Manufacturing method for arc chip, circuit board of electronic device and electronic device

A manufacturing method and circuit board technology, applied in the direction of circuits, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of inconvenience, inconvenience for users, and aggravation, and achieve the effect of being easy to hold

Inactive Publication Date: 2014-09-03
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the user holds the electronic device, the finger is bent, and the flat back shell cannot fit the user's finger, which is inconvenient for the user to hold
[0004] In addition, the ba

Method used

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  • Manufacturing method for arc chip, circuit board of electronic device and electronic device
  • Manufacturing method for arc chip, circuit board of electronic device and electronic device

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Embodiment Construction

[0032] The embodiment of the present invention discloses a method for manufacturing an arc-shaped chip, which can make the chip form an arc-shaped structure, so that the back shell of the electronic device can be arranged in an arc-shaped shape, and it is convenient for the user to hold the electronic device. The embodiment of the present invention also discloses a circuit board of an electronic device, which uses the chip prepared by the above-mentioned manufacturing method, and has the characteristics that the back shell of the electronic device is arranged in an arc shape and is convenient for the user to hold. The embodiment of the present invention also discloses an electronic device, which uses the above-mentioned circuit board, and has an arc-shaped rear shell, which is convenient for users to hold.

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in...

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PUM

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Abstract

The invention discloses a manufacturing method for an arc chip. The manufacturing method for the arc chip comprises the following steps that (1) a chip workpiece is placed in a die; (2) the chip workpiece is fixed in the die; (3) the chip workpiece is polished by a polishing component according to preset parameters, so that the arc chip is formed. When the manufacturing method for the arc chip is applied, the chip workpiece can be polished by the polishing component according to the preset parameters, and the arc chip is formed under the premises that functional components inside the chip workpiece are prevented from being damaged and function completeness of the chip is guaranteed; thus, a rear shell of an electronic device is conveniently arranged to be in an arc shape, and the rear shell is attached to the fingers of a user and conveniently held by the user with hand. The invention further provides a circuit board of the electronic device. The chip manufactured with the method is applied to the circuit board. The circuit board has the advantages that the rear shell of the electronic device is conveniently arranged to be in the arc shape and is conveniently held by the user with hand. The invention further provides the electronic deice. The circuit board is applied to the electronic device, and the rear shell is in the arc shape and is conveniently held by the user with hand.

Description

technical field [0001] The present invention relates to the technical field of machinery industry, and more specifically, to a method for manufacturing an arc-shaped chip; it also relates to a circuit board of an electronic device, which uses the arc-shaped chip prepared by the above-mentioned manufacturing method; and relates to a An electronic device using the above-mentioned circuit board. Background technique [0002] With the development of society, electronic devices such as mobile phones and tablet computers are more and more widely used in people's daily life. The electronic device includes a casing and a circuit board; the casing includes a front cover part and a rear casing; the circuit board has a substrate and a chip disposed on the substrate; wherein the chip is disposed on the circuit board on a side facing the rear casing of the electronic device. [0003] In the existing electronic equipment, the chip has a rectangular structure with edges, resulting in a st...

Claims

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Application Information

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IPC IPC(8): H01L21/02
CPCH01L21/304H01L23/04H01L29/0657
Inventor 石彬
Owner LENOVO (BEIJING) CO LTD
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