Failure detection method and device for integrated circuit

Abstract

The invention relates to an integrated circuit failure detection method and device. The method comprises the steps that a first image of a to-be-detected integrated circuit is acquired, the to-be-detected integrated circuit comprises at least one to-be-detected metal wire, and the first image comprises an image of the to-be-detected metal wire; a detection probe is used for making contact with the metal wire, a second image of the to-be-detected integrated circuit making contact with the detection probe is obtained, and the second image comprises the image of the metal wire in the first image; and determining the failure condition of the to-be-detected integrated circuit according to the first image and the second image. Therefore, the internal failure condition of the integrated circuit can be detected only through the change of the image, the detection method is convenient and simple, the internal failure condition of the integrated circuit can be preliminarily detected through the interconnection condition of the upper layer of the integrated circuit without grinding the integrated circuit to the layer to be detected, and the efficiency is higher.

Description

technical field [0001] The present application relates to the technical field of semiconductor inspection, and in particular, to a method and device for detecting failure of an integrated circuit. Background technique [0002] With the development of integrated circuit technology, the manufacturing process of integrated circuits is getting higher and higher, more and more components are integrated on integrated circuits, and the circuits are more and more complex. In addition, people have higher and higher requirements for the reliability of integrated circuits. In order to make integrated circuits become more and more complex while still meeting reliability requirements, it is necessary to perform failure detection on integrated circuits. Through failure detection, integrated circuit designers can find design defects and process parameters. mismatches or improper design and operation. Therefore, how to perform failure detection on integrated circuits is a problem that nee...

AI Technical Summary

Problems solved by technology

[0004] However, when testing the interconnection structure inside the integrated circuit, the testing method of the traditional technology needs to grind the multi-layer stacked integrated circuit to the layer that needs to be tested, so as to determine whether the integrated circuit is reliable. When many layers are stacked, such a test method needs to grind off every layer above the layer to be tested, resulting in low test efficiency

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