Electrowetting micro-fluid device based on super-hydrophobic surface

Abstract

The invention discloses an electrowetting micro-fluid device based on a super-hydrophobic surface. The electrowetting micro-fluid device based on the super-hydrophobic surface mainly comprises a micro-fluid operation lower substrate and an upper substrate. The surface of the lower substrate is provided with a micro-nanometer dual structure which includes a micron structure and a nanometer structure. The micron structure is of a bar-shaped structure and the surface of the micron structure is evenly covered by a conducting layer. A hydrophobic medium layer covers the surface of the conducting layer. The nanometer structure is located in a gap in the bottom of the micron structure and a hydrophobic medium layer covers the surface of the nanometer structure. The lower substrate has the super hydrophobic character. A group of electrode arrays which are arranged in parallel cover the inner surface of the upper substrate. The arrangement direction of the group of the electrodes is vertical to the bar-shaped structure of the lower substrate. A gap between adjacent electrodes is small. A hydrophobic medium layer covers the surface of each electrode. The lower substrate of the electrowetting micro-fluid device provides good fluid hysteresis reducing character and the function of electrowetting at the same time. The dual advantages of a super-hydrophobic surface and the electrowetting technology are combined and the micro-fluid device has the strong driving capacity and the hysteresis weakeningcharacter.

Description

technical field [0001] The invention relates to an electrowetting microfluidic device, in particular to an electrowetting microfluidic device based on a superhydrophobic surface. Background technique [0002] Electrowetting technology is a new type of microfluidic technology that has been widely used and researched in recent years. It has the characteristics of low power consumption, fast response speed, simple device structure, and small size. The current mainstream electrowetting microfluidic devices are all based on a smooth and flat microfluidic manipulation platform, including a hydrophobic insulating layer and a smooth and flat electrode layer. However, there are still a series of problems in the device, such as the saturation of the contact angle of water droplets and the hysteresis force of the solid surface on the fluid, which seriously affect the performance and application range of the electrowetting device. The researchers found that some superhydrophobic surfac...

AI Technical Summary

Problems solved by technology

However, the control function of electrowetting effect on microfluidics is completely dependent on the regulation of water droplet wettability, and the regulation of wettability on ordinary superhydrophobic surfaces will lead to the transition from the Cassie state with reduced hysteresis properties to the Wenzel state with strong hysteresis properties. , and due to the effect of the energy barrier, the water droplet in the Wenzel state cannot automatically return to the Cassie state

Images