The invention provides a method for testing the
cutting damage depth of III-V family single crystals, which is characterized by comprising the following steps: S1, cleaning the surface of a
wafer, S2, measuring the initial thickness of the
wafer, S3, pasting a protective film, S4, carrying out step-by-step
corrosion to obtain a step table surface, S5, carrying out preferential
corrosion liquid to enable the
cutting damage to appear, S6, observing and testing the surface of the step of the
wafer, and S7, testing the
cutting damage depth of the III-V family single crystals. And obtaining the cutting damage depth of the III-V family
single crystal. The method is high in test precision, can detect sub-damage defects which cannot be detected by an existing test method, is simple and time-saving in
sample preparation and operation, and is high in
test efficiency. By adopting the method disclosed by the invention, the damage caused by the cutting process of the III-V family
single crystal can be quantitatively evaluated so as to guide the improvement of the cutting process, and meanwhile, quantitative guidance can be provided for the removal amount of the III-V family wafer surface treatment process.