3results about How to "Address cooling needs" patented technology

This invention discloses a single-component moisture-curing conductive and thermally conductive adhesive and its preparation process, comprising the following raw materials in parts by weight: 100 parts SMP adhesive; 15-30 parts flake silver powder; 500-900 parts spherical silver-coated copper powder; 0-400 parts dendritic silver-coated copper powder; 10-20 parts decamethyltetrasiloxane; 1-1.5 parts β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate isooctyl ester; 7.5-10 parts N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane; and 1-1.5 parts vinyltrimethoxysilane. This invention allows the adhesive to cure at room temperature / low temperature using moisture in the air, eliminating the need for temperatures above 120°C. This completely avoids thermal stress damage to heat-sensitive substrates such as plastics, flexible circuit boards, and PET / PI films, making it perfectly suited for low-temperature processing scenarios such as flexible electronics manufacturing, wearable devices, and flexible sensors.

The application discloses a kind of discrete series low distributed capacitance liquid cooling heat dissipation device and method, it belongs to electronic device heat dissipation technical field, heat dissipation device includes several heat dissipation units, the top of each heat dissipation unit is used to set power device, and two adjacent heat dissipation units are connected by cooling liquid pipeline;Each heat dissipation unit includes matrix and radiator, cooling liquid pipeline is through the inside of matrix, the top center of matrix is equipped with mounting hole, and mounting hole is equipped with radiator, and the lower half of radiator is inserted into the inside flow channel of cooling liquid pipeline, and the top of radiator is used to place power device.The application adopts discrete series heat dissipation unit structure, cooling liquid pipeline is through each unit matrix, and the lower half of radiator is inserted into the inside flow channel of pipeline, and each unit independently corresponds a power device.Solve the parasitic distributed capacitance problem caused by shared metal radiator, eliminate resonance loop, inhibit switching oscillation, reduce loss, ensure that heat dissipation is uniform and dynamic equalization, improve the stability and service life of high-voltage series module.

The invention discloses an intelligent, safe and environment-friendly all-insulation looped network switch device, and relates to the technical field of looped network switch cabinets. Comprising an outer box body, a fixed seat module arranged in the outer box body, a looped network switch cabinet installed in the outer box body through the fixed seat module, an intelligent detection module arranged in the looped network switch cabinet, and an inflation insulation module. A discharge sensor, a two-way wireless temperature measurement sensor and a controller are integrated, accurate monitoring of key parts of the looped network switch cabinet can be achieved, the temperature distribution state of equipment can be mastered in an omnibearing mode, after data of various sensors are summarized to the controller, a complete data chain of the operation state of the equipment can be formed, and early recognition of hidden faults is achieved; insulating gas can be filled into the instrument cavity, the bus cavity, the cable cavity and the intelligent control cavity through the pressure dividing header pipe, the pressurizing pipe and the porous gas spraying disc, and uniform distribution of the gas can be realized through the air vents of the partition plates, so that a global inflation insulating environment is formed in the switch cabinet, and the insulating strength of high-pressure parts can be greatly improved.