Integrated Semiconductor Outline Package

Abstract

A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.

Description

[0001]This application is a divisional of patent application Ser. No. 12 / 513,906, filed on May 7, 2009, which is a national stage of international application number PCT / SG06 / 00379, filed on Dec. 5, 2006, which applications are incorporated herein by reference.BACKGROUND[0002]This invention relates to an integrated semiconductor outline package and refers particularly, but not exclusively, to a transistor outline package for connection between a printed circuit board (PCB) and a bus bar of a control module of an automobile.[0003]Electrical power distribution systems for automobiles, typically include a control module that provides centralized control of the electronic components of the automobile. A conventional control module includes a junction box, which is commonly referred to as a smart junction box. The junction box includes a housing that contains one or more layers of PCBs, which support semiconductor integrated devices. The control module also includes module connectors to ...

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