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Problems solved by technology
In such ebullient cooling devices 500, there is a problem that it is necessary to carry out a design suitable for the required heat dissipation performance, taking into account various conditions such as the pressure loss of the refrigerant and the distance from the core of the ventilation resistance of each ebullient cooling device 500. set up
In addition, in the case of the ebullient cooling device 500 having such a structure, there is a problem that if the refrigerant container 510 is close to the water tank 560 and the distance between the tubes 540 is narrow, it is difficult to insert the connection jig, and complicated installation is required. Operation
Method used
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Embodiment 1
[0047] figure 1 It is an exploded perspective view of the heat dissipation part (condensing part 4 and heat sink 5). figure 2 It is a perspective view showing a state in which the heat sink is assembled.
[0048] The boiling cooling device 1 of the present embodiment cools the heating element (not shown) by moving the latent heat generated by the boiling and condensation of the refrigerant, such as image 3 As shown, the apparatus consists of a boiling part 2 on which a heating element is installed, a condensing part 4 connected by the boiling part 2 and the pipes 3 ( 3A, 3B), and a heat sink 5 . In addition, the condensation part 4 and the cooling fins 5 are connected by figure 2The assembly shown constitutes the heat sink.
[0049] The material used for the boiling part 2, the condensing part 4, and the pipes 3 (3A, 3B) of the boiling cooling device 1 is, for example, aluminum, and after assembling each part, it is manufactured by integral welding.
[0050] The boilin...
Embodiment 2
[0067] Figure 4 It is a perspective view which shows the whole shape of the boiling cooling apparatus 1.
[0068] The boiling cooling device 1 of the present embodiment uses an example of a plurality of steam pipes 3A or condensate pipes 3B connecting the boiling part 2 and the condensing part 4 .
[0069] For example, as Figure 4 As shown, by using the three steam pipes 3A, the refrigerant vapor can flow out from the boiling portion 2 more smoothly, so that the refrigerant can be circulated well and the heat dissipation performance can be improved.
Embodiment 3
[0071] Figure 5 A perspective view showing the overall shape of the boiling cooling device 1 .
[0072] In the boiling cooling device 1 of the present embodiment, two outer plates 7 and a plurality of unit plates 6 are stacked to form a closed refrigerant container 10, and the refrigerant is repeatedly boiled and condensed in the refrigerant container 10. An example of composition. That is, the configuration of the condensation unit 4 described in the first embodiment is applied to the refrigerant container 10 .
[0073] In addition, the heat sink 5 is the same as that of the first embodiment, and a plurality of fins are arranged and attached to one outer side plate 7 in parallel. In addition, a heat generating body (not shown) is attached to the surface of the other outer side plate 7B.
[0074] In the present embodiment, by increasing or decreasing the number of unit plates 6 arranged in parallel with respect to the outer plate 7, the configuration of the refrigerant con...
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Abstract
A boiling cooling device, the condensing part 4 is formed by stacking a plurality of unit plates 6 and two outer plates 7, and the unit plates 6 are stacked between the two outer plates 7 along the thickness direction of the plates, and are also stacked along the plane direction. Arrange 3 blocks side by side. The two outer panels 7 are provided so that the overall shape of the three unit panels 6 arranged in parallel has substantially the same size. The cooling fins 5 are provided such that the width of the substrate 5a is approximately equal to the width of the unit plate 6, and are arranged in parallel with the unit plate 6 with respect to one outer plate 7A. According to this structure, by increasing or decreasing the number of unit plates 6 and the number of heat dissipation fins 5 arranged in parallel with respect to the outer plate 7, it is consistent with the required cooling capacity, and the heat dissipation part (the condensation part 4 and the heat dissipation part 4) can be easily changed. The structure of sheet 5).
Description
technical field [0001] The present invention relates to a boiling cooling device for cooling a heat generating element by the movement of latent heat generated by boiling and condensation of a subrefrigerant. Background technique [0002] Conventionally, when cooling components for electronic equipment such as computers, aluminum heat sinks are often used. However, since the heat generation increases year by year while improving the performance of the components, it is impossible to use heat sinks. [0003] Therefore, a boiling cooling device has been developed that transfers the heat of the element to a refrigerant, and cools the element by moving the latent heat generated by the boiling and condensation of the refrigerant. [0004] As an example of a boiling cooling apparatus using this refrigerant, there is Japanese Patent Laid-Open No. 10-308486. The boiling cooling device reported in this gazette is as follows: Figure 7 As shown, a refrigerant container 100 formed by ...
Claims
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