Applying a first under drive voltage lower than verify levels reduces time spent maintaining high voltages, improving program speed across multiple loops.
A semiconductor memory device segments programming operations into distinct modes to control threshold voltage transitions across memory cells.
A decoupling circuit adjusts control gate line voltages to mitigate parasitic capacitance in flash memory arrays.
A controller dynamically calculates read voltage threshold shifts for boundary word lines in non-volatile memory arrays.
Integrating a diode-connected transistor in non-volatile memory cells limits capacitor voltage stress, preventing breakdown and ensuring data integrity.
Dynamic frequency switching in a dual charge pump circuit reduces setup time and stabilizes output voltage without adding smoothing capacitance.
Segmented source lines in vertical semiconductor strings prevent threshold voltage instability caused by shared line resistance during programming.
Dynamic pumping clock frequency adjustment reduces peak operating currents while maintaining programming efficiency in nonvolatile memory devices.
A non-volatile memory read method adjusts bit line voltages based on sensed cell temperature to maintain accurate data sensing.
A bi-directional I/O port executes multi-address read operations by alternating input and output modes to optimize throughput.
A flash memory erase method uses dedicated column lines to record cell states and determine sector completeness without full verification.
A control circuit adjusts bit line voltages during program and erase verifying operations to improve retention characteristics in multi-level cell memory devices.
A monitoring circuit detects voltage drops in the power-on-reset signal, enabling error logging for storage controller shutdown troubleshooting.
Dynamic source voltage adjustment compensates for resistance variations along the NAND string, improving sensing reliability without body biasing.
Coupling circuit connects page buffer terminals to local I/O lines, reducing parasitic capacitance and precharge time to improve operating speed.
A nonvolatile memory capacitor distributes voltage pulses to a variable resistance element.
A floating controller isolates word lines to detect weak bridges in densely packed memory cells, improving reliability.
Reducing the inhibit voltage below the supply level minimizes RC coupling delays, enabling faster bit line charging and improved programming speed.
A one check fail byte scheme consolidates failure verification into a single progressive check per voltage level.
A differential fuse sensing system uses a variable reference current generator to equalize amplifier input voltages for accurate eFUSE state detection.
Address conversion circuits eliminate dummy clock signals during interleave operations, reducing circuit complexity and increasing operation speed.
Each memory channel uses an independent delay locked loop to adjust its delay, eliminating the need for a master controller and reducing device complexity.
Segmenting program loops with distinct parameters reduces overlapping threshold voltage distributions, improving data retention reliability.
Booster circuit charges all word lines to high voltage before address confirmation, then switches to lower voltage for selected lines to reduce read time.
A nonvolatile memory device uses a current source and bit line switch to selectively couple memory cell strings for sensing operations.
Periodic voltage pulses narrow threshold voltage distribution in ONO memory cells, preventing over-programming and over-erasing.
Segmenting sense amplifiers into local circuit groups reduces data bus length and limits current flow through wiring, lowering power consumption.
Control circuits activate adjacent word lines during redundancy replacement to prevent data degradation from electromagnetic coupling effects.
Segmenting memory banks with switches isolates partitions from mutual disturbance, maintaining stable biasing reference voltages for accurate data verification.
Masked verify logic forces predetermined results for unavailable portions of partial memory dies, preventing false errors and increasing manufacturing yield.
Segmented source regions enable dopant out-diffusion to form heavily doped pillars, resolving performance complexity trade-offs.
A semiconductor storage device uses multiple voltage step-up circuits to supply word lines during read operations.
A memory device control circuit manages the recovery phase duration and voltage ramp-down timing to suppress program disturb during write operations.
Segmented dummy word lines isolate selected cells from program disturb, ensuring consistent threshold voltage distribution.
Bypass pin triggers direct NAND access, reducing pin count and boosting testing throughput.
Adjusting global word line voltage based on detected well potential suppresses off-leakage currents, reducing power consumption and shortening erasing time.
Fractional reference voltages differentiate adjacent bit states, reducing read complexity and time.
Peripheral circuit applies distinct erase voltages to target and non-target memory strings during operation.
A bias supply circuit generates a stable voltage for memory cells using shared bias memory cells to reduce area consumption.
Nonvolatile memory blocks apply data shaping to reduce power consumption and programming time.
Controller manages memory cell array write sequences to stabilize threshold voltages against coupling capacitance fluctuations.
Merging fail address registers across column decoders reduces memory device area while maintaining repair capability.
Power-voltage driver circuit interrupts current path between output node and power source voltage using specific MOS transistor configurations.
A driving method uses an oxide semiconductor writing transistor to hold electric charge on a capacitor node without frequent refresh operations.
Applying blind voltages determines verify start times, reducing programming time while maintaining data accuracy across program levels.
A nonvolatile memory device selects verify voltages based on common source line noise levels to determine cell program states.
Segmented OTP memory blocks with verification logic ensure data integrity by writing to a secondary block when primary programming fails.
A 3D NAND flash programming method removes the ISPP pre-pulse phase to reduce electron injection and optimize channel potential differences.