Fan wheel structure

a technology of fan wheel and structure, applied in the direction of liquid fuel engine, vessel construction, marine propulsion, etc., can solve the problems of increasing manufacturing cost, requiring more complicated manufacturing processes, and computer producing a large amount of heat, so as to reduce cost and effectively reduce manufacturing cost

Inactive Publication Date: 2015-06-11
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a fan wheel structure that includes a ring member and a rotor, which can be manufactured at lowered cost. The fan wheel structure allows for easy changes in blade rotating direction by simply fitting the rotor in the ring member from a different open end. This eliminates the need for separate molds for different blade rotating directions and reduces manufacturing costs.

Problems solved by technology

When a personal computer operates, the IC chips with high circuit density, such as the central processing unit (CPU) and the graphics processing unit (GPU), of the computer will produce a large amount of heat.
In brief, the prior art fan wheel structures have the following disadvantages: (1) requiring increased manufacturing cost; and (2) involving more complicated manufacturing processes.

Method used

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Embodiment Construction

[0018]The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.

[0019]Please refer to FIGS. 2, 3, 4, 5A and 5B at the same time. A fan wheel structure according to a preferred embodiment of the present invention includes a ring member 2 and a rotor 4. The ring member 2 has two opposite open ends 21, namely, a first and a second open end, and an inner space 23 defined between and communicable with the two open ends 21. A blade seat 3 is integrally connected to an outer side of the ring member 2 and has a plurality of blades 31 formed on an outer surface thereof. The blades 31 are equally spaced on the outer surface of the blade seat 3. The blade seat 3 and the blades 31 thereof are directly molded on the outer side of the ring member 2 by way of insert molding, so that the r...

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Abstract

A fan wheel structure includes a ring member and a rotor. The ring member has two opposite open ends and an inner space defined between and communicable with the two open ends. A blade seat having a plurality of blades formed therearound is insert-molded on an outer side of the ring member. The rotor includes a hub fitted in the inner space of the ring member to associate with the ring member and the blade seat, and a rotary shaft having a coupling end inserted into the hub. The rotor can be fitted in the inner space of the ring member from either of the two open ends thereof for the completed fan wheel structure to have either a clockwise or a counterclockwise blade rotating direction. Therefore, only one mold, and accordingly an effectively reduced cost, is needed for manufacturing the fan wheel structures of different rotating directions.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a fan wheel structure, and more particularly to a fan wheel structure that includes a ring member with a blade seat and a plurality of blades insert-molded on an outer side thereof and a rotor adapted to be fitted in the ring member from either of two open ends thereof to thereby enable manufacturing of fan wheel structures of different blade rotating directions without the need of making two molds.BACKGROUND OF THE INVENTION[0002]With the constantly increased density of the electronic circuits on one single integrated circuit (IC) chip in recent years, the heat produced by each IC chip during operation thereof is also constantly increased. When a personal computer operates, the IC chips with high circuit density, such as the central processing unit (CPU) and the graphics processing unit (GPU), of the computer will produce a large amount of heat. For these IC chips to maintain normal operation over a long period of time, i...

Claims

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Application Information

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IPC IPC(8): F01D5/22
CPCF01D5/225F04D19/002F04D29/263F04D29/329
InventorCHANG, BOR-HAW
OwnerASIA VITAL COMPONENTS SHENZHEN CO LTD