilane. This invention allows the adhesive to cure at room temperature / low temperature using moisture in the air, eliminating the need for temperatures above 120°C. This completely avoids thermal stress damage to heat-sensitive substrates such as plastics, flexible circuit boards, and PET / PI films, making it perfectly suited for low-temperature processing scenarios such as flexible electronics manufacturing, wearable devices, and flexible sensors.
Owner:DONGGUAN HANPIN ELECTRONIC CO LTD

A discrete series low-distributed-capacitance liquid cooling heat dissipation device and method

The application discloses a kind of discrete series low distributed capacitance liquid cooling heat dissipation device and method, it belongs to electronic device heat dissipation technical field, heat dissipation device includes several heat dissipation units, the top of each heat dissipation unit is used to set power device, and two adjacent heat dissipation units are connected by cooling liquid pipeline;Each heat dissipation unit includes matrix and radiator, cooling liquid pipeline is through the inside of matrix, the top center of matrix is equipped with mounting hole, and mounting hole is equipped with radiator, and the lower half of radiator is inserted into the inside flow channel of cooling liquid pipeline, and the top of radiator is used to place power device.The application adopts discrete series heat dissipation unit structure, cooling liquid pipeline is through each unit matrix, and the lower half of radiator is inserted into the inside flow channel of pipeline, and each unit independently corresponds a power device.Solve the parasitic distributed capacitance problem caused by shared metal radiator, eliminate resonance loop, inhibit switching oscillation, reduce loss, ensure that heat dissipation is uniform and dynamic equalization, improve the stability and service life of high-voltage series module.
Owner:SHANGHAI CAIWIN SEMICONDUCTOR CO LTD

Air-cooling heat dissipation rotatable outboard interference device

The invention discloses an air-cooling heat dissipation rotatable outboard interference device which comprises an outboard case, an antenna housing, an orientation rotation combination, an interference source combination, a millimeter wave transmitter combination, a centimeter wave transmitter combination, a master control combination, a servo control combination, a secondary power supply, a waveguide combination and a fan. The outboard case is of a spliced structure. The interference source combination, the millimeter wave transmitter combination, the centimeter wave transmitter combination, the main control combination, the servo control combination and the secondary power supply are respectively arranged on six surfaces of the outboard case; a waveguide rotating joint is arranged at the rotating center of the azimuth rotating combination, the antenna combination is fixed on a rotating main shaft, and a motor directly drives a power gear to realize 360-degree azimuth rotation of the antenna combination; ventilation openings are formed in the diagonal positions of the bottom of the outboard case, a draught fan is installed at the ventilation opening in one end, and effective flowing of air in the whole case and air outside the whole case is achieved in cooperation with an interference source and an internal draught fan. The ship has the characteristics of low manufacturing difficulty, high space utilization rate, flexible ship loading scheme, convenience in maintenance, safe and reliable azimuth rotation, simple and efficient heat dissipation form and the like.
Owner:CHINA SHIPBUILDING IND CORP NO 723 RESEARCH INSTITUTE

Intelligent, safe and environment-friendly all-insulation looped network switch device

The invention discloses an intelligent, safe and environment-friendly all-insulation looped network switch device, and relates to the technical field of looped network switch cabinets. Comprising an outer box body, a fixed seat module arranged in the outer box body, a looped network switch cabinet installed in the outer box body through the fixed seat module, an intelligent detection module arranged in the looped network switch cabinet, and an inflation insulation module. A discharge sensor, a two-way wireless temperature measurement sensor and a controller are integrated, accurate monitoring of key parts of the looped network switch cabinet can be achieved, the temperature distribution state of equipment can be mastered in an omnibearing mode, after data of various sensors are summarized to the controller, a complete data chain of the operation state of the equipment can be formed, and early recognition of hidden faults is achieved; insulating gas can be filled into the instrument cavity, the bus cavity, the cable cavity and the intelligent control cavity through the pressure dividing header pipe, the pressurizing pipe and the porous gas spraying disc, and uniform distribution of the gas can be realized through the air vents of the partition plates, so that a global inflation insulating environment is formed in the switch cabinet, and the insulating strength of high-pressure parts can be greatly improved.
Owner:JIANGSU AOWEN ELECTRIC CO LTD

Automobile thermal management system and control method thereof

The invention provides an automobile thermal management system and a control method thereof, and belongs to the technical field of automobile thermal management. The automobile thermal management system comprises a sensor module, a control module and an execution module, the sensor module comprises a battery temperature sensor and an evaporator temperature sensor, and the execution module comprises a refrigerant stop valve and a compressor. After an automobile is powered on, the refrigerant stop valve is in a closed state, and the battery temperature sensor and the evaporator temperature sensor collect temperature information of a battery and temperature information of an evaporator respectively and input the temperature information to the control module. The control module sends a control instruction to the execution module according to the battery temperature, the evaporator temperature and the evaporator temperature when the refrigerant stop valve jumps, and controls opening or closing of the refrigerant stop valve and the power of the compressor to adjust the temperature of the battery and the cockpit. According to the invention, the comfort of a driver and passengers is improved, and the safety of the battery is protected.
Owner:ATECH AUTOMOTIVE WUHU

Multi-stage liquid separation and gravity type heat pipe integrated server liquid cooling system

The utility model discloses a multi-stage liquid separation and gravity type heat pipe integrated server liquid cooling system. Wherein a plurality of liquid cooling plates are provided, the plurality of liquid cooling plates are respectively, correspondingly and horizontally attached to a plurality of servers in the cabinet, and the horizontal heights of the plurality of liquid cooling plates are different; the number of the condenser is one, the arrangement position of the condenser is higher than that of the uppermost liquid cooling plate, and the air pipes and the liquid pipes are gravity type heat pipes and connected between the condenser and the multiple liquid cooling plates. The multi-stage liquid storage tank is arranged on the liquid pipe to form a multi-stage liquid separation system; and the plurality of liquid cooling plates, the air pipe, the condenser and the multi-stage liquid separation system form a refrigerant two-phase liquid cooling circulation system. The server heat dissipation system can efficiently and reliably carry out heat dissipation on the server with high heat dissipation density, ensures the safety of the server, and is low in power consumption at the same time.
Owner:TSINGHUA UNIVERSITY