HMDS leakage-proof protection device for spin coating developer
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 宁波润华全芯微电子设备有限公司
- Publication Date
- 2021-09-10
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Abstract
Description
technical field
[0001] The invention relates to the technical field of HMDS processing equipment, in particular to an HMDS leak-proof protection device for a glue leveling developing machine. Background technique
[0002] In the prior art, before coating the photoresist, people need to put the substrate into the HMDS pretreatment equipment for pretreatment. The purpose is to reduce the contact angle between the HMDS-treated silicon wafer and the photoresist, thereby reducing the The difficulty of spreading the photoresist on the surface of the silicon wafer during the photoresist improves the adhesion between the photoresist and the silicon wafer. The tackifier HMDS (hexamethyldisilazane) can improve this situation very well. After the HMDS is coated on the surface of the silicon wafer, it can be reacted to form a compound mainly composed of siloxane after being heated in an oven. It successfully changes the surface of the silicon wafer from hydrophilic to hydrophobic, and...