Speaker module and electronic device using the same

A speaker module and electronic device technology, which is applied in the field of electronic devices and speaker modules, can solve problems such as the size limitation of the speaker unit, the impact on the acoustic performance and output power of the speaker module, and the thickness limitation of the speaker module. The effect of thinning

Active Publication Date: 2013-05-15
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the thinning of electronic devices, the thickness of the speaker module is also strictly limited, and the size of the speaker unit is also greatly limited, thus affecting the acoustic performance and output power of the speaker module
In addition, between the loudspeaker module of the traditional structure and the electronic device, it is only a simple installation on the position and the realization of the electrical connection, which does not make full use of the space inside the electronic device.

Method used

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  • Speaker module and electronic device using the same
  • Speaker module and electronic device using the same
  • Speaker module and electronic device using the same

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Embodiment Construction

[0027] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0028] Such as figure 1 and figure 2 As shown, the speaker module includes a peripheral frame and a speaker unit housed in the peripheral frame. The peripheral frame includes an upper case 11, a middle case 12 and a lower case 13. The speaker unit includes a vibration system and a magnetic circuit system. The loudspeaker unit is fixedly combined between the middle shell 12 and the lower shell 13 . The vibration system of the loudspeaker unit includes a diaphragm 21 and a voice coil 20 combined on the lower side of the diaphragm 21 , and the magnetic circuit system includes a washer 22 , a magnet 23 and a magnetically conductive plate 24 sequentially combined from top to bottom.

[0029] In this embodiment, the diaphragm 21 is combined with the upper surface of the middle case 12. The upper side of the diaphragm 21 is surrounded by ...

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Abstract

The invention discloses a speaker module which comprises an outskirt frame and a speaker single body. A sound outlet is arranged in a side of the outskirt frame. An opened end which communicates the interior of the speaker module and the outside is arranged in the outskirt frame. The opened end is sealed and combined with a combination plate inside the electronic device. The outskirt frame, the combination plate and the speaker single body form a front sound cavity and a rear sound cavity. The front sound cavity and the rear sound cavity are of spaced structures. Meanwhile, the invention discloses an electronic device. The combination plate sealed and combined with the opened end is arranged in the electronic device. With such a structure, a thin speaker module can be ensured and the acoustic performance and output power of the speaker module can be ensured. A space in the electronic device is fully used and achievement of the thin electronic device is benefited.

Description

technical field [0001] The invention relates to the field of electroacoustics, in particular to a loudspeaker module and an electronic device using the loudspeaker module. Background technique [0002] Today, consumers have increasingly thinner requirements for portable electronic devices, and the electronic components inside the electronic devices are also increasingly thinner. Among them, the speaker monomer as an important acoustic component is also becoming thinner. The speaker includes a diaphragm for radiating sound. Since the phase difference of the sound radiated from the front side and the rear side of the diaphragm is 180 degrees, the front cavity and the rear cavity should be spaced structures. In order to avoid defects such as the inability of the front cavity and the rear cavity to be completely separated from each other when the speaker unit is directly installed in the electronic device, the speaker unit is usually placed in a peripheral frame to form a speak...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/28
Inventor 韩丹杨赟
Owner GOERTEK INC
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