Composite modification method for phenolic resin adhesive

A technology of composite modification and phenolic resin, applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of no better solution, etc., and achieve easy operation and no environmental pollution , The effect of simple process

Active Publication Date: 2011-06-29
江苏泰尔新材料股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In the prior art, many technical references and inspirations have been provided for the toughening modification of phenolic resin adhesives and the reduction of phenolic content, but ther

Method used

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  • Composite modification method for phenolic resin adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Add 0.75 g of modifier organosilicon and molten phenol into the reactor, and obtain a dark red transparent solution under the operating conditions of the comparative example.

Embodiment 2

[0032] Under the operating conditions of Example 1, the modifier organosilicon was replaced with 0.5 g of sucrose and the melted phenol was added into the reaction vessel for reaction to obtain a dark red and viscous transparent solution.

Embodiment 3

[0034] Complete the polymerization process according to the operation steps of the comparative example, that is, after reflux at 90°C for 2 hours, then add 2.5 g of modifier polyoxypropylene glycol (polyether 210) into the reactor, and continue to reflux for 2 hours to obtain wine red Clear solution.

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Abstract

The invention provides a composite modification method for a phenolic resin adhesive. A mixture of organic silicon and (or) a polyhydric compound serves as a modifier in a synthetic process of phenolic resin. The composite modification method is technically characterized in that: the modifier is added in a prepolymerization reaction process or after the prepolymerization reaction; formaldehyde is added at one time under an alkaline condition; dehydration is not performed in the later period of the reaction; the whole process flow is simple and is easy to operate; the product has stable performance and does not pollute environment; and the content of free formaldehyde is low.

Description

technical field [0001] The invention belongs to the field of adhesive synthesis, and more specifically relates to a composite modification method of phenolic resin adhesive. Background technique [0002] Phenolic resin is the earliest synthetic resin to realize industrialization, and it is also one of the three major thermosetting resins. Its synthesis process is simple, its performance is highly adjustable, and its raw materials are cheap and easy to obtain, so it is widely used in various fields. Due to the brittleness of phenolic resin, the bond strength is low when it is directly used as an adhesive. Generally, the normal temperature shear strength of the phenolic resin adhesive without toughening is about 5MPa. In addition, the free formaldehyde in the product is difficult to eliminate, endangers human health, pollutes the environment, and limits its application. Therefore, the development of phenolic resin adhesives with good toughness, strong adhesion and low free f...

Claims

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Application Information

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IPC IPC(8): C09J161/14C08G8/28
Inventor 杜郢周太炎宋珊珊宋丽萍李毅刘家芳
Owner 江苏泰尔新材料股份有限公司
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