Method for manufacturing semiconductor chips, mounting method and semiconductor chip for vertical mounting onto circuit substrates

A technology of circuit carrier and manufacturing method, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve problems such as manufacturing or assembly that are not given

Inactive Publication Date: 2012-05-30
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

WO 2008 / 016198 discloses a vertically mounted sensor chip with bonding surfaces on the end faces, but no instructions for fabrication or assembly are given

Method used

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  • Method for manufacturing semiconductor chips, mounting method and semiconductor chip for vertical mounting onto circuit substrates
  • Method for manufacturing semiconductor chips, mounting method and semiconductor chip for vertical mounting onto circuit substrates
  • Method for manufacturing semiconductor chips, mounting method and semiconductor chip for vertical mounting onto circuit substrates

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Embodiment Construction

[0035] figure 1 The finished sawn chip 10 is shown, which has the connection surface 12 on the connection surface side 14 perpendicular to the upper side 16 , which is parallel to the wafer. During assembly in the chip package, the chip 10 is rotated by 90° and the connection surface side 14 is parallel to the circuit carrier. The connection area 12 has a width 18 and a height 20 which corresponds to a typical land, ie 50 μm to 150 μm. Contact surfaces 22 are provided on the upper side 16 of the chip 10 and are connected to the circuit of the chip, indicated by the circuit 24 . In the chip manufacturing method, each connection area 12 is connected to a contact area 22 (connection not shown).

[0036] exist figure 2 , with a schematic diagram of a cut section 40 of a wafer 42 shown in FIG. 3 Figure 1 The method for manufacturing a semiconductor chip is described in different manufacturing stages a) to f), such as figure 1 A chip 10 according to an embodiment of the prese...

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Abstract

A semiconductor chip having contact surfaces on an upper side parallel to the wafer plane has terminal pads on a terminal-pad side perpendicular to the upper side, each terminal pad being conductively connected to an assigned contact surface. This allows vertical mounting of the chip on a substrate and contacting with the aid of customary bonding techniques. A manufacturing method and two mounting methods are described.

Description

technical field [0001] The invention relates to a method for producing a semiconductor chip, a mounting method for vertical mounting on a circuit carrier, and a semiconductor chip of the type according to the independent claims. Background technique [0002] Electronic circuits and mechanical or magnetic sensors in silicon technology are usually packaged in a so-called chip package, which enables them to be simply soldered on a circuit board for installation in a device or module. For this purpose, silicon chips are usually sawn and applied in different ways to the carrier of the chip package, such as a stamped grid or a circuit board, and are electrically connected either simultaneously or in a separate step. In this case, the chips are formed in a plane in which they are also located on the silicon wafer during the production process, whereby the height of the chips is generally the smallest dimension of a square chip. For some applications of the sensor system it is adva...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L21/60H01L21/50H01L23/50
CPCH01L2224/16227H01L24/85H01L2924/10253H01L2224/02371H01L2224/48106H01L2224/81801H01L24/00H01L2224/131H01L2224/05571H01L2224/85186H01L2224/48091H01L24/05H01L2224/0401H01L24/02H01L2224/02313H01L2224/04042H01L2224/05569H01L2224/16225H01L2224/48227H01L24/94H01L24/48H01L24/16H01L2224/94H01L24/81H01L2924/00014H01L2224/0231H01L2924/014H01L2924/00012H01L2924/00H01L2224/05552H01L2224/45099
InventorH-P·贝尔P·法贝尔S·魏斯L·劳舍尔
OwnerROBERT BOSCH GMBH