Optical device inspecting apparatus

a technology for optical devices and inspection apparatuses, which is applied in the direction of optical apparatus testing, semiconductor/solid-state device testing/measurement, instruments, etc., can solve the problems of warping of the substrate, slippage of the needle, and the determination of defective devices of good quality, so as to improve the workability of fixing the probe and eliminate the harmful effects of adjacent chips. , the effect of more accurate inspection

Inactive Publication Date: 2012-04-17
NIHON DENSHIZAIRYO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0021]According to the present invention, an inspection device for an optical device including a plurality of optical sensors in a sensing area comprises a light source for projecting light onto the optical device for inspection; wherein a pupil lens is provided between the light source and the sensing area, the pupil lens making the angle of incident of projected light lower as the pupil lens becomes farther from the center of the optical system thereby allowing for inspection of the optical device under the conditions of the actual use.
[0022]According to the present invention, an inspection device for an optical device comprises: a probe card unit and a lens unit; wherein the probe card unit includes a main substrate, a guide plate and a probe; the main substrate and the guide plate being provided with an opening; the guide plate being fixed to a certain location of the main substrate and provided with a plurality of probe insertion holes; the probe being disposed and fixed in the probe insertion hole of the guide plate and having a end part projecting out from the insertion hole in the shape of a cantilever; the lens unit including a pupil lens, being disposed in the opening provided in the main substrate, and making the angle of incident of light that is projected onto an device being inspected lower as the pupil lens becomes farther from the center of the optical system thereby enabling inspection of the optical device under the conditions of actual use, which results in a more accurate inspection.
[0023]In addition, the guide plate is provided with a groove, the probe insertion hole is disposed in the bottom of the groove, and the probe is fixed in the groove with resin thereby improving the workability in fixing the probe.
[0024]Further, the inspection device further comprises a light blocking member for blocking a beam of light projected by the lens unit onto the probe thereby eliminating the harmful effects to adjacent chips.
[0025]Further, the light blocking member is the guide plate thereby eliminating the need of an extra light reflection plate.

Problems solved by technology

In inspecting the output sensitivity of the sensor of an optical device whose optical sensor is offset from the microlens as described above, it is problematic that if a collimated beam is used for the inspection, the output sensitivity of a sensor that is offset from the device, especially of a sensor that is greatly offset, represents low, and therefore, even a device of a good quality is determined to be defective.
There are problems, however, with the conventions devices in that some eight chips are the maximum of the number of chips to be taken and in that enlarging the opening to take a plurality of chips causes warp of the substrate and slippage of the needle.

Method used

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Embodiment Construction

[0033]The present invention will now be described more specifically with reference to the drawings. FIG. 2 is a schematic view of an inspection device for an optical device according to the present invention. FIG. 3 is a cross sectional view of the entire inspection device for an optical device.

[0034]An inspection device 4 for an optical device according to the present invention comprises a probe card unit 5 and a lens unit 6. The probe card unit 5 and the lens unit 6 are integrated.

[0035]The probe card unit 5 comprises a main substrate 8, a guide plate 9 and a probe 7. The main substrate 8 and the guide plate 9 are provided with an opening. The guide plate 9 is fixed to a certain location of the main substrate 8 and provided with a plurality of probe insertion holes 10.

[0036]An insertion part 22 of the probe 7 is disposed and fixed in the probe insertion hole 10 provided in the guide plate 9. An end part 23 of the probe 7 projects out from the probe insertion holes 10. Here, as ill...

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Abstract

[PROBLEMS] To provide an optical device inspecting apparatus which can be set to take many objects at one time more freely compared with conventional apparatuses, and furthermore, can accurately inspect even an optical device wherein an optical sensor is offset from a microlens. [MEANS FOR SOLVING PROBLEMS] Provided is an optical device inspecting apparatus having a probe card unit and a lens unit. The probe card unit is provided with a main substrate, a guide plate and a probe. Openings are made on the main substrate and the guide plate. The guide plate is fixed at a prescribed position from the main substrate, and is provided with a plurality of probe inserting holes. The probe is inserted into the probe inserting hole on the guide plate and fixed. The leading end portion of the probe protruding from the inserting hole has a shape of a cantilever. The lens unit using a pupil lens is arranged at the opening on the main substrate, and makes light applied to an inspecting object incline as the light goes further from the center of the optical system.

Description

TECHNICAL FIELD[0001]The present invention relates to inspection devices for optical devices that are used to inspect so-called optical devices such as photoelectric conversion devices including an image sensor and a solid-state image sensor.PRIOR ART[0002]Inspection of so-called optical devices such as photoelectric conversion devices including an image sensor and a solid-state image sensor requires measurement of characteristics by projecting light onto an image-sensor member. For example, the inspection of a solid-state image sensor is performed as follows:[0003]A chip of solid-state image sensor 1 has a side length of ten mm or less and is provided with a sensing area 2 in the middle of the chip surface. The sensing area 2 is embedded with hundreds of thousands to millions of optical sensors, and formed along the four sides of the sensing area 2 is an electrode pad 3 (refer to FIG. 1).[0004]To inspect the operation of the solid-state image sensor 1, light is projected onto the s...

Claims

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Application Information

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Patent Type & AuthorityPatents(United States)
IPC IPC(8): G01B9/00
CPCG01M11/0214G01M11/0257G01R1/07342G01N21/956G01R31/308G01R31/2641G01M11/00G01R1/073H01L22/00
InventorOSAWA, SHIGEMIKOMURO, KAZUMA
OwnerNIHON DENSHIZAIRYO