Liquid cooling heat dissipation device of orthogonal architecture subrack

Abstract

The invention discloses a liquid cooling heat dissipation device of an orthogonal architecture subrack. The liquid cooling heat dissipation device comprises a line card with an orthogonal architecture, an exchange plate and a keel, and further comprises a liquid cooling heat dissipation device, wherein the liquid cooling heat dissipation device uses the keel as a carrier of a liquid-cooling fluidchannel and further used as a mounting carrier of the blind-mating liquid-cooling connector; a closed channel is arranged in the keel and serves as a liquid cooling fluid channel; a first cold plate is arranged on the exchange plate where the heating device is located, a closed channel is further arranged in the first cold plate to serve as a liquid cooling fluid channel, and the blind insertion liquid cooling connector is used for being connected with a port of the liquid cooling fluid channel located in the first cold plate and a port of the liquid cooling fluid channel located at the corresponding position of the keel. According to the liquid cooling heat dissipation device, the heat dissipation problem of a high-power-consumption device is solved, and safe, stable and efficient work ofelectronic equipment can be guaranteed.

Description

technical field [0001] The invention relates to a liquid cooling and heat dissipation device for electronic equipment, in particular to a liquid cooling and heat dissipation device with an orthogonal structure sub-box. Background technique [0002] With the continuous development of electronic technology, the power of electronic equipment systems is increasing, but the physical size is getting smaller and smaller, the heat flux density is also increasing sharply, and the risk of heat dissipation is increasing. Especially in a certain type of subrack equipment, the power consumption is increasing, and the traditional air-cooled heat dissipation challenges are becoming more and more serious, and the heat dissipation problem is prominent. Therefore, solving the heat dissipation of such equipment has become a difficulty and pain point in the industry. [0003] For this type of subrack equipment, the conventional structure adopts the form of direct ventilation, and the basic air...

AI Technical Summary

Problems solved by technology

As the power of heating devices increases, due to the limitation of the size and heat dissipation capacity of air-cooled radiators, conventional air-cooled heat dissipation solutions cannot meet the thermal reliability requirements of devices, which in turn leads to device overheating, equipment downtime and other failures

Based on the above, it can be seen that when encountering this kind of heat dissipation problem, the heat dissipation of this type of equipment cannot be solved by conventional air cooling solutions.

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