Manufacturing method and manufacturing device for electronic component

a manufacturing method and electronic component technology, applied in the manufacture of capacitors, fixed capacitor details, fixed capacitors, etc., can solve the problem difficulty in forming outer electrodes, and achieve the effect of high degree of accuracy

Active Publication Date: 2015-04-23
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This method enables the formation of outer electrodes with high accuracy, improving the connectability of electronic components to substrates and allowing for the simultaneous production of multiple components with reduced processing steps, thereby enhancing the non-defective product rate and efficiency.

Problems solved by technology

However, as described in Japanese Unexamined Patent Application Publication No. 8-236391, in the method in which the outer electrodes are formed by dipping the end portions of the dielectric block in conductive paste, since the portions of the outer electrodes located on the main surface of the dielectric block are formed by wetting of the end portions with conductive paste, it has been difficult to form the outer electrodes with a high degree of accuracy.

Method used

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  • Manufacturing method and manufacturing device for electronic component
  • Manufacturing method and manufacturing device for electronic component
  • Manufacturing method and manufacturing device for electronic component

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Embodiment Construction

[0034]Hereinafter, preferred embodiments of the present invention will be described with reference to drawings, and hence the present invention will be clarified.

[0035]FIG. 1 is a schematic perspective view of an electronic component manufactured according to the present preferred embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view when being cut along the length direction of the electronic component. First, with reference to FIG. 1 and FIG. 2, an electronic component will be described in detail that is manufactured by a manufacturing device for an electronic component according to the present preferred embodiment.

[0036]An electronic component 1 illustrated in FIG. 1 is a ceramic electronic component including a ceramic dielectric block 10 having optical transparency. For example, the electronic component 1 may be a ceramic capacitor, a ceramic piezoelectric element, a ceramic thermistor, a ceramic inductor, or other suitable electronic component, for...

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Abstract

A manufacturing method for an electronic component forms with a high degree of accuracy a portion of an outer electrode on a main surface of a dielectric block. Light irradiated from a second main surface side is detected by a detector disposed on a first main surface side, thereby detecting the positions of first and second inner electrodes, and a conductive layer is formed in a portion on a first main surface, determined based on the detection result by the detector, thereby forming first portions of individual first and second outer electrodes.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a manufacturing method and a manufacturing device for an electronic component, and, in detail, relates to a manufacturing method and a manufacturing device for an electronic component in which a portion of an outer electrode is formed and located on a main surface.[0003]2. Description of the Related Art[0004]In recent years, for example, as an electronic component capable of being downsized, there has been widely used such a chip-type laminated ceramic electronic component as described in Japanese Unexamined Patent Application Publication No. 2007-294839. Usually, the chip-type laminated ceramic electronic component includes a dielectric block and a first outer electrode and a second outer electrode, provided on an end surface of the dielectric block. In view of the connectability between an electronic component and a substrate, usually, each of the first outer electrode and the second o...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H05K13/00H05K3/12H01G4/12H01G4/30H01G13/00
CPCH05K3/12H05K13/0023H01F17/0013H01G4/0085H01G4/12H01G4/232H01G4/30H01G13/006Y10T29/435Y10T29/5313Y10T29/53217Y10T29/53243H01G4/248H01G13/00H05K13/00
InventorTSUTSUMI, HIRONORI
OwnerMURATA MFG CO LTD