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Radio frequency transceiving front-end packaging structure and system

A packaging structure, radio frequency transceiver technology, used in transmission systems, electrical components, electrical solid devices, etc., can solve the problem of inability to achieve effective heat dissipation of high-power chips at the same time, multi-chip internal interconnection, etc., to improve reliability and integration, solve Heat dissipation requirements, the effect of a wide range of application prospects

Active Publication Date: 2021-11-02
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, the miniaturized RF transceiver front-end cannot achieve effective heat dissipation of high-power chips and internal interconnection of multiple chips at the same time when packaged.

Method used

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  • Radio frequency transceiving front-end packaging structure and system
  • Radio frequency transceiving front-end packaging structure and system
  • Radio frequency transceiving front-end packaging structure and system

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Embodiment Construction

[0038] In order to illustrate the present application more clearly, the present application will be further described below in conjunction with preferred embodiments and accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present application.

[0039] The present application proposes a radio frequency transceiver front-end packaging structure, which includes: a casing, wherein a metal heat sink is provided at the bottom of the casing; a heat dissipation pad and a substrate arranged on the metal heat sink, wherein the heat dissipation The orthographic projection of the pad on the metal heat sink does not overlap with the orthographic projection of the substrate on the metal heat sink; the first chip arranged on the heat dissipation pad is used for The first ...

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Abstract

An embodiment of the invention discloses a radio frequency transceiving front-end packaging structure and system. The structure comprises a housing, wherein the bottom part of which is provided with a metal heat sink; a heat dissipation gasket and a substrate which are arranged on the metal heat sink, wherein the orthographic projection of the heat dissipation gasket on the metal heat sink is not overlapped with the orthographic projection of the substrate on the metal heat sink; a first chip arranged on the heat dissipation gasket, wherein the heat dissipation gasket is used for dissipating heat of the first chip; a second chip arranged on the substrate, wherein the substrate is used for realizing electric connection among the shell, the first chip and the second chip; and a cover plate opposite to the shell, wherein a closed cavity is formed by the shell and the cover plate.

Description

technical field [0001] The invention relates to the technical field of radio frequency packaging. More specifically, it relates to a radio frequency transceiver front-end packaging structure and system. Background technique [0002] As the core part of microwave communication equipment, the RF transceiver front-end is responsible for signal amplification and phase adjustment, and its performance directly determines the quality of signal reception and transmission. In recent years, modern microwave communication technology has developed rapidly, and various electronic devices are developing in the direction of low cost, high integration and high performance. The RF transceiver front-end has been widely developed and applied in satellite communications, weapon guidance, various terminal electronic products, and automobiles. It is an important part of the conversion of RF signals to digital signals. [0003] Especially in the military field, with the further development of ra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/18H01L23/367H01L23/373H01L23/498H04B1/38H04B1/40H04B1/44
CPCH01L25/18H01L23/367H01L23/49822H01L23/3736H04B1/38H04B1/40H04B1/44
Inventor 张博文林小飞杨帆刘浩
Owner BEIJING INST OF RADIO MEASUREMENT
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