156results about "Terminal applying apparatus" patented technology

This invention discloses a surface-mount solid aluminum electrolytic capacitor and its manufacturing method, comprising a capacitor core package, which includes N capacitor cores, N+1 conductive metal meshes, a substrate, anode leads, cathode leads, and a silver paste covering tape. The capacitor core package is encapsulated and electroplated to form a solid aluminum electrolytic capacitor. The capacitor core includes an anode portion, a cathode portion, and an insulating barrier tape. In this invention, the conductive metal mesh sandwiched between the metal pads in the anode portion of the capacitor core and the cathode portion of the capacitor core can achieve the flatness of the core package. The silver paste covering tape located on the side of the cathode portion of the core package is embedded in the gap formed between two adjacent capacitor cores due to the conductive metal mesh sandwiched, forming an integrated connection. This prevents the resin encapsulant from being squeezed into the core layers during encapsulation, preventing core deformation damage that could lead to increased leakage current and increased ESR. Furthermore, it can prevent insufficient capacitance or even capacitor failure caused by delamination between cores.

A multi-layered capacitor including a capacitor body including a dielectric layer and an internal electrode; and an external electrode disposed on an outer side of the capacitor body, wherein the dielectric layer includes a plurality of dielectric crystal grains, and the dielectric crystal grains include a core containing BaTiO3, a first shell disposed on the core and containing BaTiO3 doped with a first doping element of Sr, Ca, Bi, K, Na, or a combination thereof, and a second shell disposed on the first shell and containing a first coating element of Nb, Ta, or a combination thereof.

A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer includes a plurality of dielectric grains, and wherein the plurality of dielectric grains include one or more first dielectric grains in which a sum of lengths of defects in a dielectric grain is 150 nm or more.

This invention relates to the field of capacitor technology, and in particular to a capacitor production equipment, comprising a machine base, a conveying device, a clamping device, a straightening device, and a lead insertion device. The machine base is equipped with a feeding machine; the conveying device is located on the machine base; the clamping device is located on the machine base and is used to transfer elements from the feeding machine to the conveying device, separating the leads of the elements during the transfer; the straightening device is located on the machine base and is used to straighten tilted elements on the conveying device; the lead insertion device is located on the machine base and is used to insert the leads of the elements conveyed by the conveying device into caps. This capacitor production equipment uses automated means to insert the leads of elements into caps, achieving a high degree of automation and high efficiency, making it highly worthy of promotion.

The invention provides a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes: a capacitor body including a dielectric layer and an inner electrode layer; and an outer electrode disposed on an outer surface of the capacitor body, in which the inner electrode layer includes nickel (Ni), and a space lattice side length of the nickel (Ni) obtained according to Formula 1 by X-ray diffraction (XRD) analysis on the inner electrode layer is about to about [Formula 1] in Formula 1, lambda is a wavelength of a Cu K alpha ray, values of lambda are h, k and l are crystal plane indexes, and theta is a Bragg angle.

A ceramic electronic component according to an embodiment of the present invention includes an element body including a capacitive part in which a plurality of dielectric layers containing a ceramic as a main component and a plurality of internal electrode layers are laminated on each other. All elements of Al or Cr, Fe, and Si are present in the capacitive part, and at least one of these elements is precipitated in the internal electrode layers.

Provided is a capacitor that is lightweight yet can reduce moisture absorption. The capacitor comprises a capacitor element and a protective film. The capacitor element has a first end-face electrode, a second end-face electrode, and an outer peripheral surface. The second end-face electrode exists at the side opposite to the first end-face electrode. The outer peripheral surface exists between the first end-face electrode and the second end-face electrode. The protective film has a first protective part, a second protective part, and a third protective part. The first protective part protects the peripheral edge part of the first end-face electrode. The second protective part protects the peripheral edge part of the second end-face electrode. The third protective part is connected to the first protective part and the second protective part, and protects the outer peripheral surface.

To provide a reliable multilayer electronic component and a method of manufacturing the same.SOLUTION: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The dielectric layer includes a plurality of dielectric crystal grains. The dielectric crystal grains include one or more first dielectric crystal grains in which a sum of lengths of defects in a dielectric crystal grain is 150 nm or more.SELECTED DRAWING: Figure 10

The invention discloses a wafer capacitor adopting a carbon fiber pin and a production process and production equipment thereof. The wafer capacitor comprises a wafer capacitor body, a silver electrode and the carbon fiber pin. The production process comprises the steps of adsorbent preparation, carbon fiber wrapping with the adsorbent, pre-reduction reaction, insulation layer wrapping and wafer capacitor preparation. The production equipment comprises a lifting pool, a silver ion soaking pool, a phosphorous acid soaking pool, a hot extrusion mechanism, an extruder and a laser welding unit. According to the method, carbon fibers are wrapped with an adsorbent with high silver adsorption, a porous conductive carbon fiber structure with a nano-silver wire network is produced through pre-reduction of a reducing agent and a high-temperature reducing atmosphere reaction, and tin-free welding is carried out on a high-silver-content modified carbon fiber pin and silver on the surface of a wafer capacitor through laser welding; and the obtained product has the advantages of light weight, high strength, high conductivity, high welding strength, corrosion resistance, high temperature resistance and the like, so that the wafer capacitor adapts to a severe environment, and the application range is widened.

The invention relates to the technical field of capacitor generation, in particular to an automobile capacitor glue pouring packaging device. An automobile capacitor glue pouring packaging device comprises a conveying line used for conveying a capacitor body, a lifting mechanism used for lifting a capacitor to be processed is arranged at the front end of the conveying line, and the lifting mechanism lifts the capacitor to be processed to be equal to the conveying line in height and then transfers the capacitor to be processed into a glue pouring mechanism for glue pouring operation of the capacitor to be processed. And the capacitor after glue filling is transferred to the terminal bending mechanism for terminal bending, the capacitor after terminal bending is transferred to the terminal welding mechanism, the welded capacitor is transferred to the visual detection mechanism, and the capacitor after detection is guided out by the conveying line. A to-be-processed capacitor is lifted by the lifting mechanism to be flush with the conveying line and then is transferred, the to-be-processed capacitor is subjected to glue filling by the glue filling mechanism, shaping by the terminal bending mechanism and connection by the terminal welding mechanism, then the quality is screened by the visual inspection mechanism, qualified products are finally guided out by the conveying line, and packaging is completed.

An intaglio jig (100, 300) for manufacturing an electronic component (10, 200) having an external electrode (30 to 38, 240, 250) by applying a conductive paste (P) to an electronic component body (20, 210) includes an elastic body (110, 310), and a recessed portion (120, 320) that is formed in the elastic body and in which the conductive paste is contained. The recessed portion includes an opening (121, 321) having an opening width (W2, W6) that conforms to a width (W1, W5) of the external electrode, a bottom surface (122, 322) at a predetermined depth (D) from the opening, and at least one protrusion portion (130 to 132, 330) in which a protrusion height (H1, H2) locally protruding from the bottom surface is less than the predetermined depth (D).

The capacitor pin shaping device is characterized by comprising a bottom plate, a movable die is arranged on the left side of the middle of the bottom plate, a fixed die is arranged on the right side of the middle of the bottom plate, the fixed die is fixedly connected with the bottom plate, a clamping groove is formed in the middle of the left side face of the fixed die, an elastic silica gel pad is arranged on the bottom face of the clamping groove, and a clamping piece is arranged in the middle of the right side face of the movable die; the clamping pieces are clamped in the clamping grooves and connected with the clamping grooves in a linear moving mode, shaping air cylinders are arranged at the left end and the right end of the bottom plate, and side dies are arranged at the piston rod ends of the shaping air cylinders. The shaping cylinders, the side die, the movable die and the fixed die are arranged, and the shaping cylinders at the two ends are synchronously and oppositely started, so that automatic shaping of the pin B value of the six-pin capacitor is realized; the first pressing plate and the second pressing plate are adopted to form wedged connection, the front first pressing plate and the rear first pressing plate are driven to linearly move towards the interior of the bottom plate, automatic shaping of the P value of the pins of the six-pin capacitor is achieved, shaping of the P value and shaping of the B value are conducted synchronously, and the shaping work efficiency is greatly improved.

A capacitor may include a stack assembly that may include a plurality of anode plate members, each having an embedded wire. The anode plate members may be separated by at least one cathode foil sandwiched between separator sheets. A conducting member may electrically connect the embedded wires and may have an externally accessible end portion that is hermetically sealed from the interior of the capacitor. A case covers the stack assembly and may be attached to a cover. The case and cover may enclose the stack assembly within an interior area of the capacitor. The at least one cathode foil may be connected to the case. An electrolyte fluid may be disposed within the interior area. A passage may be provided through a central portion of the stack assembly. A tube, surrounded by insulation, may pass through the passage and may be connected to the cover and the case.

A method of forming an integrated component, for example a capacitor or an ionic capacitor, comprising: forming a stacked structure comprising, on a substrate (400, 405, AAO), a bottom electrode, an intermediate layer (420) comprising a layer of dielectric material or a layer of ionic conductor, and a top electrode, wherein forming the top and / or the bottom electrode comprises forming a liner layer (430) of material, and forming a metallic layer (435) on the liner layer, the metallic layer comprising a noble metal, wherein the metallic layer is thicker than the liner layer.

The invention provides a multilayer capacitor and a method of manufacturing the same. The multilayer capacitor includes: a capacitor body including a dielectric layer and an inner electrode; and an external electrode disposed on an outer side of the capacitor body, in which the dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains includes: a core including BaTiO3; a first shell disposed on the core and including BaTiO3 doped with a first doping element, the first doping element being Sr, Ca, Bi, K, Na, or a combination thereof; and a second shell disposed on the first shell and including a first coating element, the first coating element being Nb, Ta, or a combination thereof.

A method for producing a multilayer ceramic capacitor according to the present invention, the multilayer ceramic capacitor being provided with a capacitor main body (1) which is obtained by stacking a plurality of dielectric layers (2), a plurality of first internal electrodes (3) and a plurality of second internal electrodes (4), a first via conductor (5) which is provided within the capacitor main body (1) and is electrically connected to the plurality of first internal electrodes (3), and a second via conductor (6) which is provided within the capacitor main body (1) and is electrically connected to the plurality of second internal electrodes (4), comprises: a step for forming a first material layer which is formed of a first material for the purpose of forming the first via conductor (5) and the second via conductor (6); and a step for forming a second material layer which is positioned at an end of at least one of the first via conductor (5) and the second via conductor (6), while being formed of a second material that is different from the first material and contains, as a main component, any one of Sn, Sn-Ag, Sn-Bi, Sn-In, Sn-Ag-Cu and Au.

Provided is a method of manufacturing a lead terminal for a power storage device, the lead terminal including: an electrode terminal (2) formed of a wire material (100) mainly containing aluminum or copper; and a lead wire (3) connected to the electrode terminal through intermediation of a welded portion (4), the method including: a first step of aligning the wire material and the lead wire in a straight line, and holding the wire material and the lead wire under a state in which a distance between an end surface (100b) of the wire material on the lead wire side and an end surface (3b) of the lead wire on the wire material side is maintained at a predetermined distance; a second step of applying, by a laser irradiation machine (400), a laser beam to an end portion (100a) of the wire material on the lead wire side to melt the end portion; and a third step of pushing one of the wire material or the lead wire toward another one of the wire material or the lead wire in an axial direction after an elapse of a predetermined time from a time point of start of irradiation with the laser beam in the second step to form the welded portion.

To provide a multilayer electronic component having excellent reliability.SOLUTION: One embodiment of the present invention provides a multilayer electronic component, the multilayer electronic component including: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces, and opposing each other in a second direction, and fifth and sixth surfaces connected to the first surface to the fourth surface and opposing each other in a third direction; and an external electrode including a connection portion disposed on the third or fourth surface and a band portion extending from the connection portion to portions of the first and second surfaces. The external electrode includes: a sputtered layer disposed in the connection portion and contacting the internal electrode and including Cu; an oxide layer disposed on the sputtered layer and including a Cu oxide; and a conductive polymer layer disposed in the band portion and including a polymer material.SELECTED DRAWING: Figure 2

A method for manufacturing a multilayer ceramic electronic component, includes: an operation of forming a conductive paste for internal electrodes on a ceramic green sheet; an operation of forming a ceramic laminate by laminating a plurality of the ceramic green sheets; an operation of forming a ceramic body including a dielectric layer and a plurality of internal electrodes by sintering the ceramic laminate; an operation of trimming at least one surface of the ceramic body; and an operation of forming at least one external electrode on the at least one trimmed surface of the ceramic body.

A multilayer ceramic capacitor including a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed on an outer surface of the capacitor body, wherein the internal electrode layer includes nickel (Ni), and a space lattice edge length of the nickel (Ni) obtained from Equation 1 through X-ray diffraction analysis (XRD) of the internal electrode layer is about 3.522 Å to about 3.544 Å.α=λ·h2+k2+l22⁢ sin⁢θ[Equation⁢ 1]In Equation 1, λ, h, k, l and θ are as defined in the specification.

The capacitor lead aluminum wire forming, cleaning and forming all-in-one machine comprises a working machine table, an automatic discharging mechanism and a punching machine are arranged at the top of the working machine table, an ultrasonic cleaning machine, a forming device, a drying device and a material collecting mechanism are sequentially arranged on one side of the working machine table, and a base table is arranged at the bottom of the drying device and the bottom of the material collecting mechanism; the punching machine comprises a punching machine shell, a punching air cylinder is installed in the punching machine shell, an upper die base is installed at the output end of the punching air cylinder, a lower die base is arranged on the outer side of the punching machine shell and located below the upper die base, a flattening male die is connected to the bottom of the upper die base, and a plurality of bearings used for fixing lead aluminum wires are rotationally connected to the top of the lower die base and located on the two sides of the upper die base. The problem that the final product yield is affected by process dispersion and low efficiency in the prior art is solved.

The invention relates to a printing paste adding method of an MLCC (multilayer ceramic capacitor), which comprises the following steps of: measuring a unit blank diaphragm before and after printing to obtain the weight of inner electrode paste consumed by a single diaphragm, and obtaining the inner electrode consumption of a current printing screen in real time in the subsequent printing process to realize accurate paste adding. The problems that the inner paste on the edge of the printing screen is dry due to excessive paste supplementation and the pattern of the inner electrode is lost due to too little paste supplementation are solved, and the printing quality of the inner electrode is improved.

The invention relates to a capacitor cover plate structure and a cold forging welding process thereof. A capacitor cover plate is provided with two terminals. Holes are formed in the side surfaces of the terminals; a chaff is matched with the hole in the side face of the terminal, and the chaff is inserted into the hole in the side face of the terminal and connected with the terminal. The cold forging welding process is used for connecting a foil guide strip and a terminal, and the terminal is an aluminum product; the process comprises the following steps of (1) cold forging: clamping a terminal and contacting a chaff through cold forging, and (2) welding: connecting the chaff and the terminal through welding, so that the terminal and the chaff are firmly connected, the electrical performance is stable, and automatic production is convenient to realize.

This disclosure provides a multilayer ceramic capacitor and a method for fabricating a multilayer ceramic capacitor. The multilayer ceramic capacitor may include: a capacitor body comprising a dielectric layer and an inner electrode layer; and an outer electrode located on the outer surface of the capacitor body, comprising a conductive metal and glass, wherein the glass may include a first interface region in contact with the conductive metal, and wherein the first interface region may include at least one of Ag and Pd.

Provided are an electronic component with an external electrode having sufficient thermal resistance, and a mounting method and a mounting structure therefor.　An electronic component 1 comprises: an element body 10 in which internal electrodes 16a, 16b are embedded and that has a first major surface 12a and a second major surface 12b opposing each other in a thickness direction T, a first side surface 13a and a second side surface 13b opposing each other in a width direction W orthogonal to the thickness direction T, and a first end surface 14a and a second end surface 14b opposing each other in a length direction L orthogonal to both the thickness direction T and the width direction W; and a pair of external electrodes 20a, 20b disposed on at least the first end surface 14a and the second end surface 14b of the element body 10 and connected to the internal electrodes 16a, 16b. The external electrodes 20a, 20b each comprise at least an Ni plating layer 21, and a Cu6Sn5 portion 23 disposed on the Ni plating layer 21 either directly or indirectly with an island-like or layer-like Cu-based interposed portion 22 therebetween.

A multilayer ceramic electronic component according to one embodiment of the present invention includes a main body including a capacitor portion in which a plurality of dielectric layers having ceramic as a main component and a plurality of internal electrode layers are laminated, all elements of Al or Cr, Fe, and Si are present in the capacitor portion, and at least one of these elements is deposited in the internal electrode layers.

An electrical device for high-voltage applications and a method for obtaining an electrical device. The electrical device includes a capacitor having: a bottom electrode having a conductive structure, the conductive structure including a base surface and facing protruding walls extending upwards and having a highest surface; a top electrode having at least one conductive region arranged between the facing protruding walls and having a top surface, wherein the top surface of the at least one conductive region lies below or at the level of the highest surface of the protruding walls; and a dielectric region extending conformally over the bottom electrode and surrounding the top electrode, the capacitor being formed by the bottom and top electrodes separated by the dielectric region.

A method is provided for fabricating a terminal electrode. The terminal electrode is applied on a multilayer ceramic capacitor (MLCC). The method prints inner electrodes on full area together with protective layers. The MLCC uses the thickness of thinned dielectric ceramic layers and the stacking of nickel inner-electrode layers. High capacitance is achieved at ends and sides with high electrode-to-ceramic ratios. Thus, the present invention uses a coating technology of ultra-low-temperature electrochemical deposition to fabricate low internal-stress MLCC terminal electrodes together with insulating protective layers for improving MLCC yield while cost reduced.

A method of manufacturing a multilayer capacitor includes preparing a guide frame, forming at least one dielectric layer between at least two surfaces of the guide frame such that at least a portion of each side surface of the at least one dielectric layer is in contact with the at least two surfaces, forming at least one internal electrode on an upper surface of the at least one dielectric layer between at least two surfaces of the guide frame using an inkjet printing method, and separating at least two surfaces of the guide frame from the at least one dielectric layer.

The invention relates to the technical field of molecular devices, in particular to a helicene molecule-based capacitance-inductance dual-function device and a preparation method thereof. The device comprises a first graphene point electrode, helicene molecules and a second graphene point electrode, the first graphene point electrode and the second graphene point electrode form a graphene point electrode pair, and the helicene molecules are connected between the graphene point electrode pair; the helicene molecules are switched between a capacitance effect and an inductance effect by changing the voltage change rate of alternating current applied to the helicene molecules; when the voltage change rate of the alternating current is 0.1-1.0 V / s, the helicene molecules have an inductance effect; and when the voltage change rate of the alternating current is greater than or equal to 10V / s, the helicene molecules have a capacitance effect. According to the preparation method provided by the invention, preparation is carried out on the basis of the graphene single-molecule field effect transistor, remarkable miniaturization of the size of the device is realized, and a relatively high integration level is shown.