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Double-layer micro-channel heat dissipation device based on gas-liquid separation

A technology of gas-liquid separation and heat dissipation device, which is applied in cooling/ventilation/heating transformation, modification by conduction heat transfer, electrical components, etc., which can solve the instability of flow and boiling, high pressure drop, and it is difficult to further improve the critical heat flux density. and other problems to achieve the effect of suppressing instability, increasing the density of the gasification core, and eliminating instability

Active Publication Date: 2021-06-01
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, due to the complexity of the two-phase flow in microchannels, there are still many unsolved problems in flow boiling in microchannels, such as large flow boiling instability, excessively high pressure drop, and difficulty in further increasing the critical heat flux, etc.

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  • Double-layer micro-channel heat dissipation device based on gas-liquid separation
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  • Double-layer micro-channel heat dissipation device based on gas-liquid separation

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Embodiment Construction

[0033] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0034] From the perspective of suppressing flow boiling instability, reducing pressure drop, increasing heat transfer coefficient and critical heat flux density, the present invention designs a high-efficiency gas-liquid separation microstructure with high stability, low pressure drop characteristics and high heat transfer performance Channel heat sink.

[0035] Such as Picture 1-1 , 1-2 As shown, it includes a liquid microchannel radiator 1, a liquid microchannel 2, an air microchannel radiator 3, an air microchannel 4, a nanoporous film 5, a porous structure 6 on the surface of the liquid microchannel and the first micro Rib 7 and second micro-rib 8 . Based on the principle of rapid gas-liquid separation, the present invention proposes a structural design of double-layer microchannels for gas-liquid separation, which mainly consists of upper and lower layers of m...

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Abstract

The invention discloses a double-layer micro-channel heat dissipation device based on gas-liquid separation. The double-layer micro-channel heat dissipation device mainly comprises a liquid path micro-channel radiator on the lower layer, a nano-porous film and a gas path micro-channel radiator on the upper layer. The liquid path micro-channel radiator and the gas path micro-channel radiator are connected into a whole through the sintering technology, then the nano-porous film is packaged between the gas and liquid micro-channels, working fluid in the liquid path micro-channel is heated and evaporated, steam enters the gas path micro-channel through the nano-porous film, film evaporation is formed to take away an extremely large amount of heat, and meanwhile, gas-liquid separation is achieved, the two-phase flow instability is reduced, due to the existence of the porous structure in the liquid path micro-channel, the liquid film drying phenomenon is effectively relieved, the critical phenomenon is delayed, and the critical heat flux density is greatly improved. The device has the advantages of being small in occupied area, low in power consumption and high in heat dissipation capacity, and can be used for meeting the heat dissipation requirement exceeding the heat flux density.

Description

technical field [0001] The invention relates to the field of cooling and heat dissipation in tiny spaces, is applicable to ultra-high heat flux heat dissipation technology, and particularly relates to a double-layer micro-channel heat dissipation device based on gas-liquid separation. Background technique [0002] With the rapid development of MEMS / NEMS technology and 3D-IC packaging technology, the miniaturization and integration of electronic devices are higher. At the same time, they are also facing the dual challenges of high heat flux density and local ultra-high heat flux density. In recent years, people have proposed a variety of new cooling technologies to improve the reliability of materials and equipment, including: micro-channel cooling, spray cooling, piezoelectric cooling, jet cooling, heat pipes and other methods. Among them, microchannel cooling technology has become a research hotspot due to its strong heat transfer capacity, compactness, and heat transfer un...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039H05K7/20309H05K7/20381
Inventor 张永海马祥魏进家
Owner XI AN JIAOTONG UNIV
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