488results about "Terminal applying apparatus" patented technology

A capacitor capable of being incorporated into a packaging substrate, characterized in that the capacitor comprises a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower side. A packaging substrate containing the capacitor, and a method for producing the same are also provided.

In a ceramic electronic component, an electrically conductive resin layer is arranged to cover a thick film layer and to extend beyond the end of the thick film layer by at least about 100 μm and a plating layer is arranged to cover the electrically conductive resin layer except a region having a dimension of at least about 50 μm and extending along the end of the electrically conductive resin layer. Consequently, the concentration of the stress is reduced.

There is provided a multilayer ceramic electronic component, including: a ceramic body; and internal electrodes formed inside the ceramic body and having a plurality of non-electrode regions, wherein, on a cross-section taken in length and thickness directions of the ceramic body, when a thickness of the internal electrode is denoted by Te, a continuity of the internal electrode is denoted by C, an area of the internal electrode is denoted by Ae, an area of the plurality of non-electrode regions is denoted by Ao, and a maximum diameter of the non-electrode region having the maximum diameter among the plurality of non-electrode regions is denoted by Pmax, 0.1 μm≦Te≦0.5 μm, 1.1%≦Ao/Ae≦3.2%, Pmax≦120 nm, and 95%≦C≦99.5% are satisfied.

A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal contained in the inner electrode.

A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.

A coin-type electrochemical element enabling the external lead terminal portions to be accurately and reliably attached to a first lid portion and to a second lid portion of the coin-type electrochemical element, and a method of its production. Coin-type electric double layer capacitor (11) includes first lid portion (19) and second lid portion (18). External lead terminal portions (28) and (33) having a nearly triangular shape are separately connected to the outer surfaces of the lid portions. Upon providing external lead terminal portions (28) and (33) having the triangular shape, welded portion (35) is allowed to have an increased area enabling the coin-type electrochemical element of even a small size to be accurately and reliably welded and making it possible to provide the coin-type electrochemical element having excellent reliability.

A process for forming a multilayer ceramic device. The device includes forming a ceramic precursor layer followed by ink jet printing in alternating order an electrode precursor in a predetermined pattern on the ceramic precursor layer to form an electrode and a ceramic ink on the electrode. The ceramic precursor is then sintered.

An ultracapacitor electrode termination contact interface adapted for use in an energy storage device is disclosed. The disclosed apparatus and article of manufacture function to lower equivalent series resistance of the ultracapacitor electrode termination contact interface. In one embodiment of the present teachings, an ultracapacitor electrode termination contact interface, adapted to increase reliability and manufacturing yield of such devices is disclosed.

A multi-layer ceramic capacitor includes: a body, a first external electrode, and a second external electrode. The body includes a first end surface and a second end surface that face each other, a side surface that extends between the first end surface and the second end surface, a first recess that extends along a first ridge of the first end surface and the side surface, a second recess that extends along a second ridge of the second end surface and the side surface, a first internal electrode that is drawn to the first end surface and the first recess, and a second internal electrode that faces the first internal electrode and is drawn to the second end surface and the second recess. The first external electrode covers the body from the first end surface. The second external electrode covers the body from the second end surface.

A ceramic capacitor having a ceramic body and terminal electrodes, the ceramic body being substantially a rectangular parallelopiped in shape, the terminal electrodes being provided at the two ends of the ceramic body in the length direction, each terminal electrode being provided to cover one end face of the ceramic body in the length direction, part of the two surfaces in the width direction, and part of the two surfaces in the thickness direction, wherein, when the length of the ceramic body is L1 and the maximum lengths of the terminal electrodes at the two surfaces of the ceramic body in the width direction are L3 and L4, 0<=|(L4-L3|/L1<=0.0227 is satisfied. One surface among the two surfaces of the ceramic body in the width direction is the paste introduction side in the roller coating, while the other surface is the paste escape side in the roller coating.

The invention discloses a manufacturing process of a vertical ceramic patch capacitor and a capacitor product of the vertical ceramic patch capacitor, and belongs to the technical field of microelectronics. The process comprises the steps of material preparation, in which raw materials are mixed according to a proportion; coating, in which a layer of uniform paste thin film is formed from paste bya coating machine; printing, in which internal electrode paste is printed onto a ceramic film by a screen printing plate according to the process requirement; lamination, in which the printed ceramicfilms are laminated to form green blank having different layers; lamination, in which the green blank is loaded in a lamination bag; cutting, in which the laminated large green blank is cut to relatively small blanks; gluing, in which the cut blank blocks are glued; sintering, in which the green blank is sintered to form a ceramic body; chamfering, corners of the product of the capacitor sinteredto form ceramic are chamfered; sealing, in which the product is sealed to form the ceramic body; and sintering, in which the ceramic body is sintered to form the ceramic capacitor. The purpose of changing the shape of the capacitor and the electrode direction is achieved by changing an electrode printing method, a cutting method and a coating process, so that the installation and the applicationof a capacitor in a flat package component can be adapted.

A metal foil for capacitor element is produced through a process comprising steps of etching and then electrochemically forming a metal foil after making cut lines each in a shape of a capacitor element with at least a part of a portion predetermined to be an anode-leading-out-part left uncut. The step of etching the foil is preferably performed with the anode-leading-out-parts being protected by protective material. Solid electrolytic capacitor elements prepared by using the metal foil have narrow variation in capacitance.

The invention relates to the technical field of capacitor preparation, in particular to a fully automatic nailing and winding integrated machine. The automatic nailing and winding integrated machine comprises a foil conveying mechanism, a needle conveying mechanism, a nailing mechanism, a winding mechanism and a cutting mechanism, and the nailing mechanism only needs to move the mold assembly to be movable in the first direction And the movement of the molds on the mold assembly in the second direction can complete the nailing of the guide pins and the foil strips without changing the positionof the foil strips, omitting the foil-rolling wheel, and avoiding the foil-feeding wheel during the transmission process The error caused by the change of the tension improves the precision of the hole position of the first nailing hole and the second nailing hole, ensures the quality of the nailing, and improves the yield of the automatic nailing and winding machine.

The invention discloses a Hall chip forming tool comprising an upper die holder, a lower die holder, a plurality of guide pillars and a feeding guide slot, wherein the upper die holder and the lower die holder are respectively provided with an upper die block assembly and a lower die block assembly; the upper die block assembly comprises an upper die fixing block, an upper blade and an upper die pressing block; the lower die block assembly comprises a lower die fixing block, a lower blade, a lower die pressing block and a lower die forming block; the end of the lower die fixing block is provided with a hinge and a cam, and the cam is right positioned under the hinge to be matched with the hinge; and the upper die holder is provided with an air cylinder, and a piston rod of the air cylinder is fixedly connected to the upper surface of the upper die holder. The Hall chip forming tool disclosed by the invention adopts a once fixation and multi-forming mode so as to avoid the damage to a chip part and a capacitor part. The structure of the Hall chip forming tool is once fixed by adopting a spring buffering method so as to prevent a Hall chip pin from being pressed to be transformed. In addition, the Hall chip forming tool disclosed by the invention adopts a hinge structure to assist 90 DEG forming, so that the production efficiency is enhanced.

The invention discloses a welding and locating device of a capacitor. The welding and locating device comprises a locating and welding pressing plate and two side wall clamping plates, wherein the two side wall clamping plates are arranged in a length direction, two end heads of the two side wall clamping plates are respectively provided with an end head baffle plate, the upper and the lower end surfaces of the front end head baffle plate and the rear end head baffle plate are respectively provided with a locating and locking post, the rear end head baffle plate is provided with an end head clamping and adjusting structure in the length direction of the welding and locating device, the end head clamping and adjusting structure comprises an inner clamping piece which is arranged at the inner side of the rear end head baffle plate and a clamping and adjusting operation handle which is arranged at the outer side of the rear end head baffle plat, a clamping and adjusting connecting rod is connected between the inner clamping piece and the clamping and adjusting operation handle, and a clamping and adjusting spring is sleeved on the clamping and adjusting connecting rod between the inner clamping piece and the rear end head baffle plate. The welding and locating device disclosed by the invention has the advantages that a capacitor bank which needs to be located and welded can be freely and flexibly adjusted and clamped in the length direction and the width direction, quick and effective locating and welding operation can be carried out, the welding efficiency is high, and the labor intensity and the difficulty of production operation are reduced.