Backlight module and display device
A technology of backlight module and light guide, which is applied in the direction of light guide, optics, optical components, etc., can solve the problems of poor bending flexibility of the backlight module, and achieve the effect of improving the bending performance and uniform backlight
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Embodiment 1
[0038] Such as Figure 1 to Figure 8 As shown, this embodiment provides a backlight module, the backlight module includes a substrate 10, a light guide layer 20 and an encapsulation adhesive layer 30, the substrate 10 has a plurality of light sources 11, and the light guide layer 20 is arranged on The substrate 10 has one side of the light source 11, the light guide layer 20 is a patterned structure, and the patterned structure can change the light guide layer 20 from directly above the light source 11 to the light source 11 The light transmittance at the gap.
[0039] In this embodiment, from the perspective of thinning, the substrate 10 is preferably a flexible substrate (PI) or a thinned glass substrate, and the traces on the substrate 10 are formed by array semiconductor technology to achieve the desired The thinner design and multi-region design of the substrate 10 are described. The overall thickness of the substrate 10 is not more than 0.1 mm. The driving mode of the...
Embodiment 2
[0063] Such as Figure 1 ~ Figure 4 as well as Figure 6 ~ Figure 12 As shown, this embodiment provides a backlight module, the backlight module is a direct type backlight module, the backlight module includes a substrate 10, a light guide layer 20 and an encapsulation adhesive layer 30, and the substrate 10 has multiple A light source 11, the light guide layer 20 is provided on the surface of one side of the encapsulation adhesive layer 30, and the light guide layer 20 is a patterned structure.
[0064] In this embodiment, the substrate 10 can be one of a flexible circuit board (FPC), a printed circuit board (PCB), a glass substrate, and a flexible substrate (PI). From the perspective of thinning the device, the The substrate 10 is preferably a flexible circuit board and a flexible substrate substrate, and the traces on the substrate 10 are formed by an array semiconductor process to achieve a thinner design and a multi-region design of the substrate 10 . The overall thickn...
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Abstract
Description
Claims
Application Information
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