Automatic radiator capable of being assembled autonomously

A radiator and assembled technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, modification using gaseous coolant, etc., can solve high noise, low price of passive heat dissipation, cost and even safety problems. and other issues to achieve the effect of increasing the heat dissipation area

Inactive Publication Date: 2020-10-02
HANGZHOU TEBAI ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Technical issues: Passive cooling is cheap but the cooling effect is not good. Active cooling is better, but only considering the cooling effect, there is no good solution to the noise, high cost and even safety issues.

Method used

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  • Automatic radiator capable of being assembled autonomously
  • Automatic radiator capable of being assembled autonomously
  • Automatic radiator capable of being assembled autonomously

Examples

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Embodiment Construction

[0021] Combine below Figure 1-Figure 7 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0022] A self-assembled automatic radiator according to the present invention includes a base 11, a cooling area 53 is provided on the left side of the upper end surface of the base 11, and a fan box 23 is fixed on the right side of the upper end surface of the base 11. The fan box 23 is provided with a fan transmission cavity 26, the left wall of the fan transmission cavity 26 is rotatably connected with a fan shaft 27, and a fan rotation area 17 is arranged between the heat dissipation area 53 and the fan box 23. A power chamber 18 is provided in the base 11 and below the fan transmission chamber 26 , and a rotating shaft 22 is arranged between the fan transmission chamber 26 a...

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Abstract

The invention discloses an automatic radiator capable of being assembled autonomously. The automatic radiator comprises a base. A heat dissipation area is arranged on the left side of the upper end face of the base. A fan box is fixedly arranged on the right side of the upper end surface of the base; a fan transmission cavity is formed in the fan box; a fan shaft is rotatably connected to the leftwall in the fan transmission cavity; a fan rotating area is arranged between the heat dissipation area and the fan box; a power cavity is formed in the base and located below the fan transmission cavity. A rotating shaft is arranged between the fan transmission cavity and the power cavity in a penetrating manner. By means of the mode of adding the cooling fins and enlarging the cooling area, theactual cooling requirements are met by freely increasing and decreasing the cooling fins; the cooling area is automatically increased by detecting the temperature; and meanwhile, the cooling fins areautomatically subjected to air cooling and water cooling, so that the rapid cooling effect is achieved, and various cooling requirements are met.

Description

technical field [0001] The invention relates to the technical field of electronic radiators, in particular to an autonomously assembled automatic radiator. Background technique [0002] In daily life, as the power of electronic devices increases, the role of corresponding radiators cannot be ignored. Existing radiators are divided into active and passive cooling. Passive cooling is cheap but simply increases The cooling fins are used for heat dissipation, and the heat dissipation effect is not good. The active radiator has a good heat dissipation effect, but the air-cooled radiator is noisy. Although the water-cooled radiator is noiseless, it is expensive and difficult to assemble, which is not friendly to ordinary people. The present invention illustrates a device capable of solving the above-mentioned problems. Contents of the invention [0003] Technical issues: Passive heat dissipation is cheap but not effective in heat dissipation. Active heat dissipation is better, ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20209H05K7/20272H05K7/20281H05K7/20418
Inventor 高经
Owner HANGZHOU TEBAI ELECTRONICS TECH CO LTD
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