A chip packaging system

A packaging system and chip technology, applied in packaging, transportation, packaging, closing, etc., can solve problems such as danger, artificial fire, etc., and achieve the effects of preventing accidental injuries, convenient operation, and safe and reliable packaging

Active Publication Date: 2021-06-22
浙江麦知网络科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Chips need to be packaged when they are sold. At present, most of them use plastic packaging. In order to ensure that the plastic is not easy to break, thicker plastic packaging is used. For thicker plastic packaging, it needs to be sealed by heating between high temperature and fire, but many They are all plastic-packed by artificial fire spraying, which is extremely dangerous. Therefore, a chip packaging system is urgently needed to improve the efficiency of chip packaging

Method used

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Embodiment Construction

[0016] Combine below Figure 1-6 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0017] refer to Figure 1-6 , a chip packaging system according to an embodiment of the present invention, comprising a packing machine 11, a packing chamber 12 is arranged inside the packing machine 11, a clamping and reversing device is provided on the upper side of the packing chamber 12, and the clamping The reversing device includes a lifting plate 13 arranged on the upper side of the packing cavity 12, and a steering wheel 14 is rotatably arranged on the lower side of the lifting plate 13, and the steering wheel 14 is driven up and down by controlling the lifting plate 13, Then control the steering wheel 14 to change direction, the steering wheel 14 is rotatably provided with a c...

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PUM

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Abstract

The invention discloses a chip packaging system, which includes a packing machine, a packing chamber is arranged inside the packing machine, a clamping and reversing device is arranged on the upper side of the packing chamber, and the clamping and reversing device includes a The upper side of the lifting plate in the packing cavity, the lower side of the lifting plate is rotatably provided with a steering wheel, the steering wheel is driven up and down by controlling the lifting plate, and then the steering wheel is controlled to change direction, the steering wheel The inner rotatable is provided with a control turntable, and the lower side of the control turntable is symmetrically provided with slide plates, and the mutual approach and distance of the slide plates are controlled by the control turntable; Realize automatic reversing, can be directly connected to work between the previous processes, which is faster, saves manpower, and at the same time can prevent accidental damage caused by fire, and the packaging of chips is safer and more reliable.

Description

technical field [0001] The invention relates to the technical field of packaging and processing, in particular to a chip packaging system. Background technique [0002] Chips need to be packaged when they are sold. At present, most of them use plastic packaging. In order to ensure that the plastic is not easy to break, thicker plastic packaging is used. For thicker plastic packaging, it needs to be sealed by heating between high temperature and fire, but many They all use artificial flame spraying for plastic sealing, which is extremely dangerous. Therefore, there is an urgent need for a chip packaging system to improve the efficiency of chip packaging. Contents of the invention [0003] The object of the present invention is to provide a chip packaging system for overcoming the above-mentioned defects in the prior art. [0004] A chip packaging system according to the present invention includes a packing machine, a packing cavity is arranged inside the packing machine, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D51/10B65B35/24
CPCB65B35/24B65D51/10
Inventor 陈相忠
Owner 浙江麦知网络科技有限公司
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