IC design to optimize manufacturability

An integrated circuit and manufacturability technology, applied in CAD circuit design, computer-aided design, calculation, etc., can solve the problems of not providing the selection of manufacturability-related factors, and not being able to extract or use manufacturability features
CN1839389AInactive Publication Date: 2006-09-27PDF SOLUTIONS INC

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
PDF SOLUTIONS INC
Publication Date
2006-09-27
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

Library design elements (102) are analyzed for manufacturability to be used in designing an IC chip to be manufactured using a particular manufacturing process. The library design elements from a library are obtained. Manufacturability attributes (104) of the library design elements are determined for the particular manufacturing process, where manufacturability attributes include yield-related attributes. Library views (106) with manufacturability attributes for the library design elements are then generated, which are utilizing by an electronic design automation (EDA) tool.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to integrated circuit design, and more particularly, to integrated circuit design that optimizes manufacturability. Background technique

[0002] The design of an integrated circuit (IC) chip consists of discrete design elements, also known as intellectual property (IP) elements, of various sizes and complexities. The smallest component is often called a standard cell. Larger assemblies of elements can be interconnected to produce complete functions, commonly referred to as blocks. Multiple blocks are interconnected to produce the fabricated IC chip.

[0003] In order to design an IC chip, for a given manufacturing process, it is necessary to produce an assembly of such cells or blocks consistent with the particular manufacturing process, while providing a variety of functional and performance options that allow the designer to design and optimize a given IC chip. The assemblies of these units and blocks produced for a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More