Ultrasonic tool and ultrasonic bonder

a technology of ultrasonic bonding and ultrasonic tool, which is applied in the direction of manufacturing tools, solventing apparatus, cooking vessels, etc., can solve the problems of unstable bonding quality, increased steps and costs, and up to about 60% of applied energy transmitted, so as to improve the durability of ultrasonic tools and the energy transmission rate of ultrasonic bonding

Inactive Publication Date: 2006-10-19
FUJITSU LTD
View PDF13 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The chromium oxide coating significantly improves energy transmission rates by up to 20% and enhances the shearing strength of ultrasonic bonds, reducing tool damage and production costs while maintaining product quality.

Problems solved by technology

When the ultrasonic energy is applied while pressing the electronic part as described above, however, only up to about 60% of the applied energy is transmitted to the electronic part when a conventional ultrasonic tool is used.
Under such circumstances, the ultrasonic tool had to be removed and regenerated before the development of damage, requiring an increased number of steps and costs.
Besides, due to a large loss in the energy transmission, the bonding quality is not stable.
If the surfaces are simply roughened, however, the surfaces of the electronic parts are damaged, and the mass-production thereof is hindered.
However, such a coating does not make it possible to improve both the energy transmission rate in ultrasonic bonding and the durability of an ultrasonic tool.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrasonic tool and ultrasonic bonder
  • Ultrasonic tool and ultrasonic bonder
  • Ultrasonic tool and ultrasonic bonder

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0048] The ultrasonic tool of the invention will now be described with reference to FIGS. 2 to 4.

[0049]FIG. 2 schematically shows the construction of an ultrasonic bonder incorporating the ultrasonic tool according to the first embodiment of the present invention together with an electronic part for easy comprehension of the operation at the time of bonding.

[0050] The ultrasonic bonder 10 shown in the drawing comprises an ultrasonic tool 20, for effecting the bonding, in contact with an electronic part or the like, an oscillator 11 which is a source of ultrasonic oscillation, boosters 12 for controlling the amplitude of ultrasonic waves produced by the oscillator 11, a horn 13 for transmitting the ultrasonic waves from the boosters 12 to the ultrasonic tool 20 while maintaining a true sinusoidal waveform, and a horn holder 14 for mounting the horn 13 on an installation. A power source for supplying electric power to the oscillator 11 is not shown in the drawing.

[0051] For the ultr...

second embodiment

[0068] The ultrasonic tool of the invention will now be described with reference to FIGS. 5A to 5D.

[0069] First, in the same manner as in the first embodiment, the coating surface of a base material 21 of, for example, a stainless steel having a rectangular parallelopiped shape measuring, for example, 12 mm long and 1 mm thick and having a vacuum adsorption hole 22 of a diameter of, for example, 5 mm at the central portion thereof, is cleansed by dewaxing, washing with an alkali, and washing with an acid or the like (FIG. 5A).

[0070] Referring to FIG. 5B, the base material 21 is then immersed in a solution containing a chromium compound, such as a compound of hexavalent chromium, as well as ceramic particles, so that at least the coating surface layer of the base material 21 is impregnated with the chromium compound containing ceramic particles, the chromium compound and the ceramic particles being indicated by reference numerals 23 and 27, in the drawing, respectively.

[0071] The c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
temperatureaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the materials through another face of the one of the materials, wherein the ultrasonic tool has a coating layer comprising chromium oxide as a main component formed on at least the surface of the tool that is in contact with the face of the one of the materials through which the ultrasonic waves are applied to the one of the materials. An ultrasonic bonder provided with the ultrasonic tool is also disclosed.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is related to and is a Divisional of, and claims priority to, U.S. patent application entitled ULTRASONIC TOOL AND ULTRASONIC BONDER, having Ser. No. 09 / 995,569, by Fujitsu Limited, Kawasaki, Japan, filed on Nov. 24, 2004 and incorporated by reference herein. This application also claims the benefit of Japanese Patent Application No. 2003-396606, filed on Nov. 27, 2003, the disclosure of which is incorporated by reference herein.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to an ultrasonic tool and an ultrasonic bonder. More specifically, the invention relates to an ultrasonic tool and an ultrasonic bonder having a feature, in its constitution, for improving the durability of the ultrasonic tool attached to an end of an ultrasonic bonder for flip-chip-bonding a semiconductor device or another electronic device, as well as for improving the efficiency for transmitting ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(United States)
IPC IPC(8): A47J36/02B23K1/06B23K20/10H01L21/60H01L21/607
CPCB23K1/06B23K20/10H01L2924/014H01L2924/01074B23K20/106H01L24/75H01L24/81H01L2224/13144H01L2224/16237H01L2224/75H01L2224/81801H01L2224/83192H01L2924/01013H01L2924/01029H01L2924/01078H01L2924/01079H01L2924/01082H01L2924/01088H01L2924/04941H01L2224/16225H01L2924/01006H01L2924/01024H01L2924/01033H01L2924/01042H01L2924/00H01L2224/05573H01L2224/05568H01L2224/05647H01L24/05H01L2924/00014
InventorTAKEUCHI, SHUICHIKIRA, HIDEHIKOOZAKI, YUKIO
OwnerFUJITSU LTD