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Communication base plate connection unit for smart card processing apparatus

A technology of a communication substrate and a connecting unit, which is applied in the field of improvement of the connecting unit of the communication substrate, and can solve the problems of high cost, trouble and the like

Active Publication Date: 2004-09-08
ASAHI SEIKO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

this is very troublesome
And it's expensive since it's made in various types

Method used

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  • Communication base plate connection unit for smart card processing apparatus
  • Communication base plate connection unit for smart card processing apparatus
  • Communication base plate connection unit for smart card processing apparatus

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0027] FIG. 1 is a perspective view of a contactless card processing apparatus of an embodiment of the present invention. figure 2 is a perspective view of the main part of this embodiment. Fig. 3 is an exploded perspective view of the communication substrate connection unit of the embodiment of the present invention. Figure 4 is a cross-sectional view of the contactless card processing device of this embodiment. Figure 5 is a schematic sectional view of the card processing device of this embodiment.

[0028] In this embodiment, the card moves horizontally, but the moving direction is not limited to horizontal. The card processing device 10 for a contactless smart card includes a card receiving unit 12 , a magnetic card processing unit 14 , a communication substrate connection unit 16 and a card transfer unit 18 .

[0029] The card processing device 10 includes a side frame 28 comprising side frames 20 and 22 with a predetermined distance therebetween and braces 24 and 26...

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Abstract

Provided is the communication substrate mounting device of an IC card processor capable of easily using different IC cards or the communication substrates of different makers, and to provide the communication substrate mounting device of an IC card processor capable of mounting different IC cards or the communication substrates of different makers at low costs, and to provide the collecting device of IC cards using the communication substrate mounting device of a non-contact IC card processor capable of mounting different non-contact IC cards or the communication substrates of different makers. In this non-contact IC card processor where a communication substrate mounting device with a non-contact IC card is arranged along the carriage path of the non-contact IC card, the communication substrate mounting device is provided with a first base and a second base configured so as to be attachable / detachable for the first base, and equipped with a first communication substrate mounting part and a second communication substrate mounting part.

Description

technical field [0001] The present invention relates to an improvement of a card processing device for a contactless smart card. In particular, the present invention relates to an improvement of a communication substrate connection unit of a contactless smart card processing device. More particularly, the present invention relates to an improvement of a communication substrate connection unit of a contactless smart card processing device having a card recovery device. Background technique [0002] Generally, a smart card processing device reads and writes information of a contactless smart card and communicates through an antenna (see Japanese Laid-Open Patent No. 2000-137772). Multiple antennas are used in other prior art. In the prior art, an antenna located at the most suitable position is used (see Japanese Laid-Open Patent No. 11-120304). These prior technologies communicate with the smart card through an antenna. [0003] In the contactless smart card, it is roughl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K17/00G06K13/08
CPCG06K13/08G06K17/00
Inventor 安部宽榎本稔
Owner ASAHI SEIKO CO LTD
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