Selective Resistive Sintering - A New Additive Manufacturing Method
a selective resistive sintering and additive manufacturing technology, applied in the direction of additive manufacturing processes, printing, inking apparatus, etc., can solve the problems of imposing material-specific limitations, slow manufacturing speed of sls and ebm processes, and requiring extra time for powder, so as to improve the existing selective laser sintering technology and improve the printing speed of sls. , the effect of improving the printing speed
Pending Publication Date: 2022-03-24
THE BOARD OF TRUSTEES OF THE UNIV OF ARKANSAS
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AI Technical Summary
Benefits of technology
This approach significantly boosts printing speed, reduces energy consumption, and allows for high-volume production while maintaining substrate integrity, improving conductivity and eliminating the need for post-drying and curing steps in printed electronics.
Problems solved by technology
However, the SLS and EBM processes suffer from slow manufacturing speed, which is primarily limited by the point-wise scanning process.
Although these processes, as they are further developed, may improve 3D printing, they have two main drawbacks.
Infrared radiation is an indirect energy source that needs to be converted into heat for sintering, which often imposes material-specific limitations and requires extra time for the powder to absorb the radiation.
The second drawback is the exposure timescale.
Another disadvantage is that in printed electronics, which is usually done by printing metal nanoparticle suspension ink on a plastic substrate, ink is typically dried and sintered (usually in an oven) to make conductive circuits.
The challenge is that the sintering temperature is usually limited by the highest temperature the plastic substrate can stand (usually below 300 C) and therefore the conductivity of the sintered nanoparticles is usually much worse than the bulk metal conductivity.
Method used
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[0054]Detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention, which may be embodied in various forms. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention in virtually any appropriately detailed method, structure or system. Further, the terms and phrases used herein are not intended to be limiting, but rather to provide an understandable description of the invention.
[0055]In general, as shown in FIG. 1A, general embodiments of the present invention provide a microheater 100 having a heating array 102 that is comprised of one or more resistive heating elements 110-115 that may be resistive filaments miniaturized to ˜100 nm to ˜100 μm typically with MEMS fabrication techniques. The filaments are generall...
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Abstract
Description
RELATED APPLICATIONS[0001]This application is a continuation of U.S. Ser. No. 16 / 495,381 filed on Sep. 18, 2019, which is a 371 National Phase of PCT / US2018 / 025957 filed on Apr. 3, 2018, which claims the benefit of U.S. Provisional Application No. 62 / 480,815 filed Apr. 3, 2017, all of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]Selective laser sintering (SLS), and its variants (e.g., electron beam melting), uses an energy beam as the energy source to selectively induce fusion between powder particles layer by layer to build 3D structures. However, the SLS and EBM processes suffer from slow manufacturing speed, which is primarily limited by the point-wise scanning process. Several other powder-bed processes have been developed or are under development to address this issue, including multi-beam laser additive manufacturing (MB-LAM), selective mask sintering (SMS), high-speed sintering (HSS), selective inhibition sintering (SIS), selective heat sinterin...
Claims
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IPC IPC(8): B41J2/14B29C64/153B29C64/295B41J2/335
CPCB41J2/14129B29C64/153B33Y30/00B41J2/33515B41J2/3355B29C64/295B41J2/32B41J2/447B33Y50/02B41J2202/13
InventorZHOU, WENCHAOVAN HORN, AUSTINHOLT, NICHOLASGALVAN MARQUES, LUCAS
OwnerTHE BOARD OF TRUSTEES OF THE UNIV OF ARKANSAS