212results about "Terminal applying apparatus" patented technology

A multilayer ceramic capacitor includes: a capacitor body comprising a dielectric layer and an internal electrode layer; and an external electrode disposed on an outside surface of the capacitor body, wherein the capacitor body includes an active portion where the dielectric layer and the internal electrode layer are alternately disposed, side margin portions disposed at both side end portions of the active portion facing each other, and bonding portions disposed between the active portion and the side margin portions, and at least one of the active portion or the side margin portions includes a barium titanate-based main ingredient including barium (Ba) and titanium (Ti), and gallium (Ga).

This invention discloses a surface-mount solid aluminum electrolytic capacitor and its manufacturing method, comprising a capacitor core package, which includes N capacitor cores, N+1 conductive metal meshes, a substrate, anode leads, cathode leads, and a silver paste covering tape. The capacitor core package is encapsulated and electroplated to form a solid aluminum electrolytic capacitor. The capacitor core includes an anode portion, a cathode portion, and an insulating barrier tape. In this invention, the conductive metal mesh sandwiched between the metal pads in the anode portion of the capacitor core and the cathode portion of the capacitor core can achieve the flatness of the core package. The silver paste covering tape located on the side of the cathode portion of the core package is embedded in the gap formed between two adjacent capacitor cores due to the conductive metal mesh sandwiched, forming an integrated connection. This prevents the resin encapsulant from being squeezed into the core layers during encapsulation, preventing core deformation damage that could lead to increased leakage current and increased ESR. Furthermore, it can prevent insufficient capacitance or even capacitor failure caused by delamination between cores.

Disclosed is a multilayer ceramic capacitor. The present invention comprises: a ceramic body in which a plurality of dielectric layers are stacked; a recessed portion which is recessedly formed at a corner where a side surface of the ceramic body and a bottom surface of the ceramic body contact each other; and a lower electrode formed on the bottom surface of the ceramic body.

A multilayer ceramic capacitor may include a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed outside the capacitor body, where the dielectric layer may include a plurality of dielectric grains and a grain boundary located between the dielectric grains adjacent to each other, where the dielectric grain may include a barium titanate-based main component including barium (Ba) and titanium (Ti), where the grain boundary includes silicon (Si), dysprosium (Dy), and terbium (Tb), and where silicon (Si), dysprosium (Dy), and terbium (Tb) are included in the grain boundary in content order of terbium (Tb)<dysprosium (Dy)<silicon (Si).

The invention discloses a visual detection-based pin pitch correction device for thin film capacitor production, the correction device comprises a winding mechanism, a correction mechanism, a visual detection mechanism and a movable clamping mechanism, the winding mechanism is in fastening connection with the visual detection mechanism, the correction mechanism is in fastening connection with the winding mechanism, the visual detection mechanism is in fastening connection with the winding mechanism, and the movable clamping mechanism is in fastening connection with the winding mechanism. The movable clamping mechanism is in fastening connection with the winding mechanism, the correction mechanism is electrically connected with the visual detection mechanism, the winding mechanism and the movable clamping mechanism are in fastening connection to achieve the pin pitch adjustment process, the winding mechanism is responsible for guiding and providing thin-film capacitor materials to the correction mechanism according to needs, and the visual detection mechanism monitors and analyzes the pin pitch and the pin angle in real time. Accurate detection data are provided, the correction mechanism adjusts the pin pitch and the pin angle according to visual detection, and the movable clamping mechanism is responsible for accurately placing the adjusted capacitor to a designated position.

A multi-layered capacitor including a capacitor body including a dielectric layer and an internal electrode; and an external electrode disposed on an outer side of the capacitor body, wherein the dielectric layer includes a plurality of dielectric crystal grains, and the dielectric crystal grains include a core containing BaTiO3, a first shell disposed on the core and containing BaTiO3 doped with a first doping element of Sr, Ca, Bi, K, Na, or a combination thereof, and a second shell disposed on the first shell and containing a first coating element of Nb, Ta, or a combination thereof.

A method for manufacturing a sealed container lid includes arranging an insulating flange 42 so as to overlap with a terminal flange 32, heating the insulating flange 42 overlapping with the terminal flange 32, pressing the insulating flange 42 on the terminal flange 32 in a state where a pair of pressure portions 55, 56 sandwich the terminal flange 32 and the heated insulating flange 42, and joining the insulating flange 42 to the terminal flange 32, arranging the insulating flange 42 so as to overlap with a lid body 15, heating the insulating flange 42 overlapping with the lid body 15, and a pressing the insulating flange 42 on the lid body 15 in a state where the pair of pressure portions 55, 56 sandwich the lid body 15 and the heated insulating flange 42, and joining the insulating flange 42 to the lid body 15.

A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer includes a plurality of dielectric grains, and wherein the plurality of dielectric grains include one or more first dielectric grains in which a sum of lengths of defects in a dielectric grain is 150 nm or more.

This invention relates to the field of capacitor technology, and in particular to a capacitor production equipment, comprising a machine base, a conveying device, a clamping device, a straightening device, and a lead insertion device. The machine base is equipped with a feeding machine; the conveying device is located on the machine base; the clamping device is located on the machine base and is used to transfer elements from the feeding machine to the conveying device, separating the leads of the elements during the transfer; the straightening device is located on the machine base and is used to straighten tilted elements on the conveying device; the lead insertion device is located on the machine base and is used to insert the leads of the elements conveyed by the conveying device into caps. This capacitor production equipment uses automated means to insert the leads of elements into caps, achieving a high degree of automation and high efficiency, making it highly worthy of promotion.

The invention provides a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes: a capacitor body including a dielectric layer and an inner electrode layer; and an outer electrode disposed on an outer surface of the capacitor body, in which the inner electrode layer includes nickel (Ni), and a space lattice side length of the nickel (Ni) obtained according to Formula 1 by X-ray diffraction (XRD) analysis on the inner electrode layer is about to about [Formula 1] in Formula 1, lambda is a wavelength of a Cu K alpha ray, values of lambda are h, k and l are crystal plane indexes, and theta is a Bragg angle.

A ceramic electronic component according to an embodiment of the present invention includes an element body including a capacitive part in which a plurality of dielectric layers containing a ceramic as a main component and a plurality of internal electrode layers are laminated on each other. All elements of Al or Cr, Fe, and Si are present in the capacitive part, and at least one of these elements is precipitated in the internal electrode layers.

Provided is a capacitor that is lightweight yet can reduce moisture absorption. The capacitor comprises a capacitor element and a protective film. The capacitor element has a first end-face electrode, a second end-face electrode, and an outer peripheral surface. The second end-face electrode exists at the side opposite to the first end-face electrode. The outer peripheral surface exists between the first end-face electrode and the second end-face electrode. The protective film has a first protective part, a second protective part, and a third protective part. The first protective part protects the peripheral edge part of the first end-face electrode. The second protective part protects the peripheral edge part of the second end-face electrode. The third protective part is connected to the first protective part and the second protective part, and protects the outer peripheral surface.

To provide a reliable multilayer electronic component and a method of manufacturing the same.SOLUTION: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The dielectric layer includes a plurality of dielectric crystal grains. The dielectric crystal grains include one or more first dielectric crystal grains in which a sum of lengths of defects in a dielectric crystal grain is 150 nm or more.SELECTED DRAWING: Figure 10

The present invention provides an automatic end silver coating and clamping machine for the production of capacitor core groups, which includes a vibrating tray, a workbench, and a handling mechanism. The handling mechanism includes a Y-axis servo module, a flipping assembly, handling fingers, and an X-axis servo module. The workbench is provided with a slurry scraping mechanism for silver coating the end of the core group, a clamping mechanism for pressing and forming the end of the core group and the electrode plate, a material conveying mechanism, and a tooling blanking mechanism, which includes a slicing die, a sheet taking mechanism, a sheet feeding mechanism, and a downward pressing and bending machine. When silver coating the end of the core group in the present invention, the silver coating amount on the end of the core group is large, the coating is uniform, the connection area with the electrode at the end of the core group is increased, the connection tightness between the core group and the electrode plate is good, the bonding strength is high, and it is not easy to fall off, ensuring the silver paste coating quality on the end of the core group; the number of silver coating times on the end of the core group is increased, the thickness of the silver paste at the end is increased, the connection reliability is improved, and the capacitance value drift and the failure of no capacitance of the mica capacitor are avoided.

The invention discloses a wafer capacitor adopting a carbon fiber pin and a production process and production equipment thereof. The wafer capacitor comprises a wafer capacitor body, a silver electrode and the carbon fiber pin. The production process comprises the steps of adsorbent preparation, carbon fiber wrapping with the adsorbent, pre-reduction reaction, insulation layer wrapping and wafer capacitor preparation. The production equipment comprises a lifting pool, a silver ion soaking pool, a phosphorous acid soaking pool, a hot extrusion mechanism, an extruder and a laser welding unit. According to the method, carbon fibers are wrapped with an adsorbent with high silver adsorption, a porous conductive carbon fiber structure with a nano-silver wire network is produced through pre-reduction of a reducing agent and a high-temperature reducing atmosphere reaction, and tin-free welding is carried out on a high-silver-content modified carbon fiber pin and silver on the surface of a wafer capacitor through laser welding; and the obtained product has the advantages of light weight, high strength, high conductivity, high welding strength, corrosion resistance, high temperature resistance and the like, so that the wafer capacitor adapts to a severe environment, and the application range is widened.

The invention relates to the technical field of capacitor generation, in particular to an automobile capacitor glue pouring packaging device. An automobile capacitor glue pouring packaging device comprises a conveying line used for conveying a capacitor body, a lifting mechanism used for lifting a capacitor to be processed is arranged at the front end of the conveying line, and the lifting mechanism lifts the capacitor to be processed to be equal to the conveying line in height and then transfers the capacitor to be processed into a glue pouring mechanism for glue pouring operation of the capacitor to be processed. And the capacitor after glue filling is transferred to the terminal bending mechanism for terminal bending, the capacitor after terminal bending is transferred to the terminal welding mechanism, the welded capacitor is transferred to the visual detection mechanism, and the capacitor after detection is guided out by the conveying line. A to-be-processed capacitor is lifted by the lifting mechanism to be flush with the conveying line and then is transferred, the to-be-processed capacitor is subjected to glue filling by the glue filling mechanism, shaping by the terminal bending mechanism and connection by the terminal welding mechanism, then the quality is screened by the visual inspection mechanism, qualified products are finally guided out by the conveying line, and packaging is completed.

The invention provides a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes: a capacitor body including a dielectric layer and an inner electrode layer; and an external electrode disposed on an outer surface of the capacitor body, the capacitor body includes an effective portion in which the dielectric layers and the inner electrode layers are alternately disposed, side edge portions disposed at two side end portions of the effective portion opposite to each other, and bonding portions disposed between the effective portion and the side edge portions, respectively. And at least one of the effective portion and the side edge portion includes a barium titanate-based main component including barium (Ba) and titanium (Ti), and gallium (Ga).

An intaglio jig (100, 300) for manufacturing an electronic component (10, 200) having an external electrode (30 to 38, 240, 250) by applying a conductive paste (P) to an electronic component body (20, 210) includes an elastic body (110, 310), and a recessed portion (120, 320) that is formed in the elastic body and in which the conductive paste is contained. The recessed portion includes an opening (121, 321) having an opening width (W2, W6) that conforms to a width (W1, W5) of the external electrode, a bottom surface (122, 322) at a predetermined depth (D) from the opening, and at least one protrusion portion (130 to 132, 330) in which a protrusion height (H1, H2) locally protruding from the bottom surface is less than the predetermined depth (D).

The present application is directed to a method for establishing an electronic connection to an electronic component and chip assembly. The method includes the following steps: an electronic component having a first weld is provided; a first electrical contact is also provided; the first weld and the first electrical contact are in mechanical contact with each other; then, while the mechanical contact is maintained, a welding current is applied capable of welding the electrical contact and the weld together.

The capacitor pin shaping device is characterized by comprising a bottom plate, a movable die is arranged on the left side of the middle of the bottom plate, a fixed die is arranged on the right side of the middle of the bottom plate, the fixed die is fixedly connected with the bottom plate, a clamping groove is formed in the middle of the left side face of the fixed die, an elastic silica gel pad is arranged on the bottom face of the clamping groove, and a clamping piece is arranged in the middle of the right side face of the movable die; the clamping pieces are clamped in the clamping grooves and connected with the clamping grooves in a linear moving mode, shaping air cylinders are arranged at the left end and the right end of the bottom plate, and side dies are arranged at the piston rod ends of the shaping air cylinders. The shaping cylinders, the side die, the movable die and the fixed die are arranged, and the shaping cylinders at the two ends are synchronously and oppositely started, so that automatic shaping of the pin B value of the six-pin capacitor is realized; the first pressing plate and the second pressing plate are adopted to form wedged connection, the front first pressing plate and the rear first pressing plate are driven to linearly move towards the interior of the bottom plate, automatic shaping of the P value of the pins of the six-pin capacitor is achieved, shaping of the P value and shaping of the B value are conducted synchronously, and the shaping work efficiency is greatly improved.

A capacitor may include a stack assembly that may include a plurality of anode plate members, each having an embedded wire. The anode plate members may be separated by at least one cathode foil sandwiched between separator sheets. A conducting member may electrically connect the embedded wires and may have an externally accessible end portion that is hermetically sealed from the interior of the capacitor. A case covers the stack assembly and may be attached to a cover. The case and cover may enclose the stack assembly within an interior area of the capacitor. The at least one cathode foil may be connected to the case. An electrolyte fluid may be disposed within the interior area. A passage may be provided through a central portion of the stack assembly. A tube, surrounded by insulation, may pass through the passage and may be connected to the cover and the case.

A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers of which a main component is ceramic and each of three or more of internal electrode layers are alternately stacked. The three or more of internal electrode layers include Ni and Sn, wherein Sn is distributed entirely in the three or more of internal electrode layers. An internal electrode layer having a larger Sn concentration is closer to an outermost edge in a stacking direction than an internal electrode layer having a smaller Sn concentration and being located on a center side of the stacking direction, in a relationship of at least two of the three or more of internal electrode layers.

The invention provides a metallized film flexible straight capacitor core metal spraying automatic conveying system, and belongs to the technical field of capacitor metal spraying conveying, and the metallized film flexible straight capacitor core metal spraying automatic conveying system comprises a rectangular frame which comprises a pair of vertical rods and two cross rods, the two cross rods are arranged at the two ends of the vertical rods respectively, rectangular through grooves are formed in the side faces of the vertical rods, and a pair of hanging frames is arranged at the top of one cross rod; sliding grooves are symmetrically formed in the inner sides of the pair of vertical rods, the two ends of a transverse plate are arranged in the two sliding grooves in a sliding mode respectively, and a spring is vertically arranged above the transverse plate. The L-shaped rods are arranged on one side of the rectangular frame, the vertical sections of the L-shaped rods are in sliding connection with the movable ends of the linear mechanisms in the vertical direction, and first protruding blocks are arranged at the tops of the transverse sections of the L-shaped rods; the telescopic end of the lifting mechanism is connected with the vertical sections of the pair of L-shaped rods; and the material receiving frame is arranged below the linear mechanism, and a material pushing block is arranged between the material receiving frame and the linear mechanism. According to the conveying system, automatic discharging of the capacitor cores after metal spraying can be achieved, and the production efficiency is improved.

A solid electrolytic capacitor capable of improving manufacturing yield is provided. A solid electrolytic capacitor according to one aspect of the present disclosure includes an anode lead-out wire and a capacitor element in which the anode lead-out wire is embedded. The cross section of at least a part of the anode lead-out wire in a direction in which the anode lead-out wire is extended has a flat shape, and a recess provided in a central part, a first linear part that is extended outward from one side of the recess, and a second linear part that is extended outward from another side of the recess are formed in at least one of an upper surface and a lower surface of the anode lead-out wire having the flat shape.

A method of forming an integrated component, for example a capacitor or an ionic capacitor, comprising: forming a stacked structure comprising, on a substrate (400, 405, AAO), a bottom electrode, an intermediate layer (420) comprising a layer of dielectric material or a layer of ionic conductor, and a top electrode, wherein forming the top and / or the bottom electrode comprises forming a liner layer (430) of material, and forming a metallic layer (435) on the liner layer, the metallic layer comprising a noble metal, wherein the metallic layer is thicker than the liner layer.

A multilayer ceramic capacitor and a method of manufacturing the same are disposed. The multilayer ceramic capacitor includes: a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, respectively. One of the external electrodes includes a first plating layer, and the first plating layer includes a crystal grain in which an average ratio of major and minor axes thereof is 1:1 to 3:1.

The invention provides a multilayer capacitor and a method of manufacturing the same. The multilayer capacitor includes: a capacitor body including a dielectric layer and an inner electrode; and an external electrode disposed on an outer side of the capacitor body, in which the dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains includes: a core including BaTiO3; a first shell disposed on the core and including BaTiO3 doped with a first doping element, the first doping element being Sr, Ca, Bi, K, Na, or a combination thereof; and a second shell disposed on the first shell and including a first coating element, the first coating element being Nb, Ta, or a combination thereof.

A method for producing a multilayer ceramic capacitor according to the present invention, the multilayer ceramic capacitor being provided with a capacitor main body (1) which is obtained by stacking a plurality of dielectric layers (2), a plurality of first internal electrodes (3) and a plurality of second internal electrodes (4), a first via conductor (5) which is provided within the capacitor main body (1) and is electrically connected to the plurality of first internal electrodes (3), and a second via conductor (6) which is provided within the capacitor main body (1) and is electrically connected to the plurality of second internal electrodes (4), comprises: a step for forming a first material layer which is formed of a first material for the purpose of forming the first via conductor (5) and the second via conductor (6); and a step for forming a second material layer which is positioned at an end of at least one of the first via conductor (5) and the second via conductor (6), while being formed of a second material that is different from the first material and contains, as a main component, any one of Sn, Sn-Ag, Sn-Bi, Sn-In, Sn-Ag-Cu and Au.

To provide a ceramic electronic component capable of increasing its humidity resistance while reducing an equivalent serial resistor (ESR) and a manufacturing method of the ceramic electronic component.SOLUTION: A ceramic electronic component has a lamination structure in which a plurality of dielectric layers mainly made of ceramic and three or more internal electrode layers are alternately laminated, the three or more internal electrode layers containing Ni and Sn, and with respect to the relation between at least two layers of the three or more internal electrode layers, an internal electrode layer on an end side in a lamination direction having a Sn concentration higher than an internal electrode layer on a center side in the lamination direction.SELECTED DRAWING: Figure 4

Provided is a method of manufacturing a lead terminal for a power storage device, the lead terminal including: an electrode terminal (2) formed of a wire material (100) mainly containing aluminum or copper; and a lead wire (3) connected to the electrode terminal through intermediation of a welded portion (4), the method including: a first step of aligning the wire material and the lead wire in a straight line, and holding the wire material and the lead wire under a state in which a distance between an end surface (100b) of the wire material on the lead wire side and an end surface (3b) of the lead wire on the wire material side is maintained at a predetermined distance; a second step of applying, by a laser irradiation machine (400), a laser beam to an end portion (100a) of the wire material on the lead wire side to melt the end portion; and a third step of pushing one of the wire material or the lead wire toward another one of the wire material or the lead wire in an axial direction after an elapse of a predetermined time from a time point of start of irradiation with the laser beam in the second step to form the welded portion.