Vapor chamber and electronic equipment

Abstract

The invention relates to the technical field of heat dissipation, and provides a vapor chamber and electronic equipment, the vapor chamber comprises a first shell and a second shell which are oppositely arranged, and the first shell and the second shell define a closed cavity; the first shell comprises a bottom wall used for making contact with a heat source, the second shell is provided with a top wall right opposite to the bottom wall, a first capillary structure is arranged on the bottom wall and comprises a heat source area capillary structure and a non-heat source area capillary structure, and the heat source area capillary structure comprises a plurality of convex capillary structures and/or a plurality of first concave capillary structures. According to the vapor chamber, a plurality of convex capillary structures and/or a plurality of first concave capillary structures are arranged on the heat source area capillary structure of the first capillary structure of an evaporation area over the VC heat source, so that the evaporation area of a working medium in the VC is increased, and the evaporation thermal resistance of the working medium in the VC is reduced; the heat dissipation problem of the VC in a high-power-consumption and high-heat-flux chip application scene is solved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and more specifically relates to a uniform temperature plate and electronic equipment. Background technique [0002] With the development of electronic products in the electronics industry towards larger capacity and higher performance, the degree of integration of electronic product equipment is getting higher and higher, and the power consumption of devices continues to increase significantly, especially for some multi-function chips, the integration level is also getting higher and higher , which also leads to a continuous increase in heat flux density, which poses a severe challenge to heat dissipation technology, especially in air-cooled systems, where high-power devices face the problem of excessive thermal resistance (excessive temperature rise) from the air side to the chip side. [0003] Vacuum Chamber (Vapor Chamber; VC) also known as vapor chamber is mainly composed of shell, ...

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Problems solved by technology

[0005] The purpose of the embodiments of the present invention is to provide a vapor chamber to solve the technical problem in the prior art that the VC capillary structure evaporation heat resistance is too large, so that the performance of VC does not meet the heat dissipation requirements

[0006] Another object of the embodiments of the present invention is to provide an electronic device to solve the technical problem in the prior art that the VC capillary structure evaporation heat resistance is too large, so that the performance of VC does not meet the heat dissipation requirements

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