296results about "Terminal applying apparatus" patented technology

A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers of which a main component is ceramic and each of a plurality of internal electrode layers are alternately stacked. The plurality of internal electrode layers include Ni and Sn. Each of an upper section and a lower section of the plurality of internal electrode layers includes multiple internal electrode layers each having a Sn concentration higher than that of each internal electrode layer of a center section interposed between the upper and lower sections in a stacking direction, which are constituted by top 5% or more and bottom 5% or more of the plurality of internal electrode layers, respectively.

The invention belongs to the field of electronic component manufacturing, and particularly discloses a sintering method of a multilayer ceramic capacitor, which comprises the following steps of: carrying out trial sintering on a laminated green body after glue removal according to a sintering curve to obtain an oxygen consumption-temperature curve, and taking the oxygen consumption as a reference oxygen consumption at a corresponding temperature; formal sintering is carried out on the stacked green bodies after glue discharging according to a sintering curve, and the sintering atmosphere is adjusted according to the variable quantity of the real-time oxygen consumption and the standard oxygen consumption; the sintering atmosphere contains inert gas, hydrogen and water vapor. According to the sintering method, the sintering atmosphere composition and the gas flow in the formal sintering step can be regulated and controlled in real time, so that the stability of fluidity, oxidability and the like of the sintering atmosphere in the formal sintering process is ensured, the oxidized amount of the Ni element in the MLCC product is controlled, the electrical performance and the reliability of the prepared MLCC product are improved, and the production cost is reduced. Meanwhile, the equipment utilization rate is increased, the productivity is increased, and the cost is reduced.

The invention discloses a chip tantalum capacitor and a packaging method thereof, the capacitor comprises a lead frame and a tantalum core, and the lead frame is connected with the tantalum core through a connecting part. The packaging method comprises the following steps: correspondingly connecting a lead frame, a connecting part and a tantalum core, and then coating a water-soluble polymer material on the connecting part; putting into a mold for mold pressing; soaking in water after mould pressing, taking out, washing and drying; and carrying out electroplating treatment to finish packaging of the tantalum capacitor. According to the invention, a layer of water-soluble polymeric membrane material is coated on the positive and negative electrode lead wire areas of the lead wire frame; the water-soluble polymer material has good adhesion and peelability, so that the epoxy mould pressing flash material can be effectively prevented from being tightly attached to the lead frame in the mould pressing process, the epoxy mould pressing flash material is effectively removed, particularly the flash material is prevented from being tightly attached to the lead frame, the production quality and the product performance are improved, and the production cost is reduced. And the step of treating the flash is omitted.

A multilayer ceramic capacitor includes: a capacitor body comprising a dielectric layer and an internal electrode layer; and an external electrode disposed on an outside surface of the capacitor body, wherein the capacitor body includes an active portion where the dielectric layer and the internal electrode layer are alternately disposed, side margin portions disposed at both side end portions of the active portion facing each other, and bonding portions disposed between the active portion and the side margin portions, and at least one of the active portion or the side margin portions includes a barium titanate-based main ingredient including barium (Ba) and titanium (Ti), and gallium (Ga).

The invention provides a stacked capacitor assembly, a manufacturing method thereof and a stacked capacitor packaging structure. The stacked capacitor assembly comprises a plurality of conductive substrates, a plurality of internal conductive structures, a plurality of connecting layers and an outermost coating structure. The plurality of internal conductive structures are configured to cover the plurality of first portions of the plurality of conductive substrates, respectively. Each connecting layer is configured to be connected between any two adjacent internal conductive structures. The outermost cladding structure is configured for cladding the plurality of internal conductive structures and the plurality of connection layers. Therefore, the stacked capacitor assembly provided by the invention not only can simplify the overall structure, but also can meet the characteristic requirements of the capacitor. When the stacked capacitor assembly is applied to the stacked capacitor packaging structure, the stacked capacitor packaging structure can still achieve the electrical characteristics and functions provided by the capacitor under the condition that the overall structure is simplified.

This invention discloses a surface-mount solid aluminum electrolytic capacitor and its manufacturing method, comprising a capacitor core package, which includes N capacitor cores, N+1 conductive metal meshes, a substrate, anode leads, cathode leads, and a silver paste covering tape. The capacitor core package is encapsulated and electroplated to form a solid aluminum electrolytic capacitor. The capacitor core includes an anode portion, a cathode portion, and an insulating barrier tape. In this invention, the conductive metal mesh sandwiched between the metal pads in the anode portion of the capacitor core and the cathode portion of the capacitor core can achieve the flatness of the core package. The silver paste covering tape located on the side of the cathode portion of the core package is embedded in the gap formed between two adjacent capacitor cores due to the conductive metal mesh sandwiched, forming an integrated connection. This prevents the resin encapsulant from being squeezed into the core layers during encapsulation, preventing core deformation damage that could lead to increased leakage current and increased ESR. Furthermore, it can prevent insufficient capacitance or even capacitor failure caused by delamination between cores.

The invention provides a motor controller thin-film capacitor, and the capacitor comprises a housing which is provided with an opening and a cooling structure. The capacitor core is arranged in the shell; the capacitor core is provided with a metal terminal, the metal terminal extends out of the shell through the opening, and one end, far away from the capacitor core, of the metal terminal is provided with a bent wiring end; the positioning adjusting assembly is located in the shell; the capacitor core is detachably connected with one of two inner side walls which are oppositely arranged in the shell through the positioning adjusting assembly, and is configured to adjust the application direction of one end, far away from the capacitor core, of the metal terminal; the pouring sealant is filled in the shell; the pouring sealant covers the capacitor core, the positioning adjusting assembly and the part, located in the shell, of the metal terminal. According to the thin-film capacitor, the mounting position of the capacitor core in the shell can be changed by applying the positioning adjusting assembly, and then the application direction of the end part of the metal terminal is changed, so that the adaptability and compatibility of the thin-film capacitor are improved, and the application range of the thin-film capacitor is widened.

The invention provides a stacked capacitor assembly, a manufacturing method thereof and a stacked capacitor packaging structure. The stacked capacitor assembly includes a plurality of conductive substrates, an internal conductive structure, and an outermost cladding structure. Each conductive substrate is provided with a first part and a second part opposite to the first part; the internal conductive structure is configured to wrap the first portion of each conductive substrate and fill between any two adjacent conductive substrates. The outermost cladding structure is configured for cladding the inner conductive structure. Therefore, the stacked capacitor assembly provided by the invention not only can simplify the overall structure, but also can meet the characteristic requirements of the capacitor. When the stacked capacitor assembly is applied to the stacked capacitor packaging structure, the stacked capacitor packaging structure can still achieve the electrical characteristics and functions provided by the capacitor under the condition that the overall structure is simplified.

Disclosed is a multilayer ceramic capacitor. The present invention comprises: a ceramic body in which a plurality of dielectric layers are stacked; a recessed portion which is recessedly formed at a corner where a side surface of the ceramic body and a bottom surface of the ceramic body contact each other; and a lower electrode formed on the bottom surface of the ceramic body.

A multilayer ceramic capacitor may include a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed outside the capacitor body, where the dielectric layer may include a plurality of dielectric grains and a grain boundary located between the dielectric grains adjacent to each other, where the dielectric grain may include a barium titanate-based main component including barium (Ba) and titanium (Ti), where the grain boundary includes silicon (Si), dysprosium (Dy), and terbium (Tb), and where silicon (Si), dysprosium (Dy), and terbium (Tb) are included in the grain boundary in content order of terbium (Tb)<dysprosium (Dy)<silicon (Si).

The invention discloses a visual detection-based pin pitch correction device for thin film capacitor production, the correction device comprises a winding mechanism, a correction mechanism, a visual detection mechanism and a movable clamping mechanism, the winding mechanism is in fastening connection with the visual detection mechanism, the correction mechanism is in fastening connection with the winding mechanism, the visual detection mechanism is in fastening connection with the winding mechanism, and the movable clamping mechanism is in fastening connection with the winding mechanism. The movable clamping mechanism is in fastening connection with the winding mechanism, the correction mechanism is electrically connected with the visual detection mechanism, the winding mechanism and the movable clamping mechanism are in fastening connection to achieve the pin pitch adjustment process, the winding mechanism is responsible for guiding and providing thin-film capacitor materials to the correction mechanism according to needs, and the visual detection mechanism monitors and analyzes the pin pitch and the pin angle in real time. Accurate detection data are provided, the correction mechanism adjusts the pin pitch and the pin angle according to visual detection, and the movable clamping mechanism is responsible for accurately placing the adjusted capacitor to a designated position.

The invention relates to an all-inorganic flexible capacitor and a preparation method thereof, the all-inorganic flexible capacitor comprises at least one all-inorganic flexible capacitor unit, and the all-inorganic flexible capacitor unit comprises a metal electrode, a flexible electrode and a dielectric layer between the two electrodes; the dielectric layer is a metal oxide, the dielectric layer is generated by electrolysis on the surface of the metal foil through an electrochemical oxidation method, the metal foil is not completely electrolyzed, the remaining part of the metal foil after electrolysis serves as a flexible electrode, the dielectric layer is tightly attached to the flexible electrode, and a metal film is deposited on the surface of the dielectric layer to serve as a metal electrode. Compared with the prior art, the full-inorganic flexible capacitor can bear high voltage and is high in energy density, simple in structure and excellent in breakdown resistance, and the preparation method is simple, high in operability, low in cost, suitable for large-scale preparation and high in industrial production feasibility.

The invention relates to an aluminum electrolytic capacitor lead welding and riveting all-in-one machine which comprises a working machine table, a servo belt transmission device is installed at the bottom of the working machine table and connected with an eccentric wheel rocker mechanism, a wire feeding and cutting mechanism is installed at the top of the working machine table, and the eccentric wheel rocker mechanism is connected with the wire cutting mechanism. The servo belt transmission device is connected with a disc clamp device, and a rivet flattening device is installed on the top of the working machine table. According to the equipment, the welding function and the riveting function of the lead are integrated on the same working platform, and compared with a traditional multi-equipment operation process, the requirement for manual operation is greatly reduced, and the production efficiency is remarkably improved. Due to the integrated design, movement and carrying of materials in the operation process are reduced, the production time is shortened, the labor intensity is reduced, and a production line is smoother.

The invention discloses an aluminum capacitor and a lamination method thereof, and the method comprises the following steps: preparing single-layer capacitor monomers on a raw material piece, removing bad single-layer capacitor monomers, cutting off good single-layer capacitor monomers from the raw material piece, transferring the good single-layer capacitor monomers to a lamination jig, carrying out the negative electrode bonding, and carrying out the lamination. The method comprises the following steps: welding a positive electrode between single-layer capacitor monomers and an auxiliary frame, solidifying a negative electrode of the single-layer capacitor monomers to obtain a laminated body, dipping the negative electrode of the laminated body, assembling the laminated body to a frame lead, welding a positive electrode area of the laminated body with the frame lead, and connecting the negative electrode of the laminated body with the frame lead. And cutting off the redundant part of the auxiliary frame to complete lamination preparation. The laminated auxiliary frame has the function of a positive electrode gasket, and the height difference between the positive electrode and the negative electrode of the single-chip capacitor unit can be effectively reduced. The laminated auxiliary frame can be integrally impregnated with conductive slurry after being laminated, so that the connection between the cathode units of the capacitor is enhanced, and the equivalent series resistance is reduced.

A multi-layered capacitor including a capacitor body including a dielectric layer and an internal electrode; and an external electrode disposed on an outer side of the capacitor body, wherein the dielectric layer includes a plurality of dielectric crystal grains, and the dielectric crystal grains include a core containing BaTiO3, a first shell disposed on the core and containing BaTiO3 doped with a first doping element of Sr, Ca, Bi, K, Na, or a combination thereof, and a second shell disposed on the first shell and containing a first coating element of Nb, Ta, or a combination thereof.

A method for manufacturing a sealed container lid includes arranging an insulating flange 42 so as to overlap with a terminal flange 32, heating the insulating flange 42 overlapping with the terminal flange 32, pressing the insulating flange 42 on the terminal flange 32 in a state where a pair of pressure portions 55, 56 sandwich the terminal flange 32 and the heated insulating flange 42, and joining the insulating flange 42 to the terminal flange 32, arranging the insulating flange 42 so as to overlap with a lid body 15, heating the insulating flange 42 overlapping with the lid body 15, and a pressing the insulating flange 42 on the lid body 15 in a state where the pair of pressure portions 55, 56 sandwich the lid body 15 and the heated insulating flange 42, and joining the insulating flange 42 to the lid body 15.

A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer includes a plurality of dielectric grains, and wherein the plurality of dielectric grains include one or more first dielectric grains in which a sum of lengths of defects in a dielectric grain is 150 nm or more.

This invention relates to the field of capacitor technology, and in particular to a capacitor production equipment, comprising a machine base, a conveying device, a clamping device, a straightening device, and a lead insertion device. The machine base is equipped with a feeding machine; the conveying device is located on the machine base; the clamping device is located on the machine base and is used to transfer elements from the feeding machine to the conveying device, separating the leads of the elements during the transfer; the straightening device is located on the machine base and is used to straighten tilted elements on the conveying device; the lead insertion device is located on the machine base and is used to insert the leads of the elements conveyed by the conveying device into caps. This capacitor production equipment uses automated means to insert the leads of elements into caps, achieving a high degree of automation and high efficiency, making it highly worthy of promotion.

The invention provides a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes: a capacitor body including a dielectric layer and an inner electrode layer; and an outer electrode disposed on an outer surface of the capacitor body, in which the inner electrode layer includes nickel (Ni), and a space lattice side length of the nickel (Ni) obtained according to Formula 1 by X-ray diffraction (XRD) analysis on the inner electrode layer is about to about [Formula 1] in Formula 1, lambda is a wavelength of a Cu K alpha ray, values of lambda are h, k and l are crystal plane indexes, and theta is a Bragg angle.

A ceramic electronic component according to an embodiment of the present invention includes an element body including a capacitive part in which a plurality of dielectric layers containing a ceramic as a main component and a plurality of internal electrode layers are laminated on each other. All elements of Al or Cr, Fe, and Si are present in the capacitive part, and at least one of these elements is precipitated in the internal electrode layers.

Provided is a capacitor that is lightweight yet can reduce moisture absorption. The capacitor comprises a capacitor element and a protective film. The capacitor element has a first end-face electrode, a second end-face electrode, and an outer peripheral surface. The second end-face electrode exists at the side opposite to the first end-face electrode. The outer peripheral surface exists between the first end-face electrode and the second end-face electrode. The protective film has a first protective part, a second protective part, and a third protective part. The first protective part protects the peripheral edge part of the first end-face electrode. The second protective part protects the peripheral edge part of the second end-face electrode. The third protective part is connected to the first protective part and the second protective part, and protects the outer peripheral surface.

The special-shaped capacitor electrode terminal positioning device comprises two limiting longitudinal arms and a positioning transverse arm, each limiting longitudinal arm is provided with two special-shaped capacitor width size limiting arms and two special-shaped capacitor height size limiting arms, and the positioning transverse arm is provided with two positioning transverse arms. The two special-shaped capacitor width size limiting arms and the two special-shaped capacitor height size limiting arms are arranged and distributed on the same limiting longitudinal arm at intervals, and the height of the bottom end faces of the two special-shaped capacitor height size limiting arms is larger than that of the bottom end faces of the two special-shaped capacitor width size limiting arms. The two limiting longitudinal arms are connected with a positioning cross arm at a position between the two special-shaped capacitor height size limiting arms, and positioning hole sites matched with special-shaped capacitor electrode leading-out terminals for positioning are distributed on the positioning cross arm. The cross section of the side surface of the special-shaped capacitor is provided with a capacitor structure with step-shaped high and low top end surfaces with different heights. The occupied space is smaller and more reasonable, and the circuit wiring is more reasonable.

To provide a reliable multilayer electronic component and a method of manufacturing the same.SOLUTION: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The dielectric layer includes a plurality of dielectric crystal grains. The dielectric crystal grains include one or more first dielectric crystal grains in which a sum of lengths of defects in a dielectric crystal grain is 150 nm or more.SELECTED DRAWING: Figure 10

The present invention provides an automatic end silver coating and clamping machine for the production of capacitor core groups, which includes a vibrating tray, a workbench, and a handling mechanism. The handling mechanism includes a Y-axis servo module, a flipping assembly, handling fingers, and an X-axis servo module. The workbench is provided with a slurry scraping mechanism for silver coating the end of the core group, a clamping mechanism for pressing and forming the end of the core group and the electrode plate, a material conveying mechanism, and a tooling blanking mechanism, which includes a slicing die, a sheet taking mechanism, a sheet feeding mechanism, and a downward pressing and bending machine. When silver coating the end of the core group in the present invention, the silver coating amount on the end of the core group is large, the coating is uniform, the connection area with the electrode at the end of the core group is increased, the connection tightness between the core group and the electrode plate is good, the bonding strength is high, and it is not easy to fall off, ensuring the silver paste coating quality on the end of the core group; the number of silver coating times on the end of the core group is increased, the thickness of the silver paste at the end is increased, the connection reliability is improved, and the capacitance value drift and the failure of no capacitance of the mica capacitor are avoided.

The invention discloses a wafer capacitor adopting a carbon fiber pin and a production process and production equipment thereof. The wafer capacitor comprises a wafer capacitor body, a silver electrode and the carbon fiber pin. The production process comprises the steps of adsorbent preparation, carbon fiber wrapping with the adsorbent, pre-reduction reaction, insulation layer wrapping and wafer capacitor preparation. The production equipment comprises a lifting pool, a silver ion soaking pool, a phosphorous acid soaking pool, a hot extrusion mechanism, an extruder and a laser welding unit. According to the method, carbon fibers are wrapped with an adsorbent with high silver adsorption, a porous conductive carbon fiber structure with a nano-silver wire network is produced through pre-reduction of a reducing agent and a high-temperature reducing atmosphere reaction, and tin-free welding is carried out on a high-silver-content modified carbon fiber pin and silver on the surface of a wafer capacitor through laser welding; and the obtained product has the advantages of light weight, high strength, high conductivity, high welding strength, corrosion resistance, high temperature resistance and the like, so that the wafer capacitor adapts to a severe environment, and the application range is widened.

The invention relates to the technical field of capacitor generation, in particular to an automobile capacitor glue pouring packaging device. An automobile capacitor glue pouring packaging device comprises a conveying line used for conveying a capacitor body, a lifting mechanism used for lifting a capacitor to be processed is arranged at the front end of the conveying line, and the lifting mechanism lifts the capacitor to be processed to be equal to the conveying line in height and then transfers the capacitor to be processed into a glue pouring mechanism for glue pouring operation of the capacitor to be processed. And the capacitor after glue filling is transferred to the terminal bending mechanism for terminal bending, the capacitor after terminal bending is transferred to the terminal welding mechanism, the welded capacitor is transferred to the visual detection mechanism, and the capacitor after detection is guided out by the conveying line. A to-be-processed capacitor is lifted by the lifting mechanism to be flush with the conveying line and then is transferred, the to-be-processed capacitor is subjected to glue filling by the glue filling mechanism, shaping by the terminal bending mechanism and connection by the terminal welding mechanism, then the quality is screened by the visual inspection mechanism, qualified products are finally guided out by the conveying line, and packaging is completed.

The invention provides a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes: a capacitor body including a dielectric layer and an inner electrode layer; and an external electrode disposed on an outer surface of the capacitor body, the capacitor body includes an effective portion in which the dielectric layers and the inner electrode layers are alternately disposed, side edge portions disposed at two side end portions of the effective portion opposite to each other, and bonding portions disposed between the effective portion and the side edge portions, respectively. And at least one of the effective portion and the side edge portion includes a barium titanate-based main component including barium (Ba) and titanium (Ti), and gallium (Ga).

An intaglio jig (100, 300) for manufacturing an electronic component (10, 200) having an external electrode (30 to 38, 240, 250) by applying a conductive paste (P) to an electronic component body (20, 210) includes an elastic body (110, 310), and a recessed portion (120, 320) that is formed in the elastic body and in which the conductive paste is contained. The recessed portion includes an opening (121, 321) having an opening width (W2, W6) that conforms to a width (W1, W5) of the external electrode, a bottom surface (122, 322) at a predetermined depth (D) from the opening, and at least one protrusion portion (130 to 132, 330) in which a protrusion height (H1, H2) locally protruding from the bottom surface is less than the predetermined depth (D).

The present application is directed to a method for establishing an electronic connection to an electronic component and chip assembly. The method includes the following steps: an electronic component having a first weld is provided; a first electrical contact is also provided; the first weld and the first electrical contact are in mechanical contact with each other; then, while the mechanical contact is maintained, a welding current is applied capable of welding the electrical contact and the weld together.

The capacitor pin shaping device is characterized by comprising a bottom plate, a movable die is arranged on the left side of the middle of the bottom plate, a fixed die is arranged on the right side of the middle of the bottom plate, the fixed die is fixedly connected with the bottom plate, a clamping groove is formed in the middle of the left side face of the fixed die, an elastic silica gel pad is arranged on the bottom face of the clamping groove, and a clamping piece is arranged in the middle of the right side face of the movable die; the clamping pieces are clamped in the clamping grooves and connected with the clamping grooves in a linear moving mode, shaping air cylinders are arranged at the left end and the right end of the bottom plate, and side dies are arranged at the piston rod ends of the shaping air cylinders. The shaping cylinders, the side die, the movable die and the fixed die are arranged, and the shaping cylinders at the two ends are synchronously and oppositely started, so that automatic shaping of the pin B value of the six-pin capacitor is realized; the first pressing plate and the second pressing plate are adopted to form wedged connection, the front first pressing plate and the rear first pressing plate are driven to linearly move towards the interior of the bottom plate, automatic shaping of the P value of the pins of the six-pin capacitor is achieved, shaping of the P value and shaping of the B value are conducted synchronously, and the shaping work efficiency is greatly improved.