Method for processing circular plate-shaped workpiece

一种加工方法、圆板的技术，应用在工件进给运动的控制、金属加工设备、制造工具等方向，能够解决研磨垫缓冲性变小、研磨垫压扁等问题

Active Publication Date: 2020-06-16
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the grinding process in which the grinding pad is pressed against the disc-shaped workpiece for a long time, even when the grinding surface of the grinding pad is trimmed into a desired shape as disclosed in Patent Document 3, there may be a problem. The following problems: the grinding pad is crushed, and the disc-shaped workpiece after grinding becomes a concave shape
[0009] And, when the polishing pad is thinned due to dressing, the cushioning property of the polishing pad becomes small, so there is a problem that the polishing pad is strongly pressed against the central portion of the disc-shaped workpiece held by the holding table, and the polished circle Plate-shaped workpiece becomes concave shape

Method used

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  • Method for processing circular plate-shaped workpiece
  • Method for processing circular plate-shaped workpiece
  • Method for processing circular plate-shaped workpiece

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Experimental program
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Effect test

Embodiment approach 1

[0080] Below, for using the above figure 1 The grinding and polishing apparatus 1 shown will describe each step in the case where the disc-shaped workpiece W is subjected to the grinding process and the grinding process. Each process of the processing method of the disk-shaped workpiece of this embodiment (hereinafter referred to as the processing method of Embodiment 1) is, for example, as follows: Figure 5 The sequence shown in the flowchart shown is implemented.

[0081] (1) Maintain process

[0082] First, by making figure 1 The illustrated rotary table 6 rotates on its own axis to revolve the holding table 5 in the state where the disk-shaped workpiece W is not placed, and moves the holding table 5 to the vicinity of the loading arm 154a. The robot 155 pulls out one disk-shaped workpiece W from the first cassette 150 a and moves the disk-shaped workpiece W to the temporary storage area 152 . Next, after the disk-shaped workpiece W is centered by the alignment member ...

Embodiment approach 2

[0114] Below, for using the above figure 1 The grinding and polishing apparatus 1 shown will describe each step in the case where the disc-shaped workpiece W is subjected to the grinding process and the grinding process. Each process of the processing method of the disk-shaped workpiece of this embodiment (hereinafter referred to as the processing method of Embodiment 2) is, for example, Figure 13 The sequence shown in the flowchart is implemented.

[0115] (1) Holding process of the first disc-shaped workpiece~(2) Grinding process

[0116] The holding process is carried out in the same manner as in Embodiment 1, such as Figure 14 As shown, the disk-shaped workpiece W (hereinafter referred to as the first disk-shaped workpiece W) is held by the holding table 5 . Next, in the grinding step, rough grinding and finish grinding are performed in the same manner as in Embodiment 1, such as Figure 15 As shown, the disc-shaped workpiece W is ground to the desired finished thick...

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Abstract

The invention provides a method for processing a circular plate-shaped workpiece, and the thickness of the polished circular plate-shaped workpiece is uniform under the condition that the circular plate-shaped workpiece is processed. The workpiece machining method includes the steps: holding a disk-shaped workpiece on a table (5); rotating the workpiece and a grinding wheel (304), and grinding theworkpiece with a grinding tool; a polishing step for rotating the workpiece and the polishing pad (44) after polishing, and polishing the workpiece while the polishing pad (44) covers the workpiece;measuring the thickness of the workpiece at at least two points, i.e., a first measurement point (P1) at the center of the workpiece and a second measurement point (P2) near the outer peripheral edgeof the workpiece, after polishing; identifying the thickness tendency in the radial direction of the workpiece from the measured workpiece thicknesses at the two measurement points (P1, P2); and changing the inclination relationship between the rotating shaft (300) for rotating the grinding wheel (304) and the rotating shaft (571) of the table (5) in accordance with the recognized thickness tendency.

Description

technical field [0001] The invention relates to a processing method for grinding and lapping disc-shaped workpieces. Background technique [0002] In the case of manufacturing device chips and the like from a disc-shaped workpiece, as disclosed in Patent Document 1, after using a grinding tool to grind the disc-shaped workpiece to make it thinner, use a device capable of covering the disc. The grinding pad of the grinding surface of the area of ​​the grinding surface of the workpiece grinds the grinding surface. [0003] In the grinding process, a grinding wheel provided with a grinding tool in a ring shape is rotated, and a disc-shaped workpiece is ground to a uniform thickness by the grinding tool. In order to grind the disc-shaped workpiece to a uniform thickness, as disclosed in Patent Document 2, the grinding is temporarily stopped during the grinding process, and at the midpoint of the radius of the disc-shaped workpiece (that is, the disc-shaped The thickness of the...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): B24B37/10B24B37/30B24B37/005B24B49/02H01L21/02H01L21/66
CPCB24B37/107B24B37/30B24B37/005B24B49/02H01L21/02013H01L22/12B24B51/00
Inventor井上雄贵
OwnerDISCO CORP