Rapid cooling device for computer mainframe box

A cooling device and main box technology, applied in computing, instruments, electrical digital data processing, etc., can solve problems affecting computer operation, uneven heat dissipation, and temperature rise of the chassis, so as to improve the anti-seismic effect, facilitate transportation and use, Guaranteed cooling effect

Active Publication Date: 2017-11-24
南宁市鹏杰盛科技有限公司
View PDF15 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the main chassis of the computer is running, it will generate a lot of heat, which will increase the temperature of the chassis, and the high temperature will affect the operation of the computer. The existing computer has several fans inside the chassis. Due to the limitation of the volume, it is still not uniform. Heat dissipation, and vibration will be generated during transportation and fan startup, which will affect the computer. In order to solve the above problems, a fast cooling device for the main computer chassis is needed to meet the demand

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rapid cooling device for computer mainframe box
  • Rapid cooling device for computer mainframe box
  • Rapid cooling device for computer mainframe box

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0020] refer to Figure 1-3 , a fast cooling device for a main computer case, comprising a base 1, two vertically arranged damping rods 2 are fixedly installed on the top of the base 1, and a horizontally arranged vibration damping plate 3 is slidably mounted on the vibration damping rod 2, and the damping The vibration plate 3 is sleeved on the damping rod 2, and the spring 4 is sleeved on the damping rod 2. The top and bottom of the spring 4 are fixedly connected with the vibration damping plate 3 and the base 1 respectively, and the top of the base 1 is fixedly installed with a damper. The vibration block 5 and the top of the vibration damping block 5 are fixedly ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a rapid cooling device for a computer mainframe box. The rapid cooling device comprises a base, two vertical damping rods are fixedly mounted at the top of the base, horizontal damping plates are slidably mounted on the damping rods and sleeve the damping rods, springs are mounted on the damping rods in a sleeving manner, the tops and the bottoms of the springs are fixedly connected with the corresponding damping plates and the base, damping blocks are fixedly mounted at the top of the base, vertical fixed rods are fixedly mounted at the tops of the damping blocks, vertical sliding rods are slidably mounted in the middles of the tops of the fixed rods, the tops of the sliding rods are fixedly connected with the damping plates, and damping cavities are formed in the fixed rods. By means of double damping, the shock resistance effect of a device body is greatly improved, transportation and use of the computer mainframe box are facilitated, a computer mainframe can be cooled within a wide range by one fan, cooling uniformity is ensured, and the use performance of a computer is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a fast heat dissipation device for a computer main case. Background technique [0002] When the main chassis of the computer is running, it will generate a lot of heat, which will increase the temperature of the chassis, and the high temperature will affect the operation of the computer. The existing computer has several fans inside the chassis. Due to the limitation of the volume, it is still not uniform. Heat dissipation, and vibration will be generated during transportation and fan startup, which will affect the computer. In order to solve the above problems, a fast cooling device for the computer main chassis is needed to meet the demand. Contents of the invention [0003] The purpose of the present invention is to solve the shortcoming in the prior art, and propose a kind of fast cooling device of computer main case. [0004] In order to achieve the above object,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/182G06F1/20
Inventor 不公告发明人
Owner 南宁市鹏杰盛科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap