Hierarchical manifold micro-channel heat dissipation device
A technology of heat dissipation device and micro-channel, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc. The effect of reducing thermal resistance and shortening the effective length
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0046] Embodiments of the present invention are described in further detail below:
[0047] The present invention realizes the flow and heat transfer enhancement of traditional parallel microchannels through complex flow channel design, and adds a multi-stage flow splitting device, and develops a layered manifold microchannel heat dissipation with pressure drop, small thermal resistance, and uniform wall temperature distribution. device.
[0048] A hierarchical manifold microchannel cooling device, including a first-layer substrate 1 (the lower surface of the first-layer substrate 1 is designed with four first-level microchannels, and the upper surface is designed with two first-level working fluid inlets and one first-level working fluid inlet. quality outlet), the second layer substrate 2 (the lower surface of the second layer substrate 2 is designed with eight secondary microchannels, and the middle part of each secondary microchannel is provided with a through hole), the t...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com