Stereoscopic discrete device and control module
A discrete device, three-dimensional technology, applied in the direction of semiconductor devices, electric solid-state devices, semiconductor/solid-state device components, etc., can solve the problems of poor pressure resistance, low production efficiency, increase the installation space of the power switch circuit 4', etc. The effect of large integration density and increased quantity
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Embodiment 1
[0060] Such as Figure 2 to Figure 5 As shown, the wire bonding frame 100 of the embodiment of the present invention has a rectangular cross-section, which may be a square or a rectangle. There are four sides 12 , and chips 200 are arranged on the four sides 12 .
[0061] The cooling holes 3 provided on the wire bonding frame 100 are through holes vertically penetrating through the entire wire bonding frame 100 , specifically, the two ends of the cooling holes 3 respectively penetrate the supporting surface 11 and the frame bottom 2 . The heat dissipation holes 3 provided through can completely dissipate heat from the wire bonding frame 100 and improve the heat dissipation effect.
[0062] In this embodiment, the two ends of the heat dissipation hole 3 are respectively used as the inlet and outlet of the heat dissipation medium, so that the heat dissipation medium circulates in the heat dissipation hole 3 to take away the heat on the wire bonding frame 100 .
[0063] Specific...
Embodiment 2
[0084] The structure of this embodiment is similar to that of Embodiment 1, the only difference is that: Figure 11 shown (see attached Figure 4 ) The heat dissipation pipe 7 in the heat dissipation hole 3 of this embodiment is a pipe body structure with one end open and the other end sealed. In this embodiment, the heat dissipation pipe 7 has an open end 71 and a sealing end 72 which are arranged oppositely, the open end 71 is adjacent to the support surface 11, and a partition 4 is arranged inside the heat dissipation pipe 7, and the partition 4 divides the interior of the heat dissipation pipe 7 into For the two chambers 5 , the partition plate 4 is spaced from the sealing end 72 to form a communication port 6 connecting the two chambers 5 . This design allows the heat dissipation medium to enter and exit from the same side of the heat dissipation pipe 7, that is, after the heat dissipation medium is introduced on the side where the support surface 11 is located, after th...
Embodiment 3
[0087] In this embodiment (the reference numerals continue to use the appended Figure 4 with Figure 8 ) is similar to the structure of Embodiment 1, the difference is only that: this embodiment cancels the heat dissipation pipe 7 in the heat dissipation hole 3, directly sprays an insulating layer on the inner wall of the heat dissipation hole 3, and utilizes the insulation layer to insulate and isolate the heat dissipation medium and the welding wire of the metal The frame 100 ensures heat dissipation while preventing conduction of the heat dissipation medium.
[0088] Eliminating the heat pipe 7 can effectively reduce the manufacturing cost, and the method of spraying the insulating layer is simple and low in cost, and occupies a small space, which greatly reduces the weight of the three-dimensional discrete device.
[0089] Preferably, a partition plate can be directly arranged in the cooling hole 3, and the cooling hole 3 is divided into two independent chambers by the p...
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