Multi-level message caching device and method for distributed communication equipment
A distributed communication and message caching technology, applied in the communication field, can solve the problem that the single-chip cache capacity cannot meet the demand, and achieve the effect of expanding the packet cache capacity, solving the cache bottleneck and reducing the equipment cost.
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Embodiment 1
[0042] In this embodiment, a plurality of chips with different functions are used to form a multi-level cache, and the multi-level flow control is triggered through the linkage among the multiple chips, so as to expand the packet cache capacity of the single board card.
[0043] like figure 1 As shown, it is a schematic diagram of the chip connection of the apparatus for multi-level message buffering of distributed communication equipment provided in this embodiment in a typical communication equipment service board card. In the device provided in this embodiment, each single board is connected by multi-level chips, including a TM chip 1 , and at least one group of PP chips 2 and PIC chips 3 . Each group of PP chips 2 and PIC chips 3 are serially connected and connected to an interface of the TM chip 1 to complete packet parsing and processing and physical interface sending and receiving. Each PP chip 2 and PIC chip 3 are connected in parallel to realize the processing and fo...
Embodiment 2
[0059] On the basis of the apparatus for multi-level message buffering of distributed communication equipment provided in the above-mentioned Embodiment 1, the present invention also provides a method for carrying out message buffering by the above-mentioned apparatus.
[0060] like Figure 4 As shown, the specific steps of the method for multi-level packet buffering of a distributed communication device provided by the embodiment of the present invention are as follows:
[0061] Step 101: Use the TM chip in the apparatus for multi-level message buffering of the distributed communication equipment provided in Embodiment 1 to connect to the switching network.
[0062] Using the apparatus provided in Embodiment 1, multi-level chip connection is implemented on the service board of the distributed equipment. like Figure 5 Shown: The TM chip is connected to the switching network, which is used for traffic management of the entire service board. The PP chip is used in the front-...
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