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Multiply built up buffer structure and manufacturing method thereof

a buffer structure and manufacturing method technology, applied in packaging, paper/cardboard containers, packaging, etc., can solve the problems of increasing transportation costs resulting from bulkiness, insufficient etc., and achieves excellent resistance to pressure, drop, impact, and the applicability of high-stacked products

Inactive Publication Date: 2010-10-14
LIU HSING CHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]A first objective of the present invention is to provide a multiply built up buffer structure and a manufacturing method thereof, wherein a unique structural design and a multiple-structured arrangement are employed to provide improved resistance against pressure, drop, and impact between a package box and a product-to-be-protected so as to realize excellent strength of pressure resistance and applicability of high stacking of the packaged products. With a telescopic structure provided by the present invention makes it possible to apply to various sizes of products to be protected to thus realize reduction of costs and conservation of natural resources.
[0008]A second objective of the present invention is to provide a multiply built up buffer structure and a manufacturing method thereof, wherein with the improved resistance against pressure, drop, and impact that the present invention offers, the thickness of the buffer structure can be made small, and further, buffer members, end caps, and even stop blocks can be made with the same mold, leading to further reduction of costs and better conservation of resources.
[0009]A third objective of the present invention is to provide a multiply built up buffer structure and a manufacturing method thereof, wherein an elongate stop block is selectively set in an encasing channel of the buffer structure, the applicability of the buffer structure is made wide.
[0010]A fourth objective of the present invention is to provide a multiply built up buffer structure and a manufacturing method thereof, wherein the buffer structure 100 is made of paper material comprising base paper, such as corrugated boards, rather than being formed with pulp molding, and thus effects of such as generating no odor, being humidity resistant, being temperature durable, and being suitable for maritime transportation, can be realized. Other advantages, such as small size, occupying less container space, reducing transportation costs, meeting requirement of environmental protection, are also offered.
[0012]As such, improved resistance against pressure, drop, and impact is provided between a package box and a product to be protected. Further, with the extendible structure, the buffer of the present invention is applicable to various sizes of products to be protected to provide excellent strength of pressure resistance and allows for high stacking of packaged products, reduction of costs and non-wasting of resources.

Problems solved by technology

Conventional buffering materials are often made of Styrofoam, which is known to be non-environment-conservative, bulky, and having drawbacks of occupying a large amount of container space and increasing transportation costs resulting from bulkiness thereof.
Other disadvantages, such as insufficient resistance against pressure, drop, and impact, are often found.
The conventional buffer 900, however, has the following disadvantages: (1) insufficient resistance against pressure, drop, and impact; (2) requiring a devoted mold and unique material for manufacturing for each specific product to be protected thereby, apparently leading to excessively high costs and a waste of natural resources; (3) potential risk of generating odors in a humid and high temperature condition (such as being stored in a container for maritime transportation) due to the fact that the buffer 900 is made of pulp molding; (4) poor resistance against humidity and temperature and thus being not suitable for maritime transportation; and (5) insufficient resistance against pressure, making it impossible to be high stacked for after-packaged stacking.

Method used

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  • Multiply built up buffer structure and manufacturing method thereof
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  • Multiply built up buffer structure and manufacturing method thereof

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Embodiment Construction

[0025]The present invention provide a multiply built up buffer structure and a manufacturing method thereof for substituting the conventional Styrofoam-molded buffers or pulp-molding buffers to provide various effects of pressure resistance, drop resistance, and impact resistance between a package box and a product-to-be-protected.

[0026]Referring to FIGS. 2-4, a buffer structure constructed in accordance with the present invention, generally designated at 100, comprises at least two buffer members 1 and a pair of end caps 2 and preferably further comprises at least one stop block 3.

[0027]The buffer members 1 are made of paper material, such as corrugated boards, and are each of an elongate strip configuration having a U-shaped cross-section. Each buffer member 1 forms a hollow chamber 10 arranged in a U-shape to correspond to the U-shaped configuration of the buffer member 1. The hollow chamber 10 extends between and completely through opposite ends of the buffer member 1. One of th...

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Abstract

The present invention provides a multiply built up buffer structure and a manufacturing thereof. The buffer structure includes at least two buffer members and a pair of end caps. The buffer member is made of paper material, having an elongate strip configuration having a U-shaped cross-section forming a hollow chamber shaped to correspond to the configuration thereof. The hollow chamber extends between and completely through opposite ends of the buffer member. One of the buffer members is movably received in the hollow chamber of the other buffer member to form an extendible strip. The end cap is made of paper material, having a U-shaped configuration forming therein a hollow chamber corresponding in shape to the configuration thereof. The hollow chamber extends between and completely through opposite ends of the end cap. The hollow chamber of the end cap receives at least one reinforcement piece made of paper material therein. The pair of end caps is respectively and movably fit into opposite ends of the extendible strip in accordance with the hollow chambers of the respective buffer members.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a multiply built up buffer structure and a manufacturing method thereof, and in particular to a buffer structure and the manufacturing method thereof, which is used to encase a product to be protected for providing effects of resisting pressure, drop, and impact between a package box and the product to be protected and is applicable to electric appliances, computers, various kinds of monitor screen, electronic products, mechanical products, and other fragile products.BACKGROUND OF THE INVENTION[0002]To convey or ship a product to be protected, such as electric appliances, computers, various kinds of monitor screen, electronic products, mechanical products, and other fragile products, the product is wrapped with an enclosure buffer material to provide buffering effect between a package box and the product to be protected, whereby protections of the product can be secured during the transportation or shipping thereof.[0003]C...

Claims

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Application Information

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IPC IPC(8): B65D81/02
CPCB65D81/053B65D2581/053B65D81/055
Inventor LIU, HSING-CHEN
Owner LIU HSING CHEN