Pressing and breakover process and laminating board structure of circuit board

Abstract

The invention relates to a pressing and breakover process of a circuit board, comprising an inner-layer board and an outer-layer board which are made through blanking. The machining process mainly comprises the following steps of: making an inner-layer board circuit, pressing the outer-layer board, drilling, electroplating, printing, laminating boards, pressing laminating boards, making an outer-layer board circuit and printing with preventing weld paint; and then performing word printing, surface processing and shape machining for the obtained circuit board to obtain a finished product. The laminating board structure of the circuit board comprises a basal board which is formed by machining the inner-layer board and the outer-layer board through the steps, the upper surface and the under surface of the basal board are respectively provided with a layer of steel board, and the upper surface and the under surface of the steel board are respectively provided with a layer of kraft paper. Compared with the prior art, the invention has the characteristics that printing is connected with breakover, and the printing laminating boards are coherent together; relative to a laser blinding hole drilling process, the cost of the process is lower; and the laser blinding hole drilling process is changed into a pressing process subjected to printing, and normal breakover can be achieved after connection.

Description

Technical field [0001] The invention relates to a manufacturing process and a structure of a circuit board, in particular to a circuit board pressing and conducting process and a circuit board laminated structure. Background technique [0002] With the rapid development of microelectronics technology, the wide application of large-scale and super-large-scale integrated circuits, and the progress of micro-assembly technology, the manufacturing of printed circuit boards is developing towards multi-layer and multi-functionality. PCB (printed circuit board) needs to be drilled before bonding the multi-layer board. The drilling can align the corresponding copper wires at the upper and lower positions of the circuit board, and then conduct hole plating to make the hole wall with copper and make the hole conductive. The existing PCB micro-hole processing methods generally include mechanical drilling and laser drilling. [0003] At present, the production process of an existing PCB factor...

AI Technical Summary

Problems solved by technology

In laser drilling, the beam positioning system is extremely important for the accuracy of aperture forming. Although the precise positioning of the beam positioning system is used, due to the influence of other factors, the lack of flame in the hole deformation often occurs, and product quality is easy to occur during the production process. question

On the other hand, the cost of the laser drilling blind hole conduction process is relatively high

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