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Method for the manufacture of component carrier and its components

A manufacturing method and component bearing technology, applied in printed circuit manufacturing, multilayer circuit manufacturing, printed circuit components, etc., can solve problems such as heating, overheating hazards, and reliability issues

Active Publication Date: 2022-04-05
AT & S AUSTRIA TECH & SYSTTECHN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the scenario of modern printed circuit board applications with complex electronic functions and high integration density conductive structures, it can happen that the printed circuit board and / or components mounted on and / or in it are significantly heated during operation , and cannot adequately remove the heat generated by
This causes reliability issues and overheating hazards

Method used

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  • Method for the manufacture of component carrier and its components
  • Method for the manufacture of component carrier and its components
  • Method for the manufacture of component carrier and its components

Examples

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Embodiment approach

[0049] According to an exemplary embodiment of the invention, the use of a sacrificial layer as a deposition base for a highly thermally conductive and electrically insulating or semiconducting structure, such as a ceramic layer, improves heat dissipation within the component carrier. More specifically, a method of making an inorganic or semiconducting dielectric heat sink for use in a printed circuit board (PCB) using a sacrificial layer is provided.

[0050] Especially for light-emitting diodes (LEDs) and electrical devices, ceramics (such as aluminum nitride and aluminum oxide), carbides, and diamond-like carbon (DLC) can be used as heat sinks due to the two characteristics of these materials. On the one hand, they are dielectric materials. On the other hand, they are very good conductors of heat. However, the creation of a thin ceramic layer compatible with the dimensions of the PCB to be used as a heat sink involves a process of being subjected to extreme temperatures. ...

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Abstract

A manufacturing method for manufacturing a component (350) for a component carrier (300), wherein the method includes: providing a conductive structure (100); forming a highly thermally conductive and electrically insulating or semiconductive and subsequently attaching a thermally conductive and electrically insulating structure (200) on the exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure (102), the thermally conductive and electrically insulating structure having a higher thermal conductivity than the And the electrically insulating or semiconducting structure (102) has low thermal conductivity. Furthermore, the invention relates to a method for producing a component carrier (300) for carrying at least one component (1000).

Description

technical field [0001] The invention relates to a manufacturing method and to a method of manufacturing a component carrier. Furthermore, the invention relates to a constituent (component, component part) for a component carrier, to a component carrier and to a method of use. Background technique [0002] With the development of the electronics industry, electronic products have a trend toward miniaturization and high performance, and accordingly, multilayer boards have been developed in order to meet the demand for high-density integrated circuits while reducing the thickness of packaging substrates. In modern applications of component carrier technology complex electronic functions are implemented. This also concerns high power density and high voltage applications. Consequently, a considerable amount of heat may be generated by one or more components mounted on and / or embedded in a component carrier, such as a printed circuit board (PCB). This may have an impact on rel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/03H01L23/373H05K3/02H05K3/46
CPCH01L23/15H01L23/3731H01L23/3732H01L23/3735H01L33/60H01L33/62H01L33/641H01L33/642H01L33/647H05K1/0203H05K1/0306H05K1/036H05K3/022H05K3/4602H05K3/4605H01L2933/0066H01L2933/0075H05K2201/0108H05K2201/0195H05K2201/10106H05K2203/0152H05K1/0209H05K1/181H05K1/182H05K3/4655
Inventor 乔纳森·西尔瓦诺·德索萨汉内斯·沃拉伯格马库斯·莱特格布
Owner AT & S AUSTRIA TECH & SYSTTECHN AG
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