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Front-opened cassette configured with inflatable strutting piece modules

An inflatable support, wafer box technology, applied in electrical components, internal accessories, packaging objects under special gas conditions, etc., can solve the problems of easy generation of particles, excessive contact area, insufficient wafer support, etc., to increase the pass rate , the effect of reducing particle generation

Active Publication Date: 2010-03-31
GUDENG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] According to the wafer box of the prior art, the inflatable support module inside the box body is likely to cause problems such as insufficient wafer support force, excessive contact area, and easy generation of particles. A main purpose of the present invention is to provide an inflatable support module. In the front-opening wafer box of the module, the inflatable support module is arranged between the side wall and the rear wall of the box body and the module has at least one long slit facing the opening direction, and the long slit can eject gas to control the front opening. The state of the internal environment of the type wafer box, such as: the internal atmospheric pressure, humidity or the type of gas, etc.

Method used

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  • Front-opened cassette configured with inflatable strutting piece modules
  • Front-opened cassette configured with inflatable strutting piece modules
  • Front-opened cassette configured with inflatable strutting piece modules

Examples

Experimental program
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Effect test

Embodiment Construction

[0052] In order to make the technical content used in the present invention, the purpose of the invention and the effects achieved more complete and clear disclosure, it is described in detail below, and please refer to the disclosed drawings and figure numbers:

[0053] First, see Figure 5 and Figure 6 , is a perspective view of the box body of a front-opening wafer box of the present invention and a schematic diagram of the box body only retaining the inflatable support module. The box body 10 of the front-opening wafer box is composed of a pair of side walls 10L and a top surface 10T and a bottom surface 10B adjacent to the pair of side walls 10L, and an opening 12 is formed on one side, and the opposite opening 12 The other side of the form a rear wall 10B', wherein a pair of support modules 300 are arranged near the pair of side walls 10L close to the opening 12, and each of the pair of side walls 10L is adjacent to the rear wall 10B' An inflatable support module 200 ...

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PUM

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Abstract

The invention provides a front-opened cassette configured with inflatable strutting piece modules, comprising a cassette body and a door body, wherein the cassette body consists of a pair of lateral walls, a top surface and a bottom surface; an opening is formed at one side of the cassette body, and a rear wall is formed on the other lateral side opposite to the opening; each lateral wall is configured with a strutting piece module for holding a plurality of wafers; one internal surface of the door body is jointed with the opening of the cassette body for protecting a plurality of wafers inside of the cassette body. The front-opened cassette is characterized in that an inflatable strutting piece module is arranged at the part of each lateral wall of the cassette body adjacent to the rear wall; a long slit is configured along the direction facing to the opening; an air inlet is configured at one end of the inflatable strutting piece module and connected with a gas valve at the bottom surface; and the inflatable strutting piece module is formed by a plurality of strutting ribs in a vertical arrangement at intervals.

Description

technical field [0001] The present invention relates to a front-opening wafer box, in particular to a front-opening wafer box equipped with an inflatable support so that the gas can form a gas flow field (Gas flow field) in the front-opening wafer box ). Background technique [0002] Semiconductor wafers will be transported to different workstations due to the need to go through various processes and to cooperate with process equipment. In order to facilitate the handling of the wafers and avoid contamination from the outside, a sealed container is often used for delivery by automated equipment. Please refer to figure 1 Shown is the schematic diagram of the wafer box of known technology. The wafer box is a front opening type wafer box (Front Opening Unified Pod, FOUP), which has a box body 10 and a door body 20. The box body 10 is composed of a pair of side walls 10L and adjacent to the pair of side walls 10L. A top surface 10T and a bottom surface 10B are formed, and an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673B65D81/20B65D81/18B65D25/10
Inventor 邱铭隆洪国钧
Owner GUDENG PRECISION IND CO LTD
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