Continuous spot coating halogen-free solder paste and preparation method

A halogen-free solder paste, spot-coating technology, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of reduced efficiency, poor soldering performance, weak activity, etc., and achieve the effect of reduced surface area and convenient use

Inactive Publication Date: 2012-06-27
东莞优诺电子焊接材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The dispensing type solder paste requires a large specificity, and the air pressure squeezes out the tin, while the existing dispensing type solder paste is prone to voids and residues in the solder joints during soldering
At present, during the use of dispensing needle tube solder paste, when the piston is separated from the solder paste after depressurization, it is impossible to continue to extrude the solder paste for operation
In addition, due to the large surface area of ​​the tin powder, it is easy to accumulate tin powder, which will cause the needle to be blocked during the dispensing process and cannot continue to work, especially for small needles.
Due to the existence of air bubbles in the existing dispensing solder paste, the tin is broken in the fine pitch during the dispensing process, which causes the customer to repair the s

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0029] Example 1:

[0030] The present invention includes tin powder and flux, and the flux is composed of the following raw materials in weight percentage:

[0031] 43% hydrogenated rosin,

[0032] Thixotropic agent 5.5%;

[0033] Organic acid 17%;

[0034] Dispersant 1.5%;

[0035] Organic solvent 33%.

[0036] The thixotropic agent is one of hydrogenated castor oil or nylon, the organic acid is succinic acid and adipic acid, and the dispersant is ethylene bisstearyl amide.

[0037] The weight percentages of tin powder and flux in the solder paste are: tin powder 86% and 14%.

[0038] The preparation method of the above solder paste includes the following preparation steps:

[0039] ① Put 43g of the hydrogenated rosin, 5.5g of thixotropic agent, 1.5g of ethylene bisstearylamide, 17g of adipic acid and 33g of organic solvent in a reaction kettle and mix, stir and heat and mix uniformly, and the obtained The flux is extruded in wat...

Example Embodiment

[0042] Example 2:

[0043] The present invention includes tin powder and soldering flux, and the soldering flux has the following raw material composition by weight percentage:

[0044] Hydrogenated rosin 45%;

[0045] Thixotropic agent 5%;

[0046] Organic acid 18%;

[0047] Dispersant 1%;

[0048] Organic solvent 31%.

[0049] The thixotropic agent is one of hydrogenated castor oil or nylon, the organic acid is succinic acid and adipic acid, and the dispersant is ethylene bisstearyl amide.

[0050] The weight percentage of tin powder and flux in the solder paste is 85% and 15% of tin powder.

[0051] The preparation method of the above solder paste includes the following preparation steps:

[0052] ①. Put 45g of the hydrogenated rosin, 5g of hydrogenated castor oil, 1g of ethylene-bisstearic acid amide, 18g of adipic acid and 31g of organic solvent in a reaction kettle and mix, stir, heat and mix uniformly, then combine the obtain...

Example Embodiment

[0055] Example 3:

[0056] The present invention includes tin powder and soldering flux, and the soldering flux has the following raw material composition by weight percentage:

[0057] 40% hydrogenated rosin;

[0058] Thixotropic agent 6%;

[0059] Organic acid 16%;

[0060] Dispersant 2%;

[0061] Organic solvent 36%.

[0062] The thixotropic agent is one of hydrogenated castor oil or nylon, the organic acid is succinic acid and adipic acid, and the dispersant is ethylene bisstearyl amide.

[0063] The weight percentage of tin powder and flux in the solder paste is 87% and 13% of tin powder.

[0064] The preparation method of the above solder paste includes the following preparation steps:

[0065] ① Put 40g of hydrogenated rosin, 6g of hydrogenated castor oil, 2g of ethylene bisstearic acid amide, 16g of succinic acid and 36g of organic solvent in a reaction kettle and mix, stir, heat and mix uniformly, then combine the obtained auxiliary The ...

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PUM

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Abstract

The invention discloses continuous spot coating halogen-free solder paste and a preparation method. The continuous spot coating halogen-free solder paste comprises tin powder and a soldering flux, wherein the soldering flux comprises 40 to 45 weight percent of hydrogenated rosin, 5 to 6 weight percent of hydrogenated castor oil, 16 to 18 weight percent of organic acid, 1 to 2 weight percent of dispersing agent and 31 to 36 weight percent of organic solvent. According to the solder paste, due to the adoption of a needle cylinder packaging container and a two-time defoaming process in the horizontal direction and vertical direction, the problem of uncontinuous tin in the spot coating process due to air bubbles of the spot coating solder paste is solved.

Description

technical field [0001] The invention relates to the technical field of electronic soldering materials, in particular to a halogen-free solder paste for continuous spot coating operation and a preparation method. Background technique [0002] Solder paste is mainly used for packaging and welding of semiconductor devices such as power tubes, thyristors, and ballasts, as well as for welding of multilayer circuit boards and components. The dispensing type solder paste requires a high specificity, and the air pressure squeezes the dispensing tin, but the existing dispensing type solder paste is prone to voids and residues in the solder joints during soldering. At present, during the use of dispensing needle tube solder paste, when the piston is separated from the solder paste after depressurization, it is impossible to continue to extrude the solder paste for operation. In addition, due to the large surface area of ​​the tin powder, it is easy to accumulate tin powder, which wil...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 白映月
Owner 东莞优诺电子焊接材料有限公司
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