Method for manufacturing dustproof photography module and dustproof photography module device

Abstract

The invention discloses a method for manufacturing a dustproof photography module. The method comprises the following steps of: (1) manufacturing a lens, a light sensing chip and a planar printed circuit substrate; (2) manufacturing a hollow sealing layer with a thickness; and (3) manufacturing a light transmittance protection layer by a transparent material with a thickness, and arranging the light transmittance protection layer on the upper surface of the sealing layer, wherein the light transmittance protection layer completely covers the sealing layer; and an imaging protection region of which the perpendicular height is not less than 0.65 millimeters is formed between the position over the light sensing region of the light sensing chip and the upper surface of the light transmittance protection layer. The invention also discloses a device for implementing the method. The method and the device have the advantages that the sealing layer and the protection layer are arranged on the light sensing chip, so that an imaging distance is increased, and an image can be formed until the thickness of dust falling on the protection layer is more than 30 mu m; and the problem about dust prevention of the photography module is effectively solved.

Description

technical field [0001] The invention relates to camera technology, in particular to a method and device for preparing a dust-proof camera module. Background technique [0002] With the rapid development of science and technology, cameras have been widely used in many fields, such as notebook computers, mobile phones, medical endoscopes, real-time detection of products in industrial manufacturing, and security monitoring. [0003] CMOS Camera Module (CMOS Camera Module), referred to as CCM, is the core device used in various new-generation portable camera equipment. Compared with traditional camera systems, it has the advantages of miniaturization, low power consumption, low cost, and high image quality. [0004] The traditional high-pixel CSP process camera module is composed of photosensitive chip, lens assembly + filter, motor, motor base and flat printed circuit board. The electrical signal generated by the photosensitive chip is output through the connection point on th...

AI Technical Summary

Problems solved by technology

Therefore, the dust falls on the glass surface of the chip, and the distance between the dust and the imaging surface of the chip is relatively short, and the actual dirt is very small (15um) and can be imaged, which can easily affect the shooting effect

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