Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

42results about How to "Address cooling needs" patented technology

Heat superconductive panel fin radiator with fins on surface thereof

ActiveCN107359146ABreak through the limit of heat dissipation capacity limitFlexible structureSemiconductor/solid-state device detailsSolid-state devicesAnti freezingWave form
The invention provides a heat superconductive panel fin radiator with fins on the surface thereof. The radiator herein includes: a radiator substrate; a plurality of heat superconductive heating panels which are parallelly disposed at intervals on the surface of the radiator substrate; each heat superconductive heating panel is provided with a heat superconductive pipeline which is formed therein, and the heat superconductive pipeline is a closed pipeline which is filled with a heat conductive working medium; a radiating fin structure which is disposed on at least one surface of each heat superconductive heating panel; the radiating fin structure includes at least one radiating fin which extends in wave form along the direction in parallel to the surface of the heat superconductive heating panel. According to the invention, the heat superconductive panel fin radiator herein has the characteristics of high fin efficiency, large heat exchange area per unit volume, strong radiating capability, small size, light weight, flexible and various appearance and structure, low cost and small radiator substrate. The heat superconductive panel fin radiator herein can deploy devices with large power, is suitable to lower temperature environment of alpine regions in winter, and addresses the anti-freezing problem of heat pipes and water-cooled radiators.
Owner:ZHEJIANG JIAXI TECH CO LTD

Immersed liquid cooling sintering porous capillary core coupling micro-channel heat dissipation device

The invention discloses an immersed liquid cooling sintering porous capillary core coupling micro-channel heat dissipation device. An exhaust micro-channel copper substrate comprises a square boss and a circular soaking table, the boss is located at the center position of the upper side of the soaking table, a *-shaped exhaust micro-channel is formed in the boss through linear cutting, and a boiling-evaporation sintering porous capillary core is in the shape of a prismatic table. The top of the boiling-evaporation sintering porous capillary core is provided with a porous capillary core conical groove, the bottom of the boiling-evaporation sintering porous capillary core and the top face of the polished exhaust micro-channel copper substrate are in contact with each other and are sintered into a whole, a heat conduction piece adheres to the bottom of the soaking table, and a chip heat source adheres to the bottom of the heat conduction piece. The chip heat source is embedded on a packaging substrate, and a heat insulation silica gel pad capable of nesting the heat conduction piece and the chip heat source between the soaking table and the packaging substrate is tightly attached to the packaging substrate. According to the immersed liquid cooling sintering porous capillary core coupling micro-channel heat dissipation device, the phase-change heat transfer capacity and the working stability of the device under medium-high heat flow can be remarkably improved.
Owner:XI AN JIAOTONG UNIV

Hierarchical manifold micro-channel heat dissipation device

The invention discloses a graded manifold micro-channel heat dissipation device. The graded manifold micro-channel heat dissipation device mainly comprises a first-stage micro-channel, a second-stage micro-channel, a third-stage micro-channel and a bottom plate part. The four layers of channels are packaged through the bonding technology, working medium inlets and working medium outlets are located in the top, and the number of the micro-channels and the number of the manifold channels can be increased according to the heat exchange area. A heat exchange working medium flows into the third-stage micro-channel through the first-stage micro-channel and the second-stage micro-channel, is split into the last eight inlets from the first two inlets and flows to the surface of the analog chip, and the temperature distribution uniformity of the surface of the analog chip is improved through uniform distribution of the working medium. And the working medium after heat exchange is converged into the first-stage micro-channels through the third-stage micro-channels and the second-stage micro-channels, and finally is converged to an outlet in the middle through the two first-stage micro-channels to flow out. The flow channel is segmented into a plurality of micro-channel units, the flow length is shortened, so that the pressure drop is reduced, a thermal boundary layer is difficult to develop in the micro-channel, and the heat exchange coefficient is increased and the total thermal resistance is reduced. The device has the advantages of being small in occupied area, low in power consumption and high in heat dissipation capacity, and can be used for meeting the heat dissipation requirement exceeding the heat flux density.
Owner:XI AN JIAOTONG UNIV

Array type multistage semiconductor refrigeration method for large-target-surface detector

An array type multistage semiconductor refrigeration device for a large-target-surface detector relates to the field of vacuum refrigeration packaging of photoelectric imaging detectors, solves the problems that an existing detector refrigerating device is complex in structure and large in size, further affects the refrigerating effect of the detector and the like, and comprises the large-target-surface detector, a cold plate, an array multistage semiconductor refrigerator and a heat sink, wherein the large-target-surface detector and the cold plate are bonded through high-thermal-conductivityepoxy resin glue, and the cold end of the array multistage semiconductor refrigerator and the cold plate are welded through low-temperature welding flux, and the hot end of the array multistage semiconductor refrigerator and the heat sink are welded through low-temperature welding flux. According to the invention, array type multistage semiconductor refrigeration adopts a thermoelectric refrigeration mode, and is free of noise, vibration and refrigerant; the multistage semiconductor can realize the requirement for large imaging temperature difference of the detector; the array type semiconductor can realize the requirement for large heat productivity of the detector; and the method can be well applied to the current large-target-surface (pixel 6K*6K) CMOS detector.
Owner:长春长光奥闰光电科技有限公司

Heat radiation protection device and spectrum therapy instrument

The invention provides a heat radiation protection device and a spectrum therapy instrument. The spectrum therapy instrument comprises a plurality of light sources and a heat radiation protection device. The heat radiation protection device comprises an area light source substrate, heat radiation bases, heat radiation fans, heat conduction pipes and heat radiation fins. The multiple heat radiationbases are arranged on the area light source substrate. Second installation parts are respectively arranged between adjacent heat radiation bases. The heat radiation fans are installed in the second installation parts respectively. The adjacent heat radiation bases are connected by the heat conduction pipes. The heat radiation fins are arranged on the pipe bodies of the heat conduction pipes to increase the heat radiation area. By integrating the heat radiation bases, the heat conduction pipes, heat conduction fluid, the heat radiation fins and the heat radiation fans and quickly transferringthe heat generated by the light sources to the heat radiation fin group through the heat conduction pipe network, multiple heat radiation and intelligent temperature control are realized. A fast and efficient heat radiation cycle system is formed, which is more efficient, intelligent and environment-friendly than air cooling. The heat radiation protection device is small, simple and easy to operate, can meet the requirement of light sources for long-time work and guarantee the working life of light sources, can radiate heat quickly, has high efficiency, and is convenient to install and use.
Owner:WUHAN ZKKL OPTOELECTRONICS TECH

Vapor chamber and electronic equipment

The invention relates to the technical field of heat dissipation, and provides a vapor chamber and electronic equipment, the vapor chamber comprises a first shell and a second shell which are oppositely arranged, and the first shell and the second shell define a closed cavity; the first shell comprises a bottom wall used for making contact with a heat source, the second shell is provided with a top wall right opposite to the bottom wall, a first capillary structure is arranged on the bottom wall and comprises a heat source area capillary structure and a non-heat source area capillary structure, and the heat source area capillary structure comprises a plurality of convex capillary structures and/or a plurality of first concave capillary structures. According to the vapor chamber, a plurality of convex capillary structures and/or a plurality of first concave capillary structures are arranged on the heat source area capillary structure of the first capillary structure of an evaporation area over the VC heat source, so that the evaporation area of a working medium in the VC is increased, and the evaporation thermal resistance of the working medium in the VC is reduced; the heat dissipation problem of the VC in a high-power-consumption and high-heat-flux chip application scene is solved.
Owner:ZTE CORP

Heat dissipation system of amphibious armored vehicle

The invention discloses a heat dissipation system of an amphibious armored vehicle, and belongs to the technical field of vehicle heat dissipation. The heat dissipation system comprises three-path circulations of a fresh water path, a seawater path and an oil path, and the three-path circulations are separately circulated through a fresh water pump, a seawater pump and an oil pump to drive coolingmedia to circulate; under the land working condition, the fresh water path circulation and the oil path circulation work simultaneously, and the seawater path circulation does not work; and under theoffshore working condition, the fresh water path circulation, the oil path circulation and the seawater path circulation work simultaneously. The fresh water path circulation is provided with an expansion water tank which is used for balancing the pressure of the system water side and the exhaust and water supplement of the system. According to the heat dissipation system, the heat sources of thevehicle are classified according to different cooling media, then heat dissipation components are circularly built according to the characteristics of the marine and onshore double working conditionsof the vehicle, and the heat dissipation requirements of a high-power-density engine and advanced transmission can be met.
Owner:CHINA NORTH VEHICLE RES INST

Compressor oil return device, air conditioning system and oil return control method

The invention relates to a compressor oil return device, an air conditioning system and an oil return control method. The compressor oil return device comprises a double-suction double-exhaust compressor, and an oil separator and an oil return component which are connected to the double-suction double-exhaust compressor, wherein the oil return component comprises an oil return valve and a connecting pipe; the oil return valve comprises a valve body, a valve needle, a fixed block and a sliding block; the fixed block is fixedly connected into the valve body; the fixed block divides the valve body into an upper cavity and a lower cavity; the sliding block is arranged in the lower cavity and located below the fixed block; a middle cavity is arranged between the sliding block and the fixed block; a flow channel communicated with the upper cavity and the lower cavity is arranged in the middle cavity; and the valve needle matched with the flow channel is arranged under the flow channel. The length of the valve needle extending into the flow channel is changed through vertical sliding of the sliding block in order to achieve adjustment of the oil return amount. The oil return valve is simple in structure, low in manufacturing cost and convenient to use, the problems of high oil discharge rate and difficult lubricating oil return in a direct exhaust compression cylinder of the double-suction double-exhaust compressor can be effectively solved, the abrasion of the compressor is reduced, and the service life is prolonged.
Owner:GREE ELECTRIC APPLIANCES INC

Double-layer micro-channel heat dissipation device based on gas-liquid separation

The invention discloses a double-layer micro-channel heat dissipation device based on gas-liquid separation. The double-layer micro-channel heat dissipation device mainly comprises a liquid path micro-channel radiator on the lower layer, a nano-porous film and a gas path micro-channel radiator on the upper layer. The liquid path micro-channel radiator and the gas path micro-channel radiator are connected into a whole through the sintering technology, then the nano-porous film is packaged between the gas and liquid micro-channels, working fluid in the liquid path micro-channel is heated and evaporated, steam enters the gas path micro-channel through the nano-porous film, film evaporation is formed to take away an extremely large amount of heat, and meanwhile, gas-liquid separation is achieved, the two-phase flow instability is reduced, due to the existence of the porous structure in the liquid path micro-channel, the liquid film drying phenomenon is effectively relieved, the critical phenomenon is delayed, and the critical heat flux density is greatly improved. The device has the advantages of being small in occupied area, low in power consumption and high in heat dissipation capacity, and can be used for meeting the heat dissipation requirement exceeding the heat flux density.
Owner:XI AN JIAOTONG UNIV

Solar energy, ground source heat pump and boiler combined heating and cooling system

A solar energy, ground source heat pump and boiler combined heating and cooling system comprises a solar heat collection system, a plate heat exchanger, a boiler, a soil heat exchanger and a heat pump unit, wherein the solar heat collection system comprises a solar thermal collector, a water tank and a heat collection box; the heat pump unit comprises an evaporator side and a condenser side; the evaporator side comprises a first evaporator side connector and a second first evaporator side connector; the condenser side comprises a first condenser side connector and a second condenser side connector; one side of the plate heat exchanger is communicated with the heat collection box; a plate heat exchanger outlet and a plate heat exchanger inlet are formed in the other side of the plate heat exchanger; the plate heat exchanger outlet is communicated with the inlet of a user water utilization system through a fifth valve; and the outlet of the user water utilization system is communicated with the plate heat exchanger inlet through a second water pump. By adopting the system, the investment cost of a ground source heat pump is reduced, the running cost is reduced, centralized heating and cooling demands of large-area buildings of different functions and types are met and the problem that cooling and heating loads are not balance in the whole year is solved.
Owner:INNER MONGOLIA JUNENG ENERGY SAVING SERVICE

Safety protection system of logging-while-drilling apparatus

The invention discloses a safety protection system of a logging-while-drilling apparatus. The safety protection system comprises an upper chuck, a lower chuck, an upper stopping disk, a lower stopping disk, telescopic arms, a power supply, a switch, balls and anti-collision cushions. The safety protection system is characterized in that the upper chuck is fixed at an upper opening of the upper stopping disk; the lower chuck is fixed at a lower opening of the lower stopping disk; longitudinal notches are formed in the same positions of one side of the upper chuck, the lower chuck, the upper stopping disk and the lower stopping disk; the anti-collision cushions for protecting parameter short sections are stuck on inner walls of the two notches; a mounting groove is formed in an upper surface of the upper stopping disk; a power supply is fixed inside the mounting groove. According to the safety protection system of the logging-while-drilling apparatus, the upper and lower stopping disks can be moved without the need of manpower and the automation degree is high; heat dissipation requirements can be met and seawater cannot enter a cabinet body, so that a machine body is effectively protected; the anti-collision cushions are mounted on the notches and the parameter short sections are effectively protected from damages; when connecting plugs cannot be in butt joint, the parameter short sections can be rotatably adjusted, so that angles of the connecting plugs are changed and the safety protection system is convenient to mount.
Owner:天津中新安德科技有限公司

Liquid cooling heat dissipation device of orthogonal architecture subrack

PendingCN111988972AAddress cooling needsSolve the problem of heat dissipation that cannot be achievedCooling/ventilation/heating modificationsKeelLine card
The invention discloses a liquid cooling heat dissipation device of an orthogonal architecture subrack. The liquid cooling heat dissipation device comprises a line card with an orthogonal architecture, an exchange plate and a keel, and further comprises a liquid cooling heat dissipation device, wherein the liquid cooling heat dissipation device uses the keel as a carrier of a liquid-cooling fluidchannel and further used as a mounting carrier of the blind-mating liquid-cooling connector; a closed channel is arranged in the keel and serves as a liquid cooling fluid channel; a first cold plate is arranged on the exchange plate where the heating device is located, a closed channel is further arranged in the first cold plate to serve as a liquid cooling fluid channel, and the blind insertion liquid cooling connector is used for being connected with a port of the liquid cooling fluid channel located in the first cold plate and a port of the liquid cooling fluid channel located at the corresponding position of the keel. According to the liquid cooling heat dissipation device, the heat dissipation problem of a high-power-consumption device is solved, and safe, stable and efficient work ofelectronic equipment can be guaranteed.
Owner:南京中新赛克科技有限责任公司

A kind of imitation plum-shaped micro-channel heat sink cold plate and its cooling device

The invention discloses a plum-blossom-shaped microchannel heat sink cold plate and a heat dissipation device thereof, which belong to the technical field of micro-channel heat exchange. Microchannel heat sink, the microchannel heat sink is provided with four mutually symmetrical plum blossom petal-shaped microchannels, and the plum blossom petal-shaped microchannels are provided with a number of imitation plum blossom-shaped flow channels from the outside to the inside, and the four plum blossom petal-shaped After the microchannels are put together, the corresponding imitation quincunx-shaped flow channels are connected, and four protrusions and four depressions are formed on the outer edge, and a central confluence is formed at the center. There is a perfusion channel connected to the quincunx-shaped flow channel, and the perfusion channel is reduced from the outside to the inside; one of the depressions is provided with a nozzle connecting the flow channel of the nearest depression and the flow channels of the two adjacent protrusions. In the liquid port, the recess on the opposite side of the liquid injection port is provided with a liquid outlet that communicates with the flow channel in the nearest recess and the flow channels in two adjacent protrusions.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Thermal superconducting plate finned radiator with fins on the surface

ActiveCN107359146BBreak through the limit of heat dissipation capacity limitFlexible structureSemiconductor/solid-state device detailsSolid-state devicesEngineeringHeat pipe
The invention provides a heat superconductive panel fin radiator with fins on the surface thereof. The radiator herein includes: a radiator substrate; a plurality of heat superconductive heating panels which are parallelly disposed at intervals on the surface of the radiator substrate; each heat superconductive heating panel is provided with a heat superconductive pipeline which is formed therein, and the heat superconductive pipeline is a closed pipeline which is filled with a heat conductive working medium; a radiating fin structure which is disposed on at least one surface of each heat superconductive heating panel; the radiating fin structure includes at least one radiating fin which extends in wave form along the direction in parallel to the surface of the heat superconductive heating panel. According to the invention, the heat superconductive panel fin radiator herein has the characteristics of high fin efficiency, large heat exchange area per unit volume, strong radiating capability, small size, light weight, flexible and various appearance and structure, low cost and small radiator substrate. The heat superconductive panel fin radiator herein can deploy devices with large power, is suitable to lower temperature environment of alpine regions in winter, and addresses the anti-freezing problem of heat pipes and water-cooled radiators.
Owner:ZHEJIANG JIAXI TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products