98results about "Terminal applying apparatus" patented technology

This invention discloses a surface-mount solid aluminum electrolytic capacitor and its manufacturing method, comprising a capacitor core package, which includes N capacitor cores, N+1 conductive metal meshes, a substrate, anode leads, cathode leads, and a silver paste covering tape. The capacitor core package is encapsulated and electroplated to form a solid aluminum electrolytic capacitor. The capacitor core includes an anode portion, a cathode portion, and an insulating barrier tape. In this invention, the conductive metal mesh sandwiched between the metal pads in the anode portion of the capacitor core and the cathode portion of the capacitor core can achieve the flatness of the core package. The silver paste covering tape located on the side of the cathode portion of the core package is embedded in the gap formed between two adjacent capacitor cores due to the conductive metal mesh sandwiched, forming an integrated connection. This prevents the resin encapsulant from being squeezed into the core layers during encapsulation, preventing core deformation damage that could lead to increased leakage current and increased ESR. Furthermore, it can prevent insufficient capacitance or even capacitor failure caused by delamination between cores.

A multi-layered capacitor including a capacitor body including a dielectric layer and an internal electrode; and an external electrode disposed on an outer side of the capacitor body, wherein the dielectric layer includes a plurality of dielectric crystal grains, and the dielectric crystal grains include a core containing BaTiO3, a first shell disposed on the core and containing BaTiO3 doped with a first doping element of Sr, Ca, Bi, K, Na, or a combination thereof, and a second shell disposed on the first shell and containing a first coating element of Nb, Ta, or a combination thereof.

This invention relates to the field of capacitor technology, and in particular to a capacitor production equipment, comprising a machine base, a conveying device, a clamping device, a straightening device, and a lead insertion device. The machine base is equipped with a feeding machine; the conveying device is located on the machine base; the clamping device is located on the machine base and is used to transfer elements from the feeding machine to the conveying device, separating the leads of the elements during the transfer; the straightening device is located on the machine base and is used to straighten tilted elements on the conveying device; the lead insertion device is located on the machine base and is used to insert the leads of the elements conveyed by the conveying device into caps. This capacitor production equipment uses automated means to insert the leads of elements into caps, achieving a high degree of automation and high efficiency, making it highly worthy of promotion.

The invention provides a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes: a capacitor body including a dielectric layer and an inner electrode layer; and an outer electrode disposed on an outer surface of the capacitor body, in which the inner electrode layer includes nickel (Ni), and a space lattice side length of the nickel (Ni) obtained according to Formula 1 by X-ray diffraction (XRD) analysis on the inner electrode layer is about to about [Formula 1] in Formula 1, lambda is a wavelength of a Cu K alpha ray, values of lambda are h, k and l are crystal plane indexes, and theta is a Bragg angle.

A ceramic electronic component according to an embodiment of the present invention includes an element body including a capacitive part in which a plurality of dielectric layers containing a ceramic as a main component and a plurality of internal electrode layers are laminated on each other. All elements of Al or Cr, Fe, and Si are present in the capacitive part, and at least one of these elements is precipitated in the internal electrode layers.

Provided is a capacitor that is lightweight yet can reduce moisture absorption. The capacitor comprises a capacitor element and a protective film. The capacitor element has a first end-face electrode, a second end-face electrode, and an outer peripheral surface. The second end-face electrode exists at the side opposite to the first end-face electrode. The outer peripheral surface exists between the first end-face electrode and the second end-face electrode. The protective film has a first protective part, a second protective part, and a third protective part. The first protective part protects the peripheral edge part of the first end-face electrode. The second protective part protects the peripheral edge part of the second end-face electrode. The third protective part is connected to the first protective part and the second protective part, and protects the outer peripheral surface.

To provide a reliable multilayer electronic component and a method of manufacturing the same.SOLUTION: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The dielectric layer includes a plurality of dielectric crystal grains. The dielectric crystal grains include one or more first dielectric crystal grains in which a sum of lengths of defects in a dielectric crystal grain is 150 nm or more.SELECTED DRAWING: Figure 10

The invention discloses a wafer capacitor adopting a carbon fiber pin and a production process and production equipment thereof. The wafer capacitor comprises a wafer capacitor body, a silver electrode and the carbon fiber pin. The production process comprises the steps of adsorbent preparation, carbon fiber wrapping with the adsorbent, pre-reduction reaction, insulation layer wrapping and wafer capacitor preparation. The production equipment comprises a lifting pool, a silver ion soaking pool, a phosphorous acid soaking pool, a hot extrusion mechanism, an extruder and a laser welding unit. According to the method, carbon fibers are wrapped with an adsorbent with high silver adsorption, a porous conductive carbon fiber structure with a nano-silver wire network is produced through pre-reduction of a reducing agent and a high-temperature reducing atmosphere reaction, and tin-free welding is carried out on a high-silver-content modified carbon fiber pin and silver on the surface of a wafer capacitor through laser welding; and the obtained product has the advantages of light weight, high strength, high conductivity, high welding strength, corrosion resistance, high temperature resistance and the like, so that the wafer capacitor adapts to a severe environment, and the application range is widened.

The invention relates to the technical field of capacitor generation, in particular to an automobile capacitor glue pouring packaging device. An automobile capacitor glue pouring packaging device comprises a conveying line used for conveying a capacitor body, a lifting mechanism used for lifting a capacitor to be processed is arranged at the front end of the conveying line, and the lifting mechanism lifts the capacitor to be processed to be equal to the conveying line in height and then transfers the capacitor to be processed into a glue pouring mechanism for glue pouring operation of the capacitor to be processed. And the capacitor after glue filling is transferred to the terminal bending mechanism for terminal bending, the capacitor after terminal bending is transferred to the terminal welding mechanism, the welded capacitor is transferred to the visual detection mechanism, and the capacitor after detection is guided out by the conveying line. A to-be-processed capacitor is lifted by the lifting mechanism to be flush with the conveying line and then is transferred, the to-be-processed capacitor is subjected to glue filling by the glue filling mechanism, shaping by the terminal bending mechanism and connection by the terminal welding mechanism, then the quality is screened by the visual inspection mechanism, qualified products are finally guided out by the conveying line, and packaging is completed.

The invention provides a multilayer capacitor and a method of manufacturing the same. The multilayer capacitor includes: a capacitor body including a dielectric layer and an inner electrode; and an external electrode disposed on an outer side of the capacitor body, in which the dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains includes: a core including BaTiO3; a first shell disposed on the core and including BaTiO3 doped with a first doping element, the first doping element being Sr, Ca, Bi, K, Na, or a combination thereof; and a second shell disposed on the first shell and including a first coating element, the first coating element being Nb, Ta, or a combination thereof.

Provided is a method of manufacturing a lead terminal for a power storage device, the lead terminal including: an electrode terminal (2) formed of a wire material (100) mainly containing aluminum or copper; and a lead wire (3) connected to the electrode terminal through intermediation of a welded portion (4), the method including: a first step of aligning the wire material and the lead wire in a straight line, and holding the wire material and the lead wire under a state in which a distance between an end surface (100b) of the wire material on the lead wire side and an end surface (3b) of the lead wire on the wire material side is maintained at a predetermined distance; a second step of applying, by a laser irradiation machine (400), a laser beam to an end portion (100a) of the wire material on the lead wire side to melt the end portion; and a third step of pushing one of the wire material or the lead wire toward another one of the wire material or the lead wire in an axial direction after an elapse of a predetermined time from a time point of start of irradiation with the laser beam in the second step to form the welded portion.

A multilayer ceramic capacitor including a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed on an outer surface of the capacitor body, wherein the internal electrode layer includes nickel (Ni), and a space lattice edge length of the nickel (Ni) obtained from Equation 1 through X-ray diffraction analysis (XRD) of the internal electrode layer is about 3.522 Å to about 3.544 Å.α=λ·h2+k2+l22⁢ sin⁢θ[Equation⁢ 1]In Equation 1, λ, h, k, l and θ are as defined in the specification.

The invention relates to a capacitor cover plate structure and a cold forging welding process thereof. A capacitor cover plate is provided with two terminals. Holes are formed in the side surfaces of the terminals; a chaff is matched with the hole in the side face of the terminal, and the chaff is inserted into the hole in the side face of the terminal and connected with the terminal. The cold forging welding process is used for connecting a foil guide strip and a terminal, and the terminal is an aluminum product; the process comprises the following steps of (1) cold forging: clamping a terminal and contacting a chaff through cold forging, and (2) welding: connecting the chaff and the terminal through welding, so that the terminal and the chaff are firmly connected, the electrical performance is stable, and automatic production is convenient to realize.

This disclosure provides a multilayer ceramic capacitor and a method for fabricating a multilayer ceramic capacitor. The multilayer ceramic capacitor may include: a capacitor body comprising a dielectric layer and an inner electrode layer; and an outer electrode located on the outer surface of the capacitor body, comprising a conductive metal and glass, wherein the glass may include a first interface region in contact with the conductive metal, and wherein the first interface region may include at least one of Ag and Pd.

Provided are an electronic component with an external electrode having sufficient thermal resistance, and a mounting method and a mounting structure therefor.　An electronic component 1 comprises: an element body 10 in which internal electrodes 16a, 16b are embedded and that has a first major surface 12a and a second major surface 12b opposing each other in a thickness direction T, a first side surface 13a and a second side surface 13b opposing each other in a width direction W orthogonal to the thickness direction T, and a first end surface 14a and a second end surface 14b opposing each other in a length direction L orthogonal to both the thickness direction T and the width direction W; and a pair of external electrodes 20a, 20b disposed on at least the first end surface 14a and the second end surface 14b of the element body 10 and connected to the internal electrodes 16a, 16b. The external electrodes 20a, 20b each comprise at least an Ni plating layer 21, and a Cu6Sn5 portion 23 disposed on the Ni plating layer 21 either directly or indirectly with an island-like or layer-like Cu-based interposed portion 22 therebetween.

An electrical device for high-voltage applications and a method for obtaining an electrical device. The electrical device includes a capacitor having: a bottom electrode having a conductive structure, the conductive structure including a base surface and facing protruding walls extending upwards and having a highest surface; a top electrode having at least one conductive region arranged between the facing protruding walls and having a top surface, wherein the top surface of the at least one conductive region lies below or at the level of the highest surface of the protruding walls; and a dielectric region extending conformally over the bottom electrode and surrounding the top electrode, the capacitor being formed by the bottom and top electrodes separated by the dielectric region.

A method is provided for fabricating a terminal electrode. The terminal electrode is applied on a multilayer ceramic capacitor (MLCC). The method prints inner electrodes on full area together with protective layers. The MLCC uses the thickness of thinned dielectric ceramic layers and the stacking of nickel inner-electrode layers. High capacitance is achieved at ends and sides with high electrode-to-ceramic ratios. Thus, the present invention uses a coating technology of ultra-low-temperature electrochemical deposition to fabricate low internal-stress MLCC terminal electrodes together with insulating protective layers for improving MLCC yield while cost reduced.

The invention relates to the technical field of molecular devices, in particular to a helicene molecule-based capacitance-inductance dual-function device and a preparation method thereof. The device comprises a first graphene point electrode, helicene molecules and a second graphene point electrode, the first graphene point electrode and the second graphene point electrode form a graphene point electrode pair, and the helicene molecules are connected between the graphene point electrode pair; the helicene molecules are switched between a capacitance effect and an inductance effect by changing the voltage change rate of alternating current applied to the helicene molecules; when the voltage change rate of the alternating current is 0.1-1.0 V / s, the helicene molecules have an inductance effect; and when the voltage change rate of the alternating current is greater than or equal to 10V / s, the helicene molecules have a capacitance effect. According to the preparation method provided by the invention, preparation is carried out on the basis of the graphene single-molecule field effect transistor, remarkable miniaturization of the size of the device is realized, and a relatively high integration level is shown.

The invention provides a capacitor adjusting device, and relates to the field of capacitor pin adjustment. An adjusting structure is installed in the adjusting table, and a connecting assembly is fixedly arranged on the outer side of the adjusting structure. An auxiliary mechanism is fixedly arranged at the top of the adjusting structure, and an adjusting structure is further fixedly arranged on the outer side of the adjusting structure. A limiting assembly is fixedly arranged on the outer side of the adjusting structure, a transmission rod is fixedly arranged on the outer side of the adjusting structure and the outer side of the auxiliary mechanism, and the two pins of the cylindrical capacitor can be kept horizontal and can be adjusted at the same time through the centralizing plate, the guide base and the adjusting structure; a group of pins can be bent twice at the same time; the adjustment efficiency of the capacitor pins is improved, and the problem that the two pins of the cylindrical capacitor are inconvenient to adjust at the same time is solved. And a group of pins need to be bent twice.

The invention provides a thin film capacitor and a preparation method and a preparation device thereof, the thin film capacitor comprises a busbar and a capacitor element with a metal layer, a connecting end of the busbar is connected with the metal layer, a connecting point is formed between the busbar and the metal layer, and the connecting point is formed after sprayed metal particles are cooled and solidified. Based on the technical scheme of the invention, the busbar and the capacitor element are connected in a mode of spraying the metal particles, so that the temperature of the connection position of the busbar and the capacitor element can be effectively reduced, high-temperature damage to the capacitor element cannot be caused, the thickness of a metal layer of the capacitor element does not need to be increased, and the production cost is reduced.

An electronic component includes an element body and an external electrode. The external electrode is disposed on the element main body and includes a conductive resin layer and a plating layer formed on the conductive resin layer. The external electrode has a hole formed from the surface of the plating layer and reaching the conductive resin layer.

A multilayer ceramic capacitor includes a multilayer body including laminated ceramic layers and laminated inner electrode layers, a barrier film on the multilayer body; and outer electrodes on the barrier film at both end surfaces of the multilayer body. The ceramic layers include a perovskite compound represented by the general formula ABO3, where the A-site is Ba. The barrier film includes Ba and at least one of S or C. The barrier film covers main surfaces and side surfaces, and also covers the end surfaces except for exposed surfaces at which the inner electrode layers are exposed. The outer electrodes are in contact with the inner electrode layers at the exposed surfaces.

To provide a multilayer ceramic electronic component that can prevent a reduction in performance caused by stress applied during calcination.SOLUTION: A multilayer ceramic electronic component is provided with a laminate 16, and side margin parts 17a, 17b. The laminate has a plurality of ceramic layers stacked in a first axis direction, a plurality of internal electrodes 12, 13 located between the plurality of ceramic layers, and first and second side faces S1, S2 where the ends of the plurality of internal electrodes in a second axis direction orthogonal to the first axis are located. The side margin parts cover the first and second side faces. When the first and second margin parts are each equally divided into two along a plane perpendicular to the first axis direction to obtain first and second areas, in the first side margin part, the first area has a larger average thickness than the second area, and in the second side margin part, the second area has a larger average thickness than the first area.SELECTED DRAWING: Figure 3

A multilayer ceramic capacitor (100) comprises: a capacitor body (1) in which a plurality of dielectric layers (2), a plurality of first internal electrodes (3), and a plurality of second internal electrodes (4) are stacked; a first via conductor (5) provided in the capacitor body (1) and electrically connected to the plurality of first internal electrodes (3); a second via conductor (6) provided in the capacitor body (1) and electrically connected to the plurality of second internal electrodes (4); a first external electrode (11) provided on at least one of a first main surface (1a) and a second main surface (1b) opposing each other in a stacking direction among the surfaces of the capacitor body (1), the first external electrode (11) being connected to the first via conductor (5); a second external electrode (12) provided on at least one main surface of the capacitor body (1) and connected to the second via conductor (6); and a first metal layer (21) provided on a side surface of the capacitor body (1) and electrically connected to the first via conductor (5).

To provide a manufacturing method of an electronic component and an electronic component holding jig capable of reducing the possibility of collision of the electronic component.SOLUTION: A manufacturing method of an electronic component 1 according to the present invention includes an electronic component preparation step of preparing an electronic component 1 including a laminate chip 1A having a dielectric layer 14 and an internal electrode 15 stacked thereon, an electronic component holding step of holding the electronic components 1 in an electronic component holding jig 200 in an aligned state spaced a predetermined distance apart from each other, a position information acquisition step of acquiring position information of the laminate chip 1A in the electronic component holding jig 200, a processing step of processing the electronic component 1 while the electronic component 1 is held in the electronic component holding jig 200, and an information linking step of linking the processing results of the electronic component 1 to the position information.SELECTED DRAWING: Figure 3

A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external electrode disposed on the body. The dielectric layer includes a BaTiO3-based base material main ingredient, a sub-ingredient including Dy, and an additive. The additive is one or more of Sm, Gd and Tb, and a content of the additive is 25 mol or more and less than 50 mol relative to 100 mol of Dy. The dielectric layer includes a plurality of dielectric grains. When an average grain size of the plurality of dielectric grains is represented by G, and an average thickness of the dielectric layer is represented by td, 1.75≤td / G≤2.23 is satisfied.

A composite aluminum electrolytic capacitor comprises an aluminum shell, a core package and a sealing piece, the core package is arranged in the aluminum shell in a sealed mode through the sealing piece, the core package comprises an anode foil and a cathode film, the cathode film comprises an insulating base film and a metalized film, and the metalized film is formed on the base film in an evaporation mode; and the cathode film is electrically connected with the cathode lead-out assembly. According to the invention, the cathode film is used for replacing traditional aluminum foil, so that the volume of the core package is reduced, and the problem of short circuit caused by the fact that electrolytic paper is punctured by burrs in the core package of a traditional aluminum electrolytic capacitor can be effectively solved. Meanwhile, the cathode guide chaff is connected with the cathode film extending out of the bottom of the core cladding through ultrasonic welding or conductive rubber, so that the electric conduction area between the cathode guide chaff and the cathode film is large, the ESR value and ESL value of a product under high frequency can be effectively reduced, and the requirement of the high-frequency product is met.

The application provides a capacitor assembly and a preparation method thereof. The capacitor assembly has a simple structure and a simple preparation process. The capacitor structure comprises a first film layer, a second film layer and a capacitor core. The first film layer comprises a first metal layer and a first film layer. The first film layer is stacked on one side of the first metal layer and connected to the first metal layer. The second film layer comprises a second metal layer and a second film layer. The second film layer is stacked on one side of the second metal layer and connected to the second metal layer. The first film layer and the second film layer are stacked and co-wound on the capacitor core.

This invention provides a multilayer ceramic capacitor with excellent durability and moisture resistance, as well as a method for manufacturing the same. [Solution] The multilayer ceramic capacitor according to the embodiment includes a capacitor body comprising a dielectric layer and an internal electrode layer, and an external electrode disposed on the outside of the capacitor body, wherein the internal electrode layer comprises nickel (Ni), and the spatial lattice edge length of the nickel (Ni) obtained from the following formula 1 through X-ray diffraction analysis (XRD) of the internal electrode layer is 3.522 Å to 3.544 Å. JPEG2026052635000011.jpg25170 (In formula 1 above, λ, h, k, l, and θ are as defined in the specification.)