Intelligent disassembling and sorting method for waste circuit board devices

Abstract

The invention discloses an intelligent disassembling and sorting method for waste circuit board devices. The intelligent disassembling and sorting method for the waste circuit board devices comprisesthe following steps that a plug-in component circuit board is heated and disassembled; a patch component circuit board is heated and disassembled; performance detection is performed on the plug-in component and the patch component; and the plug-in component and the patch component are classified. According to the intelligent disassembling and sorting method for the waste circuit board devices, thecomponents are intelligently disassembled from waste circuit boards, so that recycling of the components can be achieved, toxic and harmful substances are easy to treat, precious metal recycling andnon-metal material recycling of the disassembled PCB are facilitated, and the resource utilization efficiency of the waste circuit boards is greatly enhanced; According to the intelligent disassembling and sorting method for the waste circuit board devices, as the waste circuit board is subjected to secondary crushing through a crusher, valuable metal of the waste circuit board is recycled througha high-voltage eddy current technology sorting technology, the whole process is automatic and free of pollution, and environment-friendly recycling and high-utilization-rate regeneration of the valuable metal on the waste circuit board are achieved.

Description

technical field [0001] The invention relates to the technical field of circuit board dismantling, in particular to an intelligent dismantling and sorting method for waste circuit board components. Background technique [0002] According to the survey of relevant departments, there are currently 1 billion discarded mobile phones deposited in my country, and many other discarded household appliances such as computers, TVs, refrigerators and air conditioners are replaced every year. In 2016, 14 kinds of products entered the subsidy list, and their waste electronic product production reached 10.38 million tons. By 2020, it will reach 15.5 million tons, and by 2030, it may exceed 20 million tons. The average annual growth rate is about 7.5%. Along with the growth of waste electronic and electrical products, the sharp increase of waste circuit boards. At present, the total amount of discarded circuit boards in my country is more than 500,000 tons per year, and it is growing at a ...

AI Technical Summary

Problems solved by technology

They have a common shortcoming: high-temperature dismantling of waste circuit boards directly will cause moisture to components and components, which will easily lead to delamination of plastic IC chips on them, which will seriously damage the reliability of the chips.

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