Copper-aluminum composite material heat dissipation structure for high-power-consumption single board and installation method of copper-aluminum composite material heat dissipation structure

Abstract

The invention discloses a copper-aluminum composite material heat dissipation structure for a high-power-consumption single board. The invention belongs to the technical field of high-power-consumption single-board heat dissipation. The copper-aluminum composite material heat dissipation structure comprises a high-power-consumption single-board PCB and a chipset arranged on the high-power-consumption single-board PCB. The copper-aluminum composite material heat dissipation structure further comprises a copper-aluminum composite heat dissipation body installed on the high-power-consumption single-board PCB, a heat dissipation fan is arranged on one side face of the copper-aluminum composite heat dissipation body, the other side face of the copper-aluminum composite heat dissipation body isattached to the surface of the chipset through a heat conduction medium, and then the purposes of meeting the high power consumption of the LED lamp and meeting the strict requirement for the use environment size are achieved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of high-power consumption single boards, and in particular relates to a copper-aluminum composite material heat dissipation structure for high power consumption single boards and an installation method thereof. Background technique [0002] High power consumption single boards, also known as high power consumption embedded single boards, are widely used. In the application process, solving the heat dissipation problem of high power consumption single boards is a major obstacle to the development and application of high power consumption single boards. . [0003] When working as a high-power consumption single board as a module, due to its high power consumption and strict requirements on the size of the use environment, it is often unable to achieve efficient heat dissipation and cannot take care of high power consumption operation at the same time. Row and the size requirements of the u...

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Problems solved by technology

[0003] When working as a high-power consumption single board as a module, due to its high power consumption and strict requirements on the size of the use environment, it is often unable to achieve efficient heat dissipation and cannot take care of high power consumption operation at the same time. Row and the size requirements of the use environment. In prior art applications, on the one hand, using an all-copper radiator under high power consumption will increase the weight and cost; on the other hand, in the case of using an all-aluminum radiator and in the Under the condition of strict size requirements, the situation of heat dissipation cannot be solved, resulting in the accumulation of heat on the chip, and finally the failure of normal operation.

[0004] In view of the above, the current high power consumption single board cannot meet the strict requirements of its own high power consumption and the size of the use environment at the same time.

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