Manufacturing method for flexible printed circuit board
A technology of flexible circuit boards and manufacturing methods, which is applied in the fields of multilayer circuit manufacturing, chemical instruments and methods, and assembly of printed circuits with electrical components, and can solve problems such as reduced quality of flexible circuit boards, looseness, and edge warping of flexible circuit boards
Inactive Publication Date: 2013-11-13
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
However, the clips will loosen after a long time or many times of use, so that the edge of the clamped flexible circuit board will warp due to the inability to be clamped, thereby reducing the quality of the flexible circuit board
Method used
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Embodiment Construction
[0018] see Figure 1 to Figure 8 , an embodiment of the present invention provides a method for manufacturing a flexible circuit board, and the method for manufacturing a flexible circuit board includes the following steps.
[0019] first step, such as figure 1 As shown, a circuit board carrying device 10 is provided, and the circuit board carrying device 10 includes a carrying board 12 and a connecting piece 14 attached to the carrying board 12 .
[0020] The carrying plate 12 is a rectangular plate made of aluminum for supporting and fixing the connecting piece 14 , and the surface of the carrying plate 12 adjacent to the connecting piece 14 is a smooth surface. The connecting sheet 14 includes a connecting layer 142 and an adhesive layer 144, the adhesive layer 144 is arranged between the carrier board 12 and the connecting layer 142, the adhesive layer 144 has the same shape and area as the connecting layer 142, the present invention In an embodiment, the shape of the ad...
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A manufacturing method for a flexible printed circuit board comprises the following steps: providing a bearing device, wherein the bearing device comprises a bearing board, a resin connecting layer and an adhering layer arranged between the bearing board and the resin connecting layer; providing a substrate of the flexible printed circuit board, wherein the substrate of the flexible printed circuit board comprises a basal layer, a conducting circuit layer and a solder mask layer, and is provided with a product area and a waste material area around the product area; forming a heating blind slot in the waste material area, wherein the basal layer is exposed out of the basal layer; heating and softening the basal layer of the corresponding heating blind slot and the connecting layer to be fused, and bonding the basal layer and the connecting layer; printing a solder paste; pasting an electronic element on the solder paste; fusing and solidifying the solder paste through a reflow oven; removing the waste material area to obtain the flexible printed circuit board.
Description
technical field [0001] The invention relates to circuit board technology, in particular to a manufacturing method of a flexible circuit board. Background technique [0002] With the wide application of flexible materials such as polyimide films in the electronic industry (please refer to "Applications of polyimide films to the electrical and electronic industries" published by Sugimoto, E. in IEEE Electrical Insulation Magazine, Vol. 5, No. 1, 1989 in Japan"), flexible printed circuit boards (Flexible Printed Circuit Board, FPCB) are widely used in notebook computers, liquid crystal displays, digital cameras, mobile phones, etc. Sexual electronic products have a very wide range of applications. [0003] In the existing production process of flexible circuit boards, when printing solder paste, it is usually carried out on a carrier board, and the flexible circuit board printed with solder paste is then mounted by a placement machine for electronic components, and then the fl...
Claims
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Inventor 赖志成
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD