A kind of solder wire flux that can reduce spatter and preparation method thereof

A technology of flux and solder wire, applied in welding equipment, manufacturing tools, welding media, etc., can solve problems such as environmental hazards, lower reliability of solder joints, and inability to suppress bubble splashing, so as to improve soldering performance and promote soldering wetness. Wet spreading, the effect of improving the reliability of solder joints

Active Publication Date: 2022-01-25
云南锡业新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the solder wire is soldered at high temperature, the flux will always melt and boil, decompose to generate a relatively high-pressure air pressure, and form a certain amount of high-pressure bubbles. The bursting of the bubbles will cause considerable splashes. Although the above prior art effectively reduces the Splash, but it cannot suppress the splash caused by bubble burst. In addition, fluorine-containing surfactants and ionic surfactants are used in the flux formula, which will bring certain harm to the environment and reduce the reliability of solder joints.

Method used

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  • A kind of solder wire flux that can reduce spatter and preparation method thereof
  • A kind of solder wire flux that can reduce spatter and preparation method thereof
  • A kind of solder wire flux that can reduce spatter and preparation method thereof

Examples

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Effect test

Embodiment 1

[0036] A solder wire flux that can reduce spatter, its composition and mass percentage are:

[0037]

[0038] The preparation method of solder wire flux that can reduce spatter is as follows: Add hydrogenated rosin and modified rosin R130 into the reactor, heat to 155°C, stir and melt completely, and keep the temperature at about 145°C, then add glutaric acid, decane Diacid, dodecanedioic acid and dibromobutenediol were stirred for 5-10 minutes to melt completely to obtain a composite compound; tetrahydrofurfuryl alcohol and propylene glycol monomethyl ether were mixed to obtain a compound solvent, and p-tert-butyl Add imidazole hydrobromide, Ciba antioxidant 1010, and benzotriazole into the compound solvent and stir fully to obtain a compound solution; then add the compound ingredients into the compound solution and stir at constant temperature for 1-5 minutes, and finally add Surfynol 104BC, Dynol 604, methyl silicone oil, silicone defoamer, continue to stir for 20 minute...

Embodiment 2

[0041] A solder wire flux that can reduce spatter, its composition and mass percentage are:

[0042]

[0043] The preparation method of solder wire flux that can reduce spatter is as follows: add hydrogenated rosin, Eastman fully hydrogenated rosin AX-E, and modified rosin RHR-604B into the reactor and heat to 160 ° C to stir and melt completely, and keep the temperature at 150 At about ℃, add phenylbutanedioic acid, sebacic acid and dibromobutenediol at the same time, stir for 5-10 minutes to melt completely, then add cyclohexylamine hydrobromide, p-tert-butyl In the compound solvent of imidazole hydrobromide, Ciba antioxidant 1010, and benzotriazole (the compound solvent is compounded by ethanolamine, propylene glycol monomethyl ether, and tripropylene glycol butyl ether), stir at constant temperature for 1-5 minutes, Finally, add the mixture of DF110D and silicone defoamer, and continue to stir for 20 minutes to completely dissolve the components and mix well to prepare ...

Embodiment 3

[0046] A solder wire flux that can reduce spatter, its composition and mass percentage are:

[0047]

[0048]

[0049] The preparation method of the solder wire flux that can reduce spatter is as follows: Add water white rosin, Eastman fully hydrogenated rosin AX-E, modified rosin RHR-604B, and hydrogenated rosin into the reactor and heat to 165 ° C to stir and melt completely. And keep the temperature at about 160°C, then add adipic acid, sebacic acid and dibromobutene diol at the same time, stir for 5-10 minutes to make it melt completely, then add diethylamine hydrobromide dissolved in it, In the compound solvent of tert-butyl imidazole hydrobromide, Ciba antioxidant 1010, and imidazole (the compound solvent is compounded by diethylene glycol, dipropylene glycol butyl ether, methanol, and tripropylene glycol monomethyl ether), Stir at constant temperature for 1-5 minutes, finally add the mixture of SurfynolAD01, Surfynol 104E, and methyl silicone oil, and continue to ...

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Abstract

A solder wire flux capable of reducing spatter and a preparation method thereof, the flux is composed of 1.0-10.0% compounded organic acid, 0.2-5.0% compounded activator, and 0.1-1.0% compounded defoamer , 2.0-10.0% compound solvent, 0.1-1.0% antioxidant, 0.1-1.0% corrosion inhibitor and the balance compound rosin. Heat and stir the compound rosin to melt, then add compound organic acid and low melting point insoluble activator, then add solution with high melting point soluble activator, antioxidant and corrosion inhibitor, and finally add compound defoamer, Constant temperature of 145-165°C and continuous stirring to dissolve fully and mix evenly to prepare soldering flux. The flux of the present invention has high activity, easy soldering, low corrosion, small residue, and high insulation resistance, which can greatly reduce the amount and splash distance of flux and tin beads in the soldering process of lead-free tin wire, and meet the RoHS directive , to ensure the reliability of electronic and electrical products after welding.

Description

technical field [0001] The invention belongs to the technical field of electronic soldering materials, and in particular relates to a solder wire flux and a preparation method thereof. Background technique [0002] With the rapid development of electronic information products, the welding requirements for solder wire are getting higher and higher. Among them, the performance of splashing and frying tin is one of the important indicators for evaluating the quality level of a solder wire. It directly affects the quality of electronic products and will Harm to the health of welding workers. Therefore, many standards have incorporated the splash test into the testing items, such as the international standard IPC-TM-650, IPC J-STD-004B, etc. Although the national standard does not include the splash test as a testing item, most domestic manufacturers have included it Splash test is one of the important criteria for solder wire quality evaluation. [0003] In this regard, domest...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/3613B23K35/3618B23K35/40
Inventor 何江华白海龙张欣吕金梅赵玲彦解秋莉沙文吉徐浩雷佳熙
Owner 云南锡业新材料有限公司
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