This invention belongs to the interdisciplinary fields of advanced
electronic packaging, high-frequency interconnect modeling, and
electronic design automation. Specifically, it relates to a method and
system for predicting the
electrical performance of high-frequency interconnect structures based on joint supervision of auxiliary theoretical quantities and online consistency scoring. The aim is to address the problems of existing high-frequency interconnect structure
electrical performance prediction methods, which only directly regress target parameters and lack theoretical supervision and online reliability
verification mechanisms. The method includes: determining the target
electrical performance parameters and at least two types of auxiliary theoretical quantities whose theoretical values can be directly calculated from the
input design parameters; constructing a ternary sample dataset of
input design parameters—target electrical performance parameters—auxiliary theoretical quantities; establishing a dual-
branch joint supervision model including a shared feature encoding unit, a main prediction
branch, an auxiliary theoretical
branch, and a physical consistency scoring module; constructing a joint
loss function for model training; and outputting the target electrical
performance prediction value, the auxiliary theoretical quantity prediction value, and the consistency
score, confidence level, or risk warning during the online
inference stage. The
system includes a data preprocessing module, an auxiliary theoretical quantity calculation module, a joint supervision model construction module, a model training module, an online
inference module, a physical consistency scoring module, a result interface module, and a
model management and update module. This invention can improve the stability, physical consistency and
engineering reliability of prediction results while maintaining the ability to quickly predict the electrical performance of high-frequency interconnect structures. It is applicable to the rapid evaluation and auxiliary design of advanced packaging, packaging substrates,
printed circuit board transmission lines and on-
chip or inter-
chip high-frequency interconnect structures.