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High density data storage device and data recording or reproduction method using the same

Inactive Publication Date: 2008-02-28
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0015]Accordingly, the present invention provides a high density data storage device capable of operating without contact between a recording medium and a probe so that it is possible to remove the instability of recording or reproduction caused by contact between the recording medium and the probe, and to stably record or reproduce data in or from the recording medium without errors.
[0016]According to an aspect of the present invention, there is provided a method for recording or reproducing high density data, wherein data in or from a recording medium can be recorded or reproduced without contact between the recording medium and a probe so that it is possible to stably record or reproduce high density data without errors in a high density data storage device which uses the recording medium and the probe.
[0024]According to another aspect of the present invention, there is provided a high density data recording or reproduction method comprising both a recording medium formed as a thin film on a substrate and a probe moving with a spacing from a surface of the recording medium, the method comprising: moving the probe with the spacing from the surface of the recording medium; applying first and second voltages of different magnitudes to the probe, thereby emitting heat from a tip of the probe; and changing an amount of the heat emitted from the tip of the probe due to heat conduction characteristic of the recording medium below the probe, thereby causing a resistance change in the tip to be detected by the voltage applied to the probe.
[0025]According to another aspect of the present invention, there is provided a high density data recording or reproduction method comprising both a recording medium formed as a thin film on a lower electrode and a probe moving with a spacing from a surface of the recording medium, the method comprising: moving the probe with the spacing from the surface of the recording medium; changing the surface electric field of the recording medium due to resistance of the recording medium in a state where a voltage has been applied between the probe and the lower electrode, thereby altering the resistance of a tip of the probe; and applying first and second voltages of different magnitudes to the probe, thereby causing a resistance change in the tip to be detected.

Problems solved by technology

However, since the solid-state memory device only has a capacity of several tens of GB, it is difficult to use the solid-state memory device as a large scale data storage device.
However, it is expected that it would be difficult to achieve magnetic recording densities of more than the several tens of GB.

Method used

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  • High density data storage device and data recording or reproduction method using the same
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  • High density data storage device and data recording or reproduction method using the same

Examples

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Embodiment Construction

[0031]Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0032]FIG. 2 is a sectional view of a high density data storage device in accordance with a first exemplary embodiment of the present invention.

[0033]As illustrated in FIG. 2, the high density data storage device of the exemplary embodiment of the present invention comprises a recording medium 200 and a probe 100. The recording medium 200 is formed as a thin film made from phase change material on a substrate (not shown), and a probe 100 has a tip 140 formed in a lower portion thereof, which moves with a spacing from the top of the recording medium 200.

[0034]It is preferred that the probe 100 is controlled by a controller (not shown) connected thereto so that it is spaced apart from the surface of the recording medium 200 and can move between all data recording positions on the surface of the recording medium.

[0035]The probe 100 used for the exemplary embod...

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Abstract

A high density data storage device and a data recording or reproduction method using the same, which can record or reproduce high density data without contact, thereby preventing data errors due to contact are provided. The high density data storage device uses a recording medium and a probe. The recording medium is a thin film made from phase change material or oxide resistance change material, and the probe has a tip formed in a lower portion thereof, which moves with a spacing from the top of the recording medium. Further, recording or reproduction of data is performed through electric field or heat emission, which is generated in the tip of the probe, without direct contact between the recording medium and the probe, so that it is possible to remove instability caused by contact between the recording medium and the probe and to stably record or reproduce data in or from the recording medium without errors.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS[0001]This application claims priority from Korean Patent Application No. 10-2006-0080530, filed on Aug. 24, 2006, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]Methods and apparatuses consistent with the present invention relate to a high density data storage device and a data recording or reproduction method using the same, and more particularly to a high density data storage device and a data recording or reproduction method using the same, which can record or reproduce high density data without contact, thereby preventing data errors due to contact.[0004]2. Description of the Related Art[0005]With the development of Internet-related technology, there is an increased demand for both a recording medium capable of recording mass storage information including moving pictures and means for freely carryi...

Claims

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Application Information

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IPC IPC(8): G11B9/04
CPCB82Y10/00G11B9/149G11B9/1409G11B9/04G11B9/14
Inventor HONG, SEUNG BUMJUNG, JU HWANKO, HYOUNG SOO
Owner SAMSUNG ELECTRONICS CO LTD
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