A kind of imitation plum-shaped micro-channel heat sink cold plate and its cooling device

A plum blossom petal-shaped micro and micro channel technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problem that the micro-channel heat dissipation structure cannot solve the heat dissipation demand, etc., to reduce the difference in fluid temperature, temperature The effect of uniform distribution and uniform heat dissipation

Inactive Publication Date: 2020-06-02
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a quincunx-like microchannel heat sink cold plate and its heat dissipation device to solve the technical problem that the existing microchannel heat dissipation structure cannot solve the heat dissipation requirements when two or more heat sources are adjacent to each other

Method used

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  • A kind of imitation plum-shaped micro-channel heat sink cold plate and its cooling device
  • A kind of imitation plum-shaped micro-channel heat sink cold plate and its cooling device
  • A kind of imitation plum-shaped micro-channel heat sink cold plate and its cooling device

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Effect test

Embodiment 1

[0025] Such as figure 1 As shown, the quincunx-shaped microchannel structure heat dissipation cooling device related to the present invention includes four parts: a quincunx-shaped microchannel heat sink cold plate 2, a pulsating pump 3, a circulating liquid cooler 4 and a pipeline 5 connecting them.

[0026] Such as figure 2 and image 3 As shown, the imitation quincunx-shaped micro-channel heat sink cold plate 2 includes a heat sink cover plate 2-2 and a micro-channel heat sink 2-1 that are closed up and down and are hermetically connected. The micro-channel heat sink 2-1 is provided with four A pair of mutually symmetrical plum-blossom-shaped microchannels, the plum-blossom-shaped microchannels are provided with several imitation plum-blossom flow channels 2-1-2 from the outside to the inside, and the corresponding imitation plum-blossom flow channels after the four plum-blossom petal-shaped microchannels are combined Road 2-1-2 is connected and forms four protrusions an...

Embodiment 2

[0032] Applied to CPU chip heat dissipation, the heat generated by the CPU chip is absorbed by the graphene coating through heat conduction and transferred to the micro-channel heat sink cold plate, and then the heat is absorbed by the cooling liquid flowing through the micro-channel heat sink cold plate through the connection of the micro-channel heat sink The cooling plate and the pipeline of the circulating liquid cooler are brought into the circulating liquid cooler for cooling, and finally the cooling liquid is returned to the pulsating pump through the pipeline connecting the pulsating pump and the circulating liquid cooler, forming a closed liquid cooling circulation system.

Embodiment 3

[0034] This embodiment provides a heat dissipation scheme for dealing with the case where any two heat sources are adjacent to each other. A plum blossom-shaped LED module is divided into upper and lower LED heat sources. The plum-shaped micro-channel heat sink cold plate is sandwiched between the two LED heat sources. The two LED heat sources are fixed by bolts, and the bolts pass through the plum-shaped micro-channel heat sink cold plate. The other two recesses of the liquid injection port and the liquid outlet are removed in the structure. The micro-channel cooling device of this embodiment is mainly composed of four parts: a quincunx-like micro-channel heat sink cold plate, a pulsation pump, a circulating liquid cooler, and pipes connecting them. The micro-channel cooling device is evacuated from the liquid injection port and injected with a certain volume of water or other cooling fluids, and then sealed. The pulsating flow generated by the pulsating pump enters the micr...

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Abstract

The invention discloses a plum-blossom-shaped microchannel heat sink cold plate and a heat dissipation device thereof, which belong to the technical field of micro-channel heat exchange. Microchannel heat sink, the microchannel heat sink is provided with four mutually symmetrical plum blossom petal-shaped microchannels, and the plum blossom petal-shaped microchannels are provided with a number of imitation plum blossom-shaped flow channels from the outside to the inside, and the four plum blossom petal-shaped After the microchannels are put together, the corresponding imitation quincunx-shaped flow channels are connected, and four protrusions and four depressions are formed on the outer edge, and a central confluence is formed at the center. There is a perfusion channel connected to the quincunx-shaped flow channel, and the perfusion channel is reduced from the outside to the inside; one of the depressions is provided with a nozzle connecting the flow channel of the nearest depression and the flow channels of the two adjacent protrusions. In the liquid port, the recess on the opposite side of the liquid injection port is provided with a liquid outlet that communicates with the flow channel in the nearest recess and the flow channels in two adjacent protrusions.

Description

technical field [0001] The invention belongs to the technical field of microchannel heat exchange, and in particular relates to a plum blossom imitation microchannel heat sink cold plate and a heat dissipation device thereof. Background technique [0002] Micro-channel heat sink is a kind of compact, lightweight and high-efficiency heat sink designed to meet the needs of the development of the electronic industry. The field of microelectronics follows the rapid development of Moore's law. With the development of high integration of electronic chips, its heating power is also increasing exponentially, and poor heat dissipation will lead to a decrease in the reliability of electronic equipment, and even reduce the service life of the equipment. Heat dissipation has Become the main bottleneck of the development of electronic chips. [0003] At this stage, the heat dissipation of computer chips has been using the traditional forced air-cooled heat dissipation method. The forced...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/473
CPCH01L23/367H01L23/473
Inventor 徐尚龙李垚滢喻康
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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