Sealant pouring and sealing method for integral electronic handle with inner cavity

Abstract

The invention relates to the field of methods for pouring fluid sealant, in particular to a sealant pouring and sealing method for an integral electronic handle with an inner cavity. The sealant pouring and sealing method for the integral electronic handle with the inner cavity comprises the following four steps of arranging an electronic module board in the inner cavity of the handle, preparing the fluid sealant, pouring the fluid sealant and weighing. The method is characterized in that the fluid sealant is obtained by mixing a component A and a component B according to the ratio of 5:1; and during sealant pouring, a one-machine double-temperature heating system is adopted, an angle is changed from time to time, and the mode of simultaneous pouring and weighing is adopted. The method has the advantages of timely coagulation of fluid sealant during pouring, no air bubble after coagulation and no influence to electronic equipment.

Description

technical field [0001] The invention relates to the field of sealing glue pouring methods, in particular to a glue pouring and sealing method for an integral electronic handle with an inner cavity. Background technique [0002] With the continuous development of the car's own technology, the door of the car can be remotely opened and closed by electronic equipment, which requires the installation of corresponding electronic equipment on the door. Now there is a handle with an electronic module that has been used in the car. , put the electronic module for control in the cavity inside the handle, and link with the door lock, and control the opening or closing of the door lock through the operation panel or remote control. Since there is a gap between the electronic module board and the inner cavity of the handle, in order to fix the electronic module board, the gap needs to be filled with glue. In order to ensure the reliable operation of the components, air bubbles should b...

AI Technical Summary

Problems solved by technology

But the existing glue injection machine is to fix the product on the fixture, such as "U" type products, often inject glue from the left end of "U", so that the glue slowly flows to the right end of "U". Bubbles are generated at the bottom of the U", so it is difficult to eliminate the generation of bubbles, which will affect the performance of the electronic module board when it is used