Integrated control sub-module board for simulating multi-level modular converter (MMC) sub-module

A sub-module and sub-module voltage technology, which is applied to output power conversion devices, electrical components, and AC power input to DC power output, etc., can solve the problems of high cost, difficult to reduce the size, and reduce the voltage level, and achieve high reliability. performance, communication and control pulse consistency

Active Publication Date: 2011-07-20
CHINA ELECTRIC POWER RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The second one reduces the voltage level and increases the number of cascaded modules of a single bridge arm. However, since each module has an independent controller, the contr

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  • Integrated control sub-module board for simulating multi-level modular converter (MMC) sub-module
  • Integrated control sub-module board for simulating multi-level modular converter (MMC) sub-module
  • Integrated control sub-module board for simulating multi-level modular converter (MMC) sub-module

Examples

Experimental program
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Embodiment Construction

[0042] as attached figure 1 Shown is the functional diagram of the device of the present invention, on an integrated sub-module board, a plurality of sub-modules are integrated, the number of sub-modules can be adjusted according to the size of the board, such as a standard PCB with a height of 2U can integrate about 2 sub-modules , 6U board can integrate 6-8 sub-modules.

[0043] The characteristic of the integrated sub-module board is that it is mainly divided into four parts in function:

[0044] The first is the cascade sub-module part, that is, the bridge arm voltage forming part and the bridge arm current path. Each sub-module can provide a DC voltage source. When the upper IGBT of a sub-module is turned off and the lower IGBT is turned on, the sub-module does not provide DC voltage, the bridge arm current flows from the lower IGBT or the anti-parallel diode, and the capacitor is bypassed; when the lower IGBT of a certain sub-module is turned off When the upper transist...

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Abstract

The invention relates to a sub-module circuit board used for a dynamic simulation test for simulating a high-capacity multi-level modular converter (MMC). A digital controller on the circuit board is used for controlling a plurality of MMC sub-modules of which parameters are reduced according to an exponential method, the sub-modules are connected in series. Each MMC sub-module comprises a main circuit an insulated gate bipolar transistor (IGBT) and silicon controlled rectifier driving circuit, a capacitance and voltage sampling circuit, a circuit board isolation power supply, a control and coding-decoding chip shared by a plurality of sub-modules, and a fiber channel, wherein the main circuit a capacitor, two IGBTs which are connected vertically in series and connected with the capacitor in parallel, a bypass switch connected with the lower IGBT in parallel, and a silicon controlled rectifier which is used for protecting the IGBTs and the capacitor and connected with the lower IGBT.

Description

technical field [0001] The invention belongs to the field of power electronics and relates to an integrated control submodule board for simulating a multilevel voltage source converter MMC submodule. Background technique [0002] There are currently two types of voltage source converters used in flexible DC transmission: one is a two-level or three-level converter based on high-power IGBT series technology, and the other is a module using high-voltage sub-module cascading technology Multilevel Voltage Source Converter (MMC-VSC). [0003] For the latter, its three-phase converter consists of six bridge arms, and each bridge arm is composed of multiple cascaded high-voltage sub-modules. Each high-voltage sub-module uses a power capacitor as a single DC voltage source (up to 1.2kV) that can be switched on or off, and two high-power IGBTs are connected in series as a switching switch. the emitter of the lower IGBT. The source and emitter of the down-side IGBT are respectively...

Claims

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Application Information

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IPC IPC(8): H02M7/217H02M7/219
CPCH02M2007/4835H02M7/4835
Inventor 刘栋汤广福贺之渊赵岩滕乐天俞国勤包海龙
Owner CHINA ELECTRIC POWER RES INST
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