The invention discloses a graded manifold micro-channel heat dissipation device. The graded manifold micro-channel heat dissipation device mainly comprises a first-stage micro-channel, a second-stage micro-channel, a third-stage micro-channel and a bottom plate part. The four layers of channels are packaged through the bonding technology, working medium inlets and working medium outlets are located in the top, and the number of the micro-channels and the number of the manifold channels can be increased according to the heat exchange area. A heat exchange working medium flows into the third-stage micro-channel through the first-stage micro-channel and the second-stage micro-channel, is split into the last eight inlets from the first two inlets and flows to the surface of the analog chip, and the temperature distribution uniformity of the surface of the analog chip is improved through uniform distribution of the working medium. And the working medium after heat exchange is converged into the first-stage micro-channels through the third-stage micro-channels and the second-stage micro-channels, and finally is converged to an outlet in the middle through the two first-stage micro-channels to flow out. The flow channel is segmented into a plurality of micro-channel units, the flow length is shortened, so that the pressure drop is reduced, a thermal boundary layer is difficult to develop in the micro-channel, and the heat exchange coefficient is increased and the total thermal resistance is reduced. The device has the advantages of being small in occupied area, low in power consumption and high in heat dissipation capacity, and can be used for meeting the heat dissipation requirement exceeding the heat flux density.