Structure and process for packaging RF MEMS and other devices

a technology of mems and other devices, applied in the field of packaging of mems (micro electro mechanical system) devices and other devices, can solve the problems of difficult sealing of inability to anode glass caps to substrates, and inability to realize mems-based systems. achieve the effect of improving the structure and process of packaging

Inactive Publication Date: 2006-09-21
THE BOARD OF TRUSTEES OF THE UNIV OF ARKANSAS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This approach results in packaged RF MEMS devices with high bandwidth, low electrical losses, and integral mechanical strength, suitable for RF applications, while maintaining economical fabrication and adaptability to various substrates, achieving low insertion loss and high Q factor.

Problems solved by technology

While MEMS technology has progressed rapidly, barriers to packaging, and costs, have hindered widespread realization of MEMS-based systems.
Bringing leads out on the top surface of a silicon substrate, for example, creates topography that makes sealing of a cap to the substrate difficult and that makes anodic bonding of a glass cap to the substrate impossible.

Method used

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  • Structure and process for packaging RF MEMS and other devices
  • Structure and process for packaging RF MEMS and other devices

Examples

Experimental program
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Embodiment Construction

[0032] A preferred embodiment of a structure and process for packaging RF MEMS devices (and other devices) in accordance with the invention will now be described with reference to the drawings.

[0033]FIG. 1 shows a silicon wafer substrate 10 on which a plurality of MEMS devices 12 (two being shown in the illustration) are fabricated by conventional techniques. Blind vias 14 that extend from an upper surface of the substrate are formed by conventional techniques, and are insulated, as by depositing silicon dioxide (not shown) in the vias by conventional techniques. The vias may extend 100 um into the silicon substrate, for example. At least some of the vias are then filled with a metal 16, such as copper, for example, by conventional plating, for example. Some of the vias can provide electrical connections to the MEMS devices. Other vias can provide photonic or fluidic interfaces, for example. The terms “upper” and “lower” are used herein merely to relate opposite surfaces and are no...

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Abstract

A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.

Description

BACKGROUND OF THE INVENTION [0001] This invention is concerned with the packaging of MEMS (Micro Electro Mechanical System) devices and other devices. Typically, MEMS are micromachines that may include elements, sensors, actuators and electronics on a common silicon or other substrate. [0002] MEMS technology is sometimes referred to as the next semiconductor revolution. For scientists and system engineers it brings unique and timely opportunity to integrate various functions such as electrical, optical, fluidic, etc. and is part of next-generation “multi-functional systems (MFS)”. MEMS technology has seen a significant surge in the past decade, and MEMS devices are finding applications in many strategic as well as consumer fields. While MEMS technology has progressed rapidly, barriers to packaging, and costs, have hindered widespread realization of MEMS-based systems. [0003] Packaging of MEMS is an area of intense interest for the past few years and will be of greater importance in ...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L21/00H01L21/4763B81B7/00H01L21/44H01L21/50H01L23/02H01L23/12H01L23/14H01L23/31H01L23/498
CPCB81B2207/096B81C1/00301B81C1/00333B81C2203/0118H01L23/147H01L23/3128H01L23/49827H01L2221/68377H01L2924/0002H01L2924/00
InventorSCHAPER, LEONARD W.MALSHE, AJAY P.O'NEAL, CHAD
OwnerTHE BOARD OF TRUSTEES OF THE UNIV OF ARKANSAS